NCS20071, NCV20071, NCS20072, NCV20072, NCS20074, NCV20074


Operational Amplifier, Rail- to-Rail Output, 3 MHz BW

The NCx2007x series operational amplifiers provide rail−to−rail output operation, 3 MHz bandwidth, and are available in single, dual, and quad configurations. Rail−to−rail operation enables the user to make optimal use of the entire supply voltage range while taking advantage of 3 MHz bandwidth. The NCx2007x can operate on supply

voltages as low as 2.7 V over the temperature range of −40C to


www.onsemi.com


5

1

125C. At a 2.7 V supply, the high bandwidth provides a slew rate of

2.8 V/µs while only consuming 405 µA of quiescent current per channel. The wide supply range allows the NCx2007x to run on supply voltages as high as 36 V, making it ideal for a broad range of applications. Since this is a CMOS device, high input impedance and low bias currents make it ideal for interfacing to a wide variety of signal sensors. The NCx2007x devices are available in a variety of compact packages. Automotive qualified options are available under the NCV prefix.

Features

SOIC−14 NB CASE 751A


DEVICE MARKING INFORMATION

See general marking information in the device marking section on page 2 of this data sheet.


ORDERING INFORMATION

See detailed ordering and shipping information on page 4 of this data sheet.


Semiconductor Components Industries, LLC, 2017

September, 2018 − Rev. 14

1 Publication Order Number:

NCS20071/D


MARKING DIAGRAMS



Single Channel Configuration NCS20071, NCV20071




AEAAYW■






5

ALM■


SOT−553 CASE 463B


1

TSOP−5 CASE 483


Dual Channel Configuration NCS20072, NCV20072

K72 YWW

A■

0072






N

CS20072 ALYW








8 8


AYW■

1 1


Micro8CASE 846A

SOIC−8 CASE 751

TSSOP−8 CASE 948S



Quad Channel Configuration NCS20074, NCV20074










NCS20074G

AWLYWW










14 14

NCS2 0074


ALYW■

1

TSSOP−14 CASE 948G

1


SOIC−14 NB CASE 751A


XXXXX = Specific Device Code A = Assembly Location WL, L = Wafer Lot

Y = Year

WW, W = Work Week

G or ■ = Pb−Free Package

(Note: Microdot may be in either location)


Single Channel Configuration

NCS20071, NCV20071


OUT 1


VSS 2


IN+ 3

5 VDD


+

4 IN−

IN+

2


1

+

VSS

3

IN−

VDD


4


5

OUT


SOT23−5 (TSOP−5)


Dual Channel Configuration


SOT553−5


Quadruple Channel Configuration

NCS20074, NCV20074


OUT 1 1


IN− 1 2


IN+ 1 3

NCS20072, NCV20072


8


− 7


+ 6


VDD OUT 2

IN− 2

OUT 1 1

IN− 1 2

IN+ 1 3 +

VDD 4

14

13

+ 12

11

OUT 4

IN− 4

IN+ 4 VSS


VSS 4

+ 5 IN+ 2

IN+ 2 5 + + 10

IN+ 3

IN− 2 6

OUT 2 7

9 IN− 3

8 OUT 3


Figure 1. Pin Connections


ORDERING INFORMATION


Device

Configuration

Automotive

Marking

Package

Shipping

NCS20071SN2T1G


Single


No

AEA

TSOP−5

(Pb−Free)

3000 / Tape and Reel

NCS20071XV53T2G

AL

SOT553−5

(Pb−Free)

4000 / Tape and Reel

NCV20071SN2T1G*


Yes

AEA

TSOP−5

(Pb−Free)

3000 / Tape and Reel

NCV20071XV53T2G*

AL

SOT553−5

(Pb−Free)

4000 / Tape and Reel

NCS20072DMR2G


Dual


No

0072

Micro8 (MSOP8) (Pb−Free)

4000 / Tape and Reel

NCS20072DR2G

NCS20072

SOIC−8

(Pb−Free)

2500 / Tape and Reel

NCS20072DTBR2G

K72

TSSOP−8

(Pb−Free)

2500 / Tape and Reel

NCV20072DMR2G*


Yes

0072

Micro8 (MSOP8) (Pb−Free)

4000 / Tape and Reel

NCV20072DR2G*

NCS20072

SOIC−8

(Pb−Free)

2500 / Tape and Reel

NCV20072DTBR2G*

K72

TSSOP−8

(Pb−Free)

2500 / Tape and Reel

NCS20074DR2G


Quad


No

NCS20074

SOIC−14

(Pb−Free)

2500 / Tape and Reel

NCS20074DTBR2G

NCS2 0074

TSSOP−14

(Pb−Free)

2500 / Tape and Reel

NCV20074DR2G*


Yes

NCS20074

SOIC−14

(Pb−Free)

2500 / Tape and Reel

NCV20074DTBR2G*

NCS2 0074

TSSOP−14

(Pb−Free)

2500 / Tape and Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.

*NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q100 Qualified and PPAP Capable.


