Hierarchical Structured Superhydrophobic Surfaces on Graphite Composites
Authors/Creators
Contributors
Data collector:
Editors:
Hosting institutions:
Description
A scalable thermal imprinting method and subsequent hierarchical structuring with metal oxide nanostructures forms superhydrophilic or superhydrophobic surfaces on graphite composites.
Anisotropically etched silicon wafers serve as basis to create various microstructures by a thermal
imprinting process on thermally conductive polymer graphite composites. Even after 32 times
of embossing, the mold can be reused and restored by pyrolysis, ensuring its longevity and costeffective process. Nanostructuring caused by sputtered aluminium or electron beam evaporated
copper on the embossed microstructures and further oxidized with a simple hot water treatment
offers a wide range of different hierarchical structures. The combination of microstructures and
nanostructures with a low surface energy coating of stearic or lauric acid results in a superhydrophobic surface, which is completely water-repellent with a contact angle greater than 160°
and low contact angle hysteresis lower than 5°. This work provides a deeper understanding of
the effects of the interaction of aluminum and copper metal oxide nanostructures and thermally
imprinted microstructures on surface of graphite compounds. It has been demonstrated that
superhydrophobic surfaces can be created with both fatty acids. Lauric acid is easier to use due
to its simple handling and reaches a maximum contact angle after 30 minutes of exposure time
with copper oxide nanostructures of over 170°.
Files
20240703_100um_3x3_3D_Topographie_1.png
Files
(64.7 MB)
| Name | Size | Download all |
|---|---|---|
|
md5:a6040bb54b8c1b84c86784e14cd71606
|
205.8 kB | Preview Download |
|
md5:207f26d8cb9b645e3c630c3e0f9338fa
|
599.1 kB | Preview Download |
|
md5:e9220fba8ef39abc73f0153cfdd7d3bb
|
279.5 kB | Preview Download |
|
md5:28897e245e5b0a428ab76e5c876af574
|
599.0 kB | Preview Download |
|
md5:6d9749e8aa92c9972878392fcdfc8410
|
308.9 kB | Preview Download |
|
md5:d4a92b343c3af50c8ed03250cb968f9f
|
690.0 kB | Preview Download |
|
md5:3a71ece60b040265ca898caef2e87881
|
282.1 kB | Preview Download |
|
md5:4fae13c6d9f1e93bedd03628096f95d7
|
644.4 kB | Preview Download |
|
md5:03442d69e142cfe8c1b61df40220fe4f
|
336.2 kB | Preview Download |
|
md5:58c33f1556776d88853777cbb78a86c6
|
315.1 kB | Preview Download |
|
md5:7e3f3fa5fe3ca6f35092af376b8b8ed2
|
322.9 kB | Preview Download |
|
md5:3e0aa1643127c37ef2c1f7400cba8f52
|
325.9 kB | Preview Download |
|
md5:5fbeab12e163157b8036cd0483637de2
|
349.1 kB | Preview Download |
|
md5:faf989a5089067d850039b2ee1154ecd
|
381.8 kB | Preview Download |
|
md5:5bb6b21afcae67f5d2a2fe18a7cfdbc9
|
383.1 kB | Preview Download |
|
md5:9d7ba0fb54e2439b5f67a9f6026a47b4
|
343.9 kB | Preview Download |
|
md5:bfde13b89e310473f16a30b807c76445
|
501.2 kB | Preview Download |
|
md5:fb013c34d2c7b7c26e8bf733b1adbd41
|
2.8 MB | Preview Download |
|
md5:3dc5582626dd3cce5ae82b060a81d584
|
49.3 MB | Preview Download |
|
md5:80f64a4631aa475415c13e51de456f2d
|
459.9 kB | Preview Download |
|
md5:206d24641b1ff3de0a7f1dc9d39a218e
|
462.9 kB | Preview Download |
|
md5:6a55c3eb93bbdb67d54090ae75656ea1
|
400.7 kB | Preview Download |
|
md5:0d8efa4166c655eac84b629db7d82ab0
|
433.0 kB | Preview Download |
|
md5:b1c0a7973ea142492bf2789bc8f75be3
|
464.5 kB | Preview Download |
|
md5:f1f7aeead5abb2e9e34ff75a45d7d488
|
526.2 kB | Preview Download |
|
md5:a80c607004d5115ae918ad2600cfc86c
|
487.0 kB | Preview Download |
|
md5:f17124265da189288afacf702d1a82b6
|
433.8 kB | Preview Download |
|
md5:73401f5b5fee5d25a341ac024b86501f
|
903.0 kB | Preview Download |
|
md5:1ec995b37e586ea0541739e077ce36e7
|
558.7 kB | Preview Download |
|
md5:8477005ea8e45b6c22132f9ea78d887e
|
480.3 kB | Preview Download |
|
md5:ee7fa7e864ef4d872cd0c2a3b472e50b
|
181.0 kB | Preview Download |
Additional details
Dates
- Accepted
-
2024-12-03