Published August 17, 2022
| Version v1
Conference paper
Open
Co-designed electro-optical integrated frontend circuits for high speed transceivers
Authors/Creators
- J. Bauwelinck1
- M. Verbeke1
- J. Lambrecht1
- M. Vanhoecke2
- L. Breyne1
- G. Coudyzer1
- J. Declercq1
- B. Moeneclaey1
- R. Ahmed1
- N. Singh1
- C. Bruynsteen1
- C. Wang1
- S. Niu1
- X. Wang1
- T. Pannier1
- Y. Gu1
- A. Vandierendonck1
- B. Van Lombergen1
- K. De Bruyn1
- J. Van Kerrebrouck1
- M. Verplaetse3
- G. Torfs1
- X. Yin1
- P. Ossieur1
- 1. Dep. INTEC., IDLab., Ghent University - imec, Ghent, Belgium
- 2. Nvidia, Ghent, Belgium
- 3. Nokia Bell Labs, Antwerp, Belgium
Description
Co-design of photonic and electronic chips has become a necessity to realize high-performance transceivers. This paper will illustrate a number of recent developments of high-speed transceiver circuits including broadband driver amplifiers and transimpedance amplifiers.
Files
OECCPSC_2022_Bauwelinck.pdf
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Additional details
Funding
- European Commission
- QAMeleon - Sliceable multi-QAM format SDN-powered transponders and ROADMs Enabling Elastic Optical Networks 780354
- European Commission
- POETICS - CoPackaging of Terabit direct-detection and coherent Optical Engines and switching circuits in mulTI-Chip moduleS for Datacenter networks and the 5G optical fronthaul 871769
- European Commission
- NEBULA - Neuro-augmented 112Gbaud CMOS plasmonic transceiver platform for Intra- and Inter-DCI applications 871658
- European Commission
- PlasmoniAC - Energy- and Size-efficient Ultra-fast Plasmonic Circuits for Neuromorphic Computing Architectures 871391