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Published May 1, 2011 | Version v1
Conference paper Open

Reliability study of Au-In transient liquid phase bonding for SiC power semiconductor packaging

Authors/Creators

  • Grummel, Brian
  • Mustain, Habib A.
  • Shen, Z. John
  • Hefner, Allen R.

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n/a

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DOI
10.1109/ispsd.2011.5890840
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DOI 

10.1109/ispsd.2011.5890840

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Created
June 5, 2018
Modified
August 2, 2024

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