DIFFUSION BONDING USING TAGUCHI METHOD

The present study includes characterization of diffusion bonding of aluminum alloy 2024-O without and with applying different interlayers as pure powder such as copper, silver and titanium. Bonding was performed in vacuum up to (1 10^-5 mbar) using vacuum system bonding. Aluminum alloy 2024-O specimens was used as cylinder shape as diameter (15mm) and (35mm) length and interlayer thickness was equal 100 ϻm, under bonding conditions of (330-480°C) and (1-4 Mpa) and duration of (60 min). Interlayer was classified according to diffusion coefficient of each element in the base alloy.TaguchiMethod was applied to reduce the number of experiments and determine the optimum bonding conditions. Optimum bonding conditions were (430 °C) and (4 Mpa) during (60 min) time as bonding and the best interlayer used was copper powder. Tensile testing of bonded joint was performance for the specimen at optimum bonding condition. The ultimate strength was found equal 189.2 Mpa with an efficiency of 91.8 % compared to the ultimate strength of aluminum alloy 2024-O.Minitab 17 program gave the accuracy of the model according to relationship between every factor and tensile strength by scatter plots to determine the accuracy of model. The accuracy of model is 99.13 % this mean that the model is perfect. Minitab 17 program gave A statistical model equation that represent the final model equationthat was deduced using Minitab 17 which gives the effect of all variables (temperature, pressure and interlayer) on the bonding strength of the joint.