New Die Attach Materials: Silver and Silver/ Copper sintering pastes

Advanced materials, like sintered silver, are key to robust and efficient power modules at high power densities. Excessive temperature degrades the performance and reliability of power electronics. Die attach materials are enabling high power applications to keep temperature within limits, which consequently can allow for higher power densities and lowered overall process cost. In this work, we present newly designed silver-based sintering pastes for pressure-less and pressure assisted sintering applications which enable a high yield of production. Additionally, we introduce a system of cost-efficient Ag/Cu hybrid pastes, which contain up to 60% of Cu. Results for copper-based materials are showcased for different sintering pressures and validated through mandrel bend and die-shear test. With these new materials industry has the chance to decrease costs of the used interconnection materials with the same
stability and workability of Ag-pastes.