Tailoring the surface morphology of Al, Mo-doped Copper-silicon alloys for enhanced impact resistance

Abstract: This study explored the impact resistance of Al, Mo-doped copper-silicon alloy. The alloys system were developed via stir-casting technique and subjected to solid solution heat treatment at 900^oC for 5 h. The microstructures of the ternary alloys were analyzed and correlated with the investigated properties. Results showed that the Cu-3Si-3Al and Cu-3Si-3Mo alloys demonstrated excellent impact resistance. The Cu-3Si binary alloy initially recorded impact energy of 13.2 J. After adding Al, the impact energy increased to 14.2 J. The impact energy of Cu-3Si-Al ternary alloys was increased by 74.6% after undergoing solid solution treatment. The as-cast Cu-3Si-Mo alloy had lower impact resistance than the parent alloy but showed improved impact energy after solid solution strengthening; reaching 18.9 J. This change in impact resistance is attributed to increased solid solution of Al and Mo in the copper matrix. The density of the parent alloy (Cu-3Si) decreased when molybdenum (Mo) was incorporated, going from 8.21 g/cm³ to 7.81 g/cm³. After undergoing solid solution treatment, the density of Cu-3Si-Mo alloy decreased further to 7.6 g/cm3.The parent alloy (Cu-3Si) had better electrical conductivity compared to the ternary alloys. This difference in electrical conductivity was attributed to increased solid solution of Al and Mo in the copper matrix, which decreases the mobility of copper atoms.

Keywords: Impact resistance; surface morphology; strength; conductivity; properties.

Title: Tailoring the surface morphology of Al, Mo-doped Copper-silicon alloys for enhanced impact resistance

Author: Agatha Ifeoma Ijomah, Kingsley Chidi Nnakwo, Ifeanacho Uchenna Okeke, Jerome Ugwu odo

International Journal of Novel Research in Electrical and Mechanical Engineering

ISSN 2394-9678

Vol. 11, Issue 1, September 2023 - August 2024

Page No: 1-6

Novelty Journals

Website: www.noveltyjournals.com

Published Date: 14-September-2023

DOI: https://doi.org/10.5281/zenodo.8344705

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