ABSOLUTE MAXIMUM RATINGS (Note 1)

Rating

Symbol

Limit

Unit

Supply Voltage (VDD – VSS) (Note 4)

VS

40

V

Input Voltage

VCM

VSS − 0.2 to VDD + 0.2

V

Differential Input Voltage (Note 2)

VID

Vs

V

Maximum Input Current

IIN

10

mA

Maximum Output Current (Note 3)

IO

100

mA

Continuous Total Power Dissipation (Note 4)

PD

200

mW

Maximum Junction Temperature

TJ

150

C

Storage Temperature Range

TSTG

−65 to 150

C

Mounting Temperature (Infrared or Convection – 20 sec)

Tmount

260

C

ESD Capability (Note 5)

Human Body Model

HBM

2000

V


Machine Model − NCx20071

MM

200



Machine Model − NCx20072, NCx20074

MM

150



Charged Device Model − NCx20071, NCx20072

CDM

2000 (C6)



Charged Device Model − NCx20074

CDM

1000 (C6)


Latch−Up Current (Note 6)

ILU

100

mA

Moisture Sensitivity Level (Note 7)

MSL

Level 1


Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.

  1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.

  2. Maximum input current must be limited to 10 mA. Series connected resistors of at least 500 Q on both inputs may be used to limit the maximum input current to 10 mA.

  3. Total power dissipation must be limited to prevent the junction temperature from exceeding the 150C limit.

  4. Continuous short circuit operation to ground at elevated ambient temperature can result in exceeding the maximum allowed junction temperature of 150C. Output currents in excess of the maximum output current rating over the long term may adversely affect reliability. Shorting output to either VDD or VSS will adversely affect reliability.

  5. This device series incorporates ESD protection and is tested by the following methods: ESD Human Body Model tested per JEDEC standard JS-001 (AEC−Q100−002)

    ESD Machine Model tested per JEDEC standard JESD22−A115 (AEC−Q100−003)

    ESD Charged Device Model tested per JEDEC standard JESD22−C101 (AEC−Q100−011)

  6. Latch−up Current tested per JEDEC standard JESD78 (AEC−Q100−004)

  7. Moisture Sensitivity Level tested per IPC/JEDEC standard J−STD−020A

    THERMAL INFORMATION


    Parameter


    Symbol


    Package

    Single Layer Board (Note 8)

    Multi−Layer Board (Note 9)


    Unit


    Junction−to−Ambient


    8JA

    SOT23−5 / TSOP5

    265

    195


    SOT553−5

    325

    244

    Micro8 / MSOP8

    236

    167

    SOIC−8

    190

    131

    TSSOP−8

    253

    194

    SOIC−14

    142

    101

    TSSOP−14

    179

    128

  8. Values based on a 1S standard PCB according to JEDEC51−3 with 1.0 oz copper and a 300 mm2 copper area

  9. Values based on a 1S2P standard PCB according to JEDEC51−7 with 1.0 oz copper and a 100 mm2 copper area

    OPERATING RANGES

    Parameter

    Symbol

    Min

    Max

    Unit

    Operating Supply Voltage (Single Supply)

    VS

    2.7

    36

    V

    Operating Supply Voltage (Split Supply)

    VS

    1.35

    18

    V

    Differential Input Voltage (Note 10)

    VID


    VS

    V

    Input Common Mode Voltage Range

    VCM

    VSS

    VDD − 1.35

    V

    Ambient Temperature

    TA

    −40

    125

    C

    Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond the Recommended Operating Ranges limits may affect device reliability.

  10. Maximum input current must be limited to 10 mA. See Absolute Maximum Ratings for more information.


    Parameter

    Symbol

    Conditions

    Min

    Typ

    Max

    Unit

    INPUT CHARACTERISTICS


    Input Offset Voltage


    VOS


    NCx20071


    1.3

    3.5


    mV



    ±4.5


    NCx20072, NCx20074


    1.3

    3



    ±4

    Offset Voltage Drift

    /1VOS//1T

    TA = 25C to 125C


    2


    µV/C


    Input Bias Current (Note 12)


    IIB



    5

    200


    pA




    1500


    Input Offset Current (Note 12)


    IOS


    NCx20071, NCx20072


    2

    75


    pA



    500


    NCx20074


    2

    75



    200


    Channel Separation


    XTLK


    DC

    NCx20072


    100



    dB

    NCx20074


    115


    Differential Input Resistance

    RID



    5


    GQ

    Common Mode Input Resistance

    RIN



    5


    GQ

    Differential Input Capacitance

    CID



    1.5


    pF

    Common Mode Input Capacitance

    CCM



    3.5


    pF


    Common Mode Rejection Ratio


    CMRR


    VCM = VSS + 0.2 V to VDD − 1.35 V

    90

    110



    dB

    69



    OUTPUT CHARACTERISTICS


    Open Loop Voltage Gain


    AVOL


    96

    118



    dB

    86




    Output Current Capability (Note 13)


    IO

    Op amp sinking current


    70



    mA

    Op amp sourcing current


    50



    Output Voltage High


    VOH


    Voltage output swing from positive rail


    0.006

    0.15


    V



    0.22


    Output Voltage Low


    VOL


    Voltage output swing from negative rail


    0.005

    0.15


    V



    0.22

    AC CHARACTERISTICS

    Unity Gain Bandwidth

    UGBW

    CL = 25 pF


    3


    MHz

    Slew Rate at Unity Gain

    SR

    CL = 20 pF, RL = 2 kQ


    2.8


    V/µs

    Phase Margin

    cpm

    CL = 25 pF


    50


    Gain Margin

    Am

    CL = 25 pF


    14


    dB


    Settling Time


    tS

    VO = 1 Vpp, Gain = 1, CL = 20 pF

    Settling time to 0.1%


    0.6



    µs

    Settling time to 0.01%


    1.2


    Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.

