Improving the structure, tensile strength and hardness of molybdenum-doped copper-silicon alloy system
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Abstract: Cu-Be alloys are known for their outstanding strength, hardness, and electrical conductivity. They are often used in applications where high performance is required, such as aerospace, electronics, and telecommunications. One significant drawback of Cu-Be alloys is that beryllium is toxic and poses health risks, especially during the manufacturing and machining processes. This has led to concerns about worker safety and environmental impact. In this study, novel Cu-Si-Mo ternary alloys composition with improved tensile strength, ductility, and hardness are produced. The Cu-3Si-xMo (x: 0.1-5 wt%) alloys were fabricated via stir-casting technique. The surface morphologies of the Cu-Si and Cu-Si-Mo alloys were investigated and linked with the mechanical properties using optical metallurgical microscope (OM). Results of the study indicated that tensile strength, ductility, and hardness of the parent alloy improved significantly, recording maximum values of 130 MPa, 18.4%, and 192 BHN, respectively. Alloy with composition; Cu-3Si-1.5Mo gave the best mechanical properties, owing to increased solid solution strengthening, modification, and refinement of the dendritic grains by molybdenum addition.
Keywords: Strength, hardness; morphology; Cu-Si-Mo alloy; composition.
Title: Improving the structure, tensile strength and hardness of molybdenum-doped copper-silicon alloy system
Author: Agatha Ifeoma Ijomah, Kingsley Chidi Nnakwo, Jerome Ugwu Odo, Ifeanacho Uchenna Okeke
International Journal of Mechanical and Industrial Technology
ISSN 2348-7593 (Online)
Vol. 11, Issue 1, April 2023 - September 2023
Page No: 54-59
Research Publish Journals
Website: www.researchpublish.com
Published Date: 15-September-2023
DOI: https://doi.org/10.5281/zenodo.8348223
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- Journal article: https://www.researchpublish.com/papers/improving-the-structure-tensile-strength-and-hardness-of-molybdenum-doped-copper-silicon-alloy-system (URL)
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- Journal article: 2348-7593 (ISSN)