On-wafer microwave metrology for future industrial applications
Published June 20, 2025 | Version v1
Conference paper Open

Dielectric Measurements of Conventional and 3-D Printed Substrate Materials from 50 GHz to 1.5 THz Using Free-Space and TDS Methods

Authors/Creators

  • 1. ROR icon National Physical Laboratory
  • 2. ROR icon University of Birmingham
  • 3. Rogers Corporation
  • 4. Varioprint AG

Description

This paper presents a study characterizing three conventional substrate dielectric materials, along with one new 3-D printed dielectric (RADIX), all supplied by Rogers, over the frequency range of 50 GHz to 1.5 THz. Two measurement methods were employed: guided free-space approach using material characterization kits (MCKs) and time-domain spectroscopy (TDS). The 3-D printed dielectric was measured using TDS systems located at two different laboratories, enabling an interlaboratory comparison to validate the results. The measurement results show good agreement between both methods and across the two laboratories. This work provides useful insights for use of these conventional and novel substrate materials in millimeter-wave and THz applications.

Notes

The project (23IND10 OnMicro) has received funding from the European Partnership on Metrology, co-financed from the European Union’s Horizon Europe Research and Innovation Programme and by the Participating States. 

  • Funder name: European Partnership on Metrology
  • Funder ID: 10.13039/100019599
  • Grant number: Partnership 23IND10 OnMicro

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Additional details

Related works

Is source of
Conference paper: 10.1109/IMS40360.2025.11103865 (DOI)

Funding

European Association of National Metrology Institutes
On-wafer microwave metrology for future industrial applications 23IND10