  11. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.

  12. Performance guaranteed over the indicated operating temperature range by design and/or characterization.

  13. Power dissipation must be limited to prevent junction temperature from exceeding 150C. See Absolute Maximum Ratings for more infor- mation.


Parameter

Symbol

Conditions

Min

Typ

Max

Unit

NOISE CHARACTERISTICS

Total Harmonic Distortion plus Noise

THD+N

VIN = 0.5 Vpp, f = 1 kHz, Av = 1


0.05


%


Input Referred Voltage Noise


en

f = 1 kHz


30


nV/Hz

f = 10 kHz


20


Input Referred Current Noise

in

f = 1 kHz


90


fA/Hz

SUPPLY CHARACTERISTICS


Power Supply Rejection Ratio


PSRR


No Load

114

135



dB

100




Power Supply Quiescent Current


IDD


NCx20071


No load


420

625


µA



765


NCx20072, NCx20074


Per channel, no load


405

525



625

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.

  1. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.

  2. Performance guaranteed over the indicated operating temperature range by design and/or characterization.

  3. Power dissipation must be limited to prevent junction temperature from exceeding 150C. See Absolute Maximum Ratings for more infor- mation.


    ELECTRICAL CHARACTERISTICS AT VS = 5 V

    TA = 25C; RL 10 kQ; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis.

    Boldface limits apply over the specified temperature range, TA = −40C to 125C. (Notes 14, 15)


    Parameter

    Symbol

    Conditions

    Min

    Typ

    Max

    Unit

    INPUT CHARACTERISTICS



    Input Offset Voltage


    VOS


    NCx20071


    1.3

    3.5


    mV



    ±4.5


    NCx20072, NCx20074


    1.3

    3



    ±4

    Offset Voltage Drift

    /1VOS//1T

    TA = 25C to 125 C


    2


    µV/C


    Input Bias Current (Note 15)


    IIB



    5

    200


    pA




    1500


    Input Offset Current (Note 15)


    IOS


    NCx20071, NCx20072


    2

    75


    pA



    500


    NCx20074


    2

    75



    200


    Channel Separation


    XTLK


    DC

    NCx20072


    100



    dB

    NCx20074


    115


    Differential Input Resistance

    RID



    5


    GQ

    Common Mode Input Resistance

    RIN



    5


    GQ

    Differential Input Capacitance

    CID



    1.5


    pF

    Common Mode Input Capacitance

    CCM



    3.5


    pF

    Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.

  4. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.

  5. Performance guaranteed over the indicated operating temperature range by design and/or characterization.

  6. Power dissipation must be limited to prevent junction temperature from exceeding 150C. See Absolute Maximum Ratings for more infor- mation.


Parameter

Symbol

Conditions

Min

Typ

Max

Unit

INPUT CHARACTERISTICS



Common Mode Rejection Ratio


CMRR


VCM = VSS + 0.2 V to VDD − 1.35 V

102

125



dB

80



OUTPUT CHARACTERISTICS



Open Loop Voltage Gain


AVOL


96

120



dB

86




Output Current Capability (Note 16)


IO

Op amp sinking current


50



mA

Op amp sourcing current


60



Output Voltage High


VOH


Voltage output swing from positive rail


0.013

0.20


V



0.25


Output Voltage Low


VOL


Voltage output swing from negative rail


0.01

0.10


V



0.15

AC CHARACTERISTICS


Unity Gain Bandwidth

UGBW

CL = 25 pF


3


MHz

Slew Rate at Unity Gain

SR

CL = 20 pF, RL = 2 kQ


2.7


V/µs

Phase Margin

cpm

CL = 25 pF


50


Gain Margin

Am

CL = 25 pF


14


dB


Settling Time


tS

VO = 3 Vpp, Gain = 1, CL = 20 pF

Settling time to 0.1%


1.2



µs

Settling time to 0.01%


5.6


NOISE CHARACTERISTICS


Total Harmonic Distortion plus Noise

THD+N

VIN = 2.5 Vpp, f = 1 kHz, Av = 1


0.009


%


Input Referred Voltage Noise


en

f = 1 kHz


30


nV/Hz

f = 10 kHz


20


Input Referred Current Noise

in

f = 1 kHz


90


fA/Hz

SUPPLY CHARACTERISTICS



Power Supply Rejection Ratio


PSRR


No Load

114

135



dB

100




Power Supply Quiescent Current


IDD


NCx20071


No load


430

635


µA



775


NCx20072, NCx20074


Per channel, no load


410

530



630

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.

