Published April 23, 2024
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Temperature-Dependent Resistivity of Alternative Metal Thin Films
Authors/Creators
-
1.
IMEC
Description
The temperature coefficient of resistivity (TCR) has been measured for Cu, Ru, Co, and Ir thin films with thicknesses down to 3 nm to assess the dominant electron scattering mechanism in these films. Ru, Co, and Ir show bulk-like TCR values down to 5 nm with some signs of disorder-induced TCR lowering
for 3 nm for Ru and Co. By contrast, Cu shows a considerably larger TCR value than bulk that increases with decreasing thickness. The results are qualitatively consistent with calculations of the TCR within a semiclassical model.
Poster presented at the 2019 IEEE International Interconnect Technology Conference
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IITC_2019_TCR_Adelmann_Final.pdf
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Additional details
Dates
- Accepted
-
2019-02