The effect of solvent on convectively-driven silica particle assembly: Decoupling surface tension,viscosity, and evaporation rate
Authors/Creators
-
Roach, Lucien
(Researcher)1
-
Drisko, Glenna L.
(Researcher)1
- Gonzalez-Rodriguez, David (Researcher)2
- Gao, Jie (Researcher)3
- Laurichesse, Eric (Researcher)4
-
Castro-Grijalba, Alexander
(Researcher)1
-
Oda, Reiko
(Researcher)5
-
Pouget, Emilie
(Researcher)3
-
Schmitt, Véronique
(Researcher)4
-
Tréguer-Delapierre, Mona
(Researcher)1
-
1.
Institut de Chimie de la Matière Condensée de Bordeaux
- 2. LCP-A2MC, Université de Lorraine, 57000 Metz, France
-
3.
Chimie et Biologie des Membranes et des Nanoobjects
-
4.
Centre de recherche Paul Pascal
-
5.
Institut Européen de Chimie et Biologie
Contributors
Data collector:
-
1.
Institut de Chimie de la Matière Condensée de Bordeaux
Description
Dataset associated with 'The effect of solvent on convectively-driven silica particle assembly: Decoupling surface tension, viscosity, and evaporation rate’.
The data is based on the figures below, published in the linked article (see the doi).
- Figure 1. Segmented and raw images of dip-coated films. (images, .TIF)
- Figure 2. Calculated surface coverages (data, .csv)
- Figure 3. Rheology on SiO2-iPrOH-Glycerol mixtures & SEM micrographs of particle films. (data, .csv; images, .TIF)
- Figure 4. SEM micrographs of silica helices films. (images, .TIF)
- Figure S1. Measured evaporated masses of each solvent as a function of time. (data, .csv)
- Figure S2. TEM micrographs of SiO2 seeds and measured particle diameters. (data, .csv; images, .TIF)
- Figure S3. TEM micrographs of SiO particles and measured particle diameters. (data, .csv; images, .TIF)
- Figure S4. Calculated solvent fractions as a function of time. (data, .csv)
- Figure S5. Rheology of i-PrOH-glycerol mixtures. (data, .csv)
Files
ERC-SCATTER_ICMCB_Article_ ACS-Applied_Materials&Interfaces-D_Figure4_25.10.2022_V1.zip
Files
(207.1 MB)
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Additional details
Related works
- Is published in
- Preprint: 10.26434/chemrxiv-2023-03j7v (DOI)