  1. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.

  2. Performance guaranteed over the indicated operating temperature range by design and/or characterization.

  3. Power dissipation must be limited to prevent junction temperature from exceeding 150C. See Absolute Maximum Ratings for more infor- mation.


    Parameter

    Symbol

    Conditions

    Min

    Typ

    Max

    Unit

    INPUT CHARACTERISTICS


    Input Offset Voltage


    VOS


    NCx20071


    1.3

    3.5

    mV



    ±4.5

    mV


    Input Offset Voltage


    VOS


    NCx20072, NCx20074


    1.3

    3

    mV



    ±4

    mV

    Offset Voltage Drift

    /1VOS//1T

    TA = 25C to 125C


    2


    µV/C


    Input Bias Current (Note 18)


    IIB



    5

    200


    pA




    1500


    Input Offset Current (Note 18)


    IOS


    NCx20071, NCx20072


    2

    75


    pA



    500


    NCx20074


    2

    75



    200


    Channel Separation


    XTLK


    DC

    NCx20072


    100



    dB

    NCx20074


    115


    Differential Input Resistance

    RID



    5


    GQ

    Common Mode Input Resistance

    RIN



    5


    GQ

    Differential Input Capacitance

    CID



    1.5


    pF

    Common Mode Input Capacitance

    CCM



    3.5


    pF


    Common Mode Rejection Ratio


    CMRR


    VCM = VSS + 0.2 V to VDD − 1.35 V

    110

    130



    dB

    87



    OUTPUT CHARACTERISTICS


    Open Loop Voltage Gain


    AVOL


    98

    120



    dB

    88




    Output Current Capability (Note 19)


    IO

    Op amp sinking current


    50



    mA

    Op amp sourcing current


    65



    Output Voltage High


    VOH


    Voltage output swing from positive rail


    0.023

    0.08


    V



    0.10


    Output Voltage Low


    VOL


    Voltage output swing from negative rail


    0.022

    0.3


    V



    0.35

    AC CHARACTERISTICS

    Unity Gain Bandwidth

    UGBW

    CL = 25 pF


    3


    MHz

    Slew Rate at Unity Gain

    SR

    CL = 20 pF, RL = 2 kQ


    2.6


    V/µs

    Phase Margin

    cpm

    CL = 25 pF


    50


    Gain Margin

    Am

    CL = 25 pF


    14


    dB


    Settling Time


    tS

    VO = 8.5 Vpp, Gain = 1, CL = 20 pF

    Settling time to 0.1%


    3.4



    µs

    Settling time to 0.01%


    6.8


    Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.

  4. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.

  5. Performance guaranteed over the indicated operating temperature range by design and/or characterization.

  6. Power dissipation must be limited to prevent junction temperature from exceeding 150C. See Absolute Maximum Ratings for more infor- mation.


Parameter

Symbol

Conditions

Min

Typ

Max

Unit

NOISE CHARACTERISTICS

Total Harmonic Distortion plus Noise

THD+N

VIN = 7.5 Vpp, f = 1 kHz, Av = 1


0.004


%


Input Referred Voltage Noise


en

f = 1 kHz


30


nV/Hz

f = 10 kHz


20


Input Referred Current Noise

in

f = 1 kHz


90


fA/Hz

SUPPLY CHARACTERISTICS


Power Supply Rejection Ratio


PSRR


No Load

114

135



dB

100




Power Supply Quiescent Current


IDD


NCx20071


No load


430

645


µA



785


NCx20072, NCx20074


Per channel, no load


416

540



640

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.

  1. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.

  2. Performance guaranteed over the indicated operating temperature range by design and/or characterization.

  3. Power dissipation must be limited to prevent junction temperature from exceeding 150C. See Absolute Maximum Ratings for more infor- mation.


    ELECTRICAL CHARACTERISTICS AT VS = 36 V

    TA = 25C; RL 10 kQ; VCM = VOUT = mid−supply unless otherwise noted. All limits are guaranteed by testing or statistical analysis. Boldface limits apply over the specified temperature range, TA = −40C to 125C. (Notes 20, 21)


    Parameter

    Symbol

    Conditions

    Min

    Typ

    Max

    Unit

    INPUT CHARACTERISTICS



    Input Offset Voltage


    VOS


    NCx20071


    1.3

    3.5

    mV



    ±4.5

    mV


    NCx20072, NCx20074


    1.3

    3

    mV



    ±4

    mV

    Offset Voltage Drift

    /1VOS//1T

    TA = 25C to 125C


    2


    µV/C


    Input Bias Current (Note 21)


    IIB



    5

    200


    pA

    NCx20071, NCx20072



    2000

    NCx20074



    1500


    Input Offset Current (Note 21)


    IOS


    NCx20071, NCx20072


    2

    75


    pA



    1000


    NCx20074


    2

    75



    200


    Channel Separation


    XTLK


    DC

    NCx20072


    100



    dB

    NCx20074


    115


    Differential Input Resistance

    RID



    5


    GQ

    Common Mode Input Resistance

    RIN



    5


    GQ

    Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.

  4. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.

