OSB PANEL WITH LOW DENSITY REFORESTING WOOD RESIDUE: PHYSICAL AND THERMAL CHARACTERIZATION

This work aims to evaluate the potential use of low-density reforesting wood residues in OSB panel production made of an organic matrix with a focus on the physical characteristics of the panel. Physical and chemical characterization of the wood particles and thermo-physics (bulk density, density profile and thermal conductivity) properties of panels were carried out. Panels with a density of 550 kg/m³ and 13 % resin content were produced. The density profile showed uniform compaction throughout the thickness (ranging from 530.1 to 560.4 kg/m³) and the thermal conductivity test led to a 0.146 W/mK value, which allows the application of the composite as a thermal insulator.