Published February 5, 2025 | Version v1
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Design of Power SiC Transistor Embedded in PCB Supported by 3D Thermo-Mechanical Simulations

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Funding

European Commission
FastLane – Boosting the European Value Chain for Sustainable Power Electronics 101139788

Dates

Accepted
2024-11-14

References

  • Huesgen, T. et al., Power Electronic Devices and Components, 3, 100017, 2022.
  • Chen H. et al., in Proceedings of 9th Int. Power Electronics and Motion Control Conf. IPEMC2020, Nanjing, China, 725, 2020.
  • Chvala, A. et al., Microelectronics Reliability, 78, 148, 2017.
  • COMSOL Multiphysics® v. 6.1 www.comsol.com.