European Journal Of Advances In Engineering And Technology
Published August 31, 2023 | Version v1
Journal article Open

A Systematic Literature Review of Advanced Packaging Technology in Semiconductors: Revolutionizing the Industry

Authors/Creators

  • 1. Senior Director, Business Development L&T Technology Services

Description

ABSTRACT

Semiconductor packaging is vital in ensuring the environmental protection and reliable interconnection of semiconductor chips, serving as the crucial first level of packaging in the electronic device manufacturing process. This systematic literature review delves into the evolution and impact of advanced packaging technologies (tech.s) within the semiconductor industry. The research investigates how these advancements have contributed to enhancing semiconductor devices, influencing industry trends, and shaping the future Landscape. The study comprehensively analyzes a wealth of literatures, providing insights into the multifaceted aspects of advanced packaging. It explores the intricate balance required to meet diverse performance requirements, including considerations for physical, mechanical, electrical, and thermal aspects. The semiconductor package's role in addressing mechanical stresses, environmental factors, and electrostatic discharge during handling and mounting is examined. Furthermore, the paper investigates its pivotal role as a mechanical interface for testing processes and facilitating the next interconnection level.

Through a thorough examination of industry trends, the research illuminates the trajectory of advanced packaging tech.s. Graphs and charts are utilized to illustrate key findings, offering a visual representation of the dynamic evolution within the semiconductor packaging domain. The paper also scrutinizes the specifications for quality, reliability, and cost-effectiveness, essential factors in the successful deployment of semiconductor packages.

As semiconductor devices continue to evolve, the insights derived from this systematic literature review provide a valuable understanding of the current state and future prospects of advanced packaging tech.s. The findings contribute to the ongoing discourse on semiconductor industry advancements, offering a foundation for informed decision-making and further research initiatives in this dynamic field.

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