THERMAL CONDUCTIVITY ENHANCEMENT OF SILICON INSERTED HYBRID COMPOSITE MATERIALS

In this investigation thermal conductivity test was carried out to the prepared specimen of silicon inserted hybrid composite material (on silicon inserted glass � fiber chop strand and other silicon inse rted glass � fiber 90 0 woven). The specimens were prepared by hand layup followed by compression molding method. The apparatus consist of two copper plates and one specimen together clamped on both sides using bolts and nuts. On one side of the copper plate a heater is fitted. End losses from the plates are minimized by providing thick insulation all around to ensure unidirectional heat flow. A dimmer stat is provided for varying the input to the heater and measurements of input is carried out by Voltmeter. Thermocouples are bou nded in mica are embedded between the interface of the copper materials and the specimen of silicon inserted hybrid composite material,to read the temperature at the surface.

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