Published March 23, 2016 | Version v1
Technical note Open

HSF Packaging Working Group Report

  • 1. FNAL
  • 2. CERN
  • 3. BNL

Description

The note describes the outcome of the discussions in the HSF Packaging Working Group. It summarizes the discussion on existing configuration and build tools and the possibility to converge on more common solutions.

Files

HSF-TN-2016-03.pdf

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