  5. Performance guaranteed over the indicated operating temperature range by design and/or characterization.

  6. Power dissipation must be limited to prevent junction temperature from exceeding 150C. See Absolute Maximum Ratings for more infor- mation.


Parameter

Symbol

Conditions

Min

Typ

Max

Unit

INPUT CHARACTERISTICS


Differential Input Capacitance

CID



1.5


pF

Common Mode Input Capacitance

CCM



3.5


pF


Common Mode Rejection Ratio


CMRR


NCx20071

VCM = VSS + 0.2 V to VDD − 1.35 V

118

135



dB

95




NCx20072

VCM = VSS + 0.2 V to VDD − 1.35 V

120

145


95




NCx20074

VCM = VSS + 0.2 V to VDD − 1.35 V

120

145


85



OUTPUT CHARACTERISTICS



Open Loop Voltage Gain


AVOL


98

120



dB

88




Output Current Capability (Note 22)


IO

Op amp sinking current


50



mA

Op amp sourcing current


65



Output Voltage High


VOH


Voltage output swing from positive rail


NCx20071


0.074

0.15


V



0.22


NCx20072


0.074

0.10



0.15


NCx20074


0.074

0.10



0.12


Output Voltage Low


VOL


Voltage output swing from negative rail


0.065

0.3


V



0.35

AC CHARACTERISTICS


Unity Gain Bandwidth

UGBW

CL = 25 pF


3


MHz

Slew Rate at Unity Gain

SR

CL = 20 pF, RL = 2 kQ


2.4


V/µs

Phase Margin

cpm

CL = 25 pF


50


Gain Margin

Am

CL = 25 pF


14


dB


Settling Time


tS

VO = 10 Vpp, Gain = 1, CL = 20 pF

Settling time to 0.1%


3.2



µs

Settling time to 0.01%


7


NOISE CHARACTERISTICS


Total Harmonic Distortion plus Noise

THD+N

VIN = 28.5 Vpp, f = 1 kHz, Av = 1


0.001


%


Input Referred Voltage Noise


en

f = 1 kHz


30



nV/Hz

f = 10 kHz


20


Input Referred Current Noise

in

f = 1 kHz


90


fA/Hz

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.

  1. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.

  2. Performance guaranteed over the indicated operating temperature range by design and/or characterization.

  3. Power dissipation must be limited to prevent junction temperature from exceeding 150C. See Absolute Maximum Ratings for more infor- mation.


Parameter

Symbol

Conditions

Min

Typ

Max

Unit

SUPPLY CHARACTERISTICS



Power Supply Rejection Ratio


PSRR


No Load

114

135



dB

100




Power Supply Quiescent Current


IDD


NCx20071


No load


480

700


µA



840


NCx20072


Per channel, no load


465

570



700


NCx20074


Per channel, no load


465

600



700

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions.

  1. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.

  2. Performance guaranteed over the indicated operating temperature range by design and/or characterization.

  3. Power dissipation must be limited to prevent junction temperature from exceeding 150C. See Absolute Maximum Ratings for more infor- mation.











































    VS = 36 V




















































    VS = 2.7 V









    VS = 5 V










    VS = 10 V














































    0.7 0.7


    SUPPLY CURRENT (mA)

    0.6


    0.5


    0.4


    0.3


    T = 125C T = 85C T = 25C


    T = −40C

    0.6


    SUPPLY CURRENT (mA)

    0.5


    0.4


    0.3


    0.2


    0 6 12 18 24 30 36

    SUPPLY VOLTAGE (V)

    0.2


    −40 −20


    0 20 40 60 80

    TEMPERATURE (C)


    100


    120

    Figure 2. Quiescent Current Per Channel vs.

    Supply Voltage

    Figure 3. Quiescent Current vs. Temperature


    0


    OFFSET VOLTAGE (mV)

    −0.2


    −0.4


    −0.6


    −0.8


    T = 85C T = 25C


    T = −40C

    5

    VCM = mid−supply 4

    OFFSET VOLTAGE (mV)

    3

    2

    1

    0

    −1

    −2


    VS = 18 V

    10 units


    −1


    −1.2

    T = 125C


    0 6 12 18 24 30 36

    −3

    −4

    −5

    −18 −14 −10 −6


    −2 2


    6 10


    14 18

    SUPPLY VOLTAGE (V)

    Figure 4. Offset Voltage vs. Supply Voltage

    COMMON MODE VOLTAGE (V)

    Figure 5. Input Offset Voltage vs. Common Mode Voltage


    5


    OFFSET VOLTAGE (mV)

    2.5


    0


    −2.5


    −5


    −7.5


    −10


    −12.5


    −15


    Normal operation


    VS = 18 V

    10 units

    125


    100


    75


    GAIN (dB)

    50


    25


    0


    −25


    −50


    −75


    GAIN


    RL = 10 kQ CL = 15 pF


    PHASE


    VS = 2.7 V, Gain

    VS = 36 V, Gain

    VS = 2.7 V, Phase VS = 36 V, Phase

    180


    135


    90


    PHASE ()

