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Integration specifications

Ndip, Ivan; Andersson, Kristoffer; Dielacher, Franz; Papananos, Yannis; Reyes, Jacob; Tschoban, Christian; Maaß, Uwe; Ostmann, Andreas; Kosmider, Stefan

5G mmWave packaging requirements are given, and the specifications of the packaging platform proposed in SERENA to meet these requirements are presented. The platform is specified to meet the performance, reliability, size and cost requirements.

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