Journal article Open Access
Simulation-Based Design Methodology for Heterogeneous Systems at Package-Level Utilizing XML and XSLT
Fischbach, Robert; Heinig, Andy; Lienig, Jens
System-in-Package is an appealing alternative compared to the integration on a PCB or in a chip. A big variety of different packaging solutions (including 2.5/3D integration) makes it difficult to choose the most appropriate solution for a given specification. Simulation-based design flows gain importance, but lack the straightforward access to actual design data. We propose a new description format as well as a corresponding methodology to manage and process assembly and packaging design data. Based on established software concepts (XML/XSLT), our Assembly Description Format (ADF) integrates well into existing design environments and features a high flexibility to consider distinct design aspects.
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ZuE2017_pp66_73.pdf
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| Data volume | 41.3 MB | 41.3 MB |
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- Publication date:
- September 18, 2017
- DOI:
-
- Published in:
- ITG-Fachbericht 274: Zuverlässigkeit und Entwurf (ZuE 2017): pp. 66-73 (09/2017).
- Grants:
-
European Commission:
- MICROPRINCE - Pilot line for micro-transfer-printing of functional components on wafer level (737465)
- Related identifiers:
- Part of
- 978-3-8007-4444-2 (ISBN)
- License (for files):
- Creative Commons Attribution Non Commercial 4.0 International