    45


    0


    −45


    −90


    −135


    −180

    15.5 16 16.5 17 17.5 18 18.5 10

    COMMON MODE VOLTAGE (V)

    100 1k 10k 100k 1M

    FREQUENCY (Hz)

    10M

    100M

    Figure 6. Input Offset Voltage vs. Common Mode Voltage

    Figure 7. Gain and Phase vs. Frequency


    60

    VS = 5 V

    50 RL = 10 kQ

    PHASE MARGIN ()

    TA = 25C

    40


    30


    20


    10

    1E+1










    VS = 36 V

    fIN = 1 kHz AV = 1




































































































































































    1E+0


    THD+N (%)

    1E−1


    1E−2


    1E−3


    0

    0 100 200 300 400 500

    1E−4


    0 6 12 18 24


    30 36

    CAPACITIVE LOAD (pF)

    Figure 8. Phase Margin vs. Capacitive Load

    OUTPUT VOLTAGE (Vpp)

    Figure 9. THD+N vs. Output Voltage


    1E+1


    1E+0


    THD+N (%)

    1E−1


    1E−2


    1E−3


    1E−4


    VS = 2.7 V VS = 5 V

    VS = 10 V VS = 36 V

    275

    AV = 1 250

    VOLTAGE NOISE (nV/Hz)

    225

    200

    175

    150

    125

    100

    75

    50

    25

    0


    VS = 2.7 V VS = 5 V VS = 10 V VS = 36 V

    10 100 1k 10k FREQUENCY (Hz)

    Figure 10. THD+N vs. Frequency

    10 100 1k 10k 100k FREQUENCY (Hz)

    Figure 11. Input Voltage Noise vs. Frequency


    INPUT REFERRED CURRENT NOISE (fA/Hz)

    10000


    1000


    100


    10


    1


    VS = 2.7 V

    VS = 5 V VS = 10 V VS = 36 V

    140


    120


    100


    PSRR (dB)

    80


    60


    40


    20


    VS = 2.7 V, VDD VS = 2.7 V, VSS VS = 36 V, VDD VS = 36 V VSS


    0.1

    10 100 1k 10k 100k FREQUENCY (Hz)

    Figure 12. Input Current Noise vs. Frequency

    0

    10 100 1k 10k 100k 1M FREQUENCY (Hz)

    Figure 13. PSRR vs. Frequency


    120


    VS = 2.7 V

    1.4


    T = −40C


    100


    CMRR (dB)

    80


    60


    40


    20


    RL = 10 kQ

    VS = 5 V

    VS = 10 V VS = 36 V

    1.2 1

    OUTPUT VOLTAGE RELATIVE TO VDD (V)

    0.8


    0.6


    0.4


    0.2

    T = 25C T = 85C T = 125C

    TA = 25C

    0

    VS = 36 V

    0

    10 100 1k 10k 100k 1M

    0 2 4 6

    8 10 12 14

    16 18 20

    FREQUENCY (Hz)

    Figure 14. CMRR vs. Frequency

    OUTPUT CURRENT (mA)

    Figure 15. High Level Output vs. Output Current

    OUTPUT VOLTAGE RELATIVE TO VSS (V)

    1 T = −40C

    18.1


    Input


    VS = 36 V


    0.8


    0.6


    0.4


    0.2


    0

    T = 25C T = 85C T = 125C


    VS = 36 V


    18.05


    VOLTAGE (V)

    18


    17.95


    17.9

    Output

    AV = +1 RL = 10 kQ

    0 2 4 6

    8 10 12 14

    16 18 20

    −20 0 20 40 60


    18.075


    18.05


    VOLTAGE (V)

    18.025

    OUTPUT CURRENT (mA)

    Figure 16. Low Level Output vs. Output Current

    TIME (µs)

    Figure 17. Non−inverting Small Signal Transient Response


    25


    VOLTAGE (V)

    20







    Input Output



























    VS = 36 V

    AV = +1 RL = 10 kQ
















    18


    17.975


    17.95


    17.925


    15


    Input Output

    10


    VS = 36 V AV = +1

    RL = 10 kQ

    −20 0 20 40 60

    TIME (µs)

    Figure 18. Inverting Small Signal Transient Response

    −20 0 20 40 60

    TIME (µs)

    Figure 19. Non−inverting Large Signal Transient Response


    24 1200


    VS = 36 V

    22


    VOLTAGE (V)

    20


    18


    16


    14


    12


    10


    Input Output

    VS = 36 V AV = −1

    RL = 10 kQ

    1000


    CURRENT (pA)

    800


    600


    400


    200


    0


    −200

    IIB+ IIB− IOS

    −20 0 20 40

    60 −25 0 25 50

    75 100

    125

    TIME (µs)

    Figure 20. Inverting Large Signal Transient Response

    TEMPERATURE (C)

    Figure 21. Input Bias and Offset Current vs.

