Published October 16, 2017 | Version v2.2.1-beta.2

amburan/hoomd: Introducing dybond_plugin

  • 1. University of Michigan
  • 2. Temple University
  • 3. Boise State University
  • 4. University fo Michigan, Ann Arbor
  • 5. Vanderbilt University
  • 6. University of Michigan, Ann Arbor
  • 7. Yeshiva University
  • 8. Lookout
  • 9. @lanl
  • 10. @twosigma
  • 11. Counsyl

Description

  • First version of dynamic bonding plugin for modelling polymerization reactions using MD.
  • Released together with the python package called epoxpy

Files

amburan/hoomd-v2.2.1-beta.2.zip

Files (5.1 MB)

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md5:e63485a7cb9069f37e1181f218ffcc36
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