Epoxy Staging Time Effect on Voiding & Adhesion Strength

This research interested in studying about property of epoxy staging for epoxy voids in die attach process. Die attach process is a very important process in the integrated circuit (IC) packaging. It is a popular adhesive material used for attaching between die and Leadframe of a package which is an epoxy. Oven cure process is also important to make a complete epoxy due to cross linking to enhance microstructure of epoxy stiffness. The Staging or waiting time before Oven cure process will affect the void under die of multichip package because the long duration of attaching will increase the risk of void under die. In experiment, the staging or wait time before Oven cure were varied from 0 until 5 hours with a step of 1 hour and analyzed the void under die of epoxy by die shear test, ball line thickness, delamination, x-ray and reliability test. The results confirmed that the wait time will affect the void under die of die attach process in IC packaging.