    Temperature


    30

    VS = 36 V

    25


    CURRENT (pA)

    20


    15


    10


    5


    0


    IIB+ IIB− IOS


      1. Hz to 10 Hz noise VS = 18 V, VCM = VS/2 RL = 10 kQ, CL = 100 pF

        2 µV/div

        AV = −1, VIN = 0 V


        −5

        0 6 12 18


        24 30 36


        0 1 2


        3 4 5


        6 7 8


        9 10

        COMMON MODE VOLTAGE (V)

        Figure 22. Input Bias Current vs. Common Mode Voltage

        TIME (s)

        Figure 23. 0.1 Hz to 10 Hz Noise


        0


        CHANNEL SEPARATION (dB)

        −20


        −40


        −60


        −80


        −100


        −120


        −140


        −160


        RL = 10 kQ CL = 25 pF


        VS = 2.7 V

        VS = 5 V VS = 10 V VS = 36 V

        500

        VS = 2.7 V

        VS = 5 V

        VS = 10 V VS = 36 V

        450

        400

        IMPEDANCE (Q)

        350

        300

        250

        200

        150

        100

        50

        0

        10 100 1k 10k 100k 1M 10 100 1k 10k 100k 1M

        FREQUENCY (Hz)

        Figure 24. Channel Separation vs. Frequency

        FREQUENCY (Hz)

        Figure 25. Open Loop Output Impedance


        1000


        VS = 36 V

        10

        VS = 36 V

        /1 FROM FINAL VALUE (mV)

        8 10 V step

        OFFSET VOLTAGE (µV)

        500


        0


        −500


        −1000


        −1500


        −2000


        −2500

        5 Units

        VCM = mid−supply


        6

        4

        2

        0

        −2

        −4

        −6

        −8

        −10

        AV = −1


        12−bit Setting


        1/2LSB = 0.024%

        −50 −25 0

        25 50

        75 100

        125

        0 5 10 15

        20 25 30

        35 40

        45 50

        TEMPERATURE (C)

        Figure 26. Offset Voltage vs. Temperature

        TIME (µs)

        Figure 27. Large Signal Settling Time



        5

        VS = 36 V

        SLEW RATE (V/µs)

        4


        3


        2


        1


        SR+ SR−


        0

        −40 −20 0


        20 40


        60 80


        100


        120

        TEMPERATURE (C)

        Figure 28. Slew Rate vs. Temperature



        Input Circuit

        APPLICATIONS INFORMATION

        NCS2007x at differential voltages greater than VID = 26 V,

        The NCS2007x input stage has a PMOS input pair and ESD protection diodes. The input pair is internally connected by back−to−back Zener diodes with a reverse voltage of 5.5 V. To protect the internal circuitry, the input current must be limited to 10 mA. When operating the


        VDD

        series resistors can be added externally to limit the input current flowing between the input pins. Adding 500 Q resistors in series with the input prevents the current from exceeding 10 mA over the entire operating range up to 36 V.


        VDD


        1k 1k

        IN+ IN−


        VSS


        Figure 29. Differential Input Pair

        VSS


        Output

        The NCS2007x has a class AB output stage with rail−to−rail output swing.

        High output currents can cause the junction temperature to exceed the 150C absolute maximum rating. In the case of a short circuit where the output is connected to either supply rail, the amount of current the op amp can source and sink is described by the output current capability parameter

        listed in the Electrical Characteristics. The junction temperature at a given power dissipation, P, can be calculated using the following formula:

        TJ = TA + P x 8JA

        The thermal resistance between junction and ambient, 8JA, is provided in the Thermal Information section of this datasheet.


        SOT−553, 5 LEAD CASE 463B ISSUE C

        D NOTES:

        −X−

        L

        A 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.


        5

        4

        E

        1 2 3

        −Y−


        b 5 PL


        0.08 (0.003) M

        X

        Y

        e

        1. CONTROLLING DIMENSION: MILLIMETERS


          DIM

          MILLIMETERS

          INCHES

          MIN

          NOM

          MAX

          MIN

          NOM

          MAX

          A

          0.50

          0.55

          0.60

          0.020

          0.022

          0.024

          b

          0.17

          0.22

          0.27

          0.007

          0.009

          0.011

          c

          0.08

          0.13

          0.18

          0.003

          0.005

          0.007

          D

          1.55

          1.60

          1.65

          0.061

          0.063

          0.065

          E

          1.15

          1.20

          1.25

          0.045

          0.047

          0.049

          e

          0.50 BSC

          0.020 BSC

          L

          0.10

          0.20

          0.30

          0.004

          0.008

          0.012

          HE

          1.55

          1.60

          1.65

          0.061

          0.063

          0.065

        2. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.


HE


c



RECOMMENDED SOLDERING FOOTPRINT*

0.3

0.0118


1.35

0.0531


1.0

0.0394


0.45

0.0177



0.5

0.0197

0.5

0.0197



SCALE 20:1

mm inches

( )

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.


TSOP−5 CASE 483 ISSUE M


NOTE 5


T

0.10

2X



0.20

C

A

B

D 5X


NOTES:

      1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

      2. CONTROLLING DIMENSION: MILLIMETERS.

      3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH THICKNESS. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE MATERIAL.

M 4. DIMENSIONS A AND B DO NOT INCLUDE MOLD

5 4

1 2 3

B

T

0.20

2X S K

B G DETAIL Z

A A

FLASH, PROTRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS, OR GATE BURRS SHALL NOT EXCEED 0.15 PER SIDE. DIMENSION A.

5. OPTIONAL CONSTRUCTION: AN ADDITIONAL TRIMMED LEAD IS ALLOWED IN THIS LOCATION. TRIMMED LEAD NOT TO EXTEND MORE THAN 0.2 FROM BODY.


DIM

MILLIMETERS

MIN

MAX

A

2.85

3.15

B

1.35

1.65

C

0.90

1.10

D

0.25

0.50

G

0.95 BSC

H

0.01

0.10

J

0.10

0.26

K

0.20

0.60

M

0 °

10 °

S

2.50

3.00

TOP VIEW



C

0.05 H

DETAIL Z

C

J


SIDE VIEW

SEATING PLANE

END VIEW


SOLDERING FOOTPRINT*

1.9 0.074

0.95

0.037



1.0

0.039

2.4

0.094






0.7

0.028


SCALE 10:1


mm inches

( )

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.


Micro8M CASE 846A−02 ISSUE J


D


HE


PIN 1 ID e


E


b 8 PL


NOTES:

  1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

  2. CONTROLLING DIMENSION: MILLIMETER.

  3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED

    0.15 (0.006) PER SIDE.

  4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.

  5. 846A-01 OBSOLETE, NEW STANDARD 846A-02.


0.08 (0.003)

M

T

B

S

A

S



−T−



0.038 (0.0015)


SEATING PLANE



DIM

MILLIMETERS

INCHES

MIN

NOM

MAX

MIN

NOM

MAX

A

−−

−−

1.10

−−

−−

0.043

A1

0.05

0.08

0.15

0.002

0.003

0.006

b

0.25

0.33

0.40

0.010

0.013

0.016

c

0.13

0.18

0.23

0.005

0.007

0.009

D

2.90

3.00

3.10

0.114

0.118

0.122

E

2.90

3.00

3.10

0.114

0.118

0.122

e

0.65 BSC

0.026 BSC

L

0.40

0.55

0.70

0.016

0.021

0.028

HE

4.75

4.90

5.05

0.187

0.193

0.199

A


A1 c L

RECOMMENDED SOLDERING FOOTPRINT*

8X

8X 0.48 0.80

5.25


0.65

PITCH

DIMENSION: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.



−X−

A



5


8

B S

1


4

−Y−


G


C


DIM

MILLIMETERS

INCHES

MIN

MAX

MIN

MAX

A

4.80

5.00

0.189

0.197

B

3.80

4.00

0.150

0.157

C

1.35

1.75

0.053

0.069

D

0.33

0.51

0.013

0.020

G

1.27 BSC

0.050 BSC

H

0.10

0.25

0.004

0.010

J

0.19

0.25

0.007

0.010

K

0.40°

1.27°

0.016°

0.050°

M

0

8

0

8

N

0.25

0.50

0.010

0.020

S

5.80

6.20

0.228

0.244

SEATING

SOIC−8 NB CASE 751−07 ISSUE AK



0.25 (0.010) M

Y M



K


N X 45°


NOTES:

  1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

  2. CONTROLLING DIMENSION: MILLIMETER.

  3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION.

  4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE.

  5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION.

  6. 751−01 THRU 751−06 ARE OBSOLETE. NEW STANDARD IS 751−07.

−Z−

PLANE


0.10 (0.004)

H D M J



0.25 (0.010)

M

Z

Y

S

X

S

SOLDERING FOOTPRINT*



1.52 0.060


7.0

0.275

4.0

0.155


0.6 0.024

1.270

( )

0.050


SCALE 6:1


mm inches

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.


TSSOP−8 CASE 948S ISSUE C



0.20 (0.008)

U S


L


T

PIN 1 IDENT

0.20 (0.008)

U S

8x K REF


5

8

2X L/2

−U−


0.10 (0.004)

M

T

U

S

V

S

B


1


4


A

−V−


T

J J1


K1 K

SECTION N−N


NOTES:

  1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

  2. CONTROLLING DIMENSION: MILLIMETER.

  3. DIMENSION A DOES NOT INCLUDE MOLD FLASH. PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.

  4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.

  5. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.

  6. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-.


    C

    0.076 (0.003)

    −T−

    G

    SEATING D

    PLANE

    −W−



    DIM

    MILLIMETERS

    INCHES

    MIN

    MAX

    MIN

    MAX

    A

    2.90

    3.10

    0.114

    0.122

    B

    4.30

    4.50

    0.169

    0.177

    C

    ---

    1.10

    ---

    0.043

    D

    0.05

    0.15

    0.002

    0.006

    F

    0.50

    0.70

    0.020

    0.028

    G

    0.65 BSC

    0.026 BSC

    J

    0.09

    0.20

    0.004

    0.008

    J1

    0.09

    0.16

    0.004

    0.006

    K

    0.19

    0.30

    0.007

    0.012

    K1

    0.19

    0.25

    0.007

    0.010

    L

    6.40 BSC

    0.252 BSC

    M

    °

    0

    °

    8

    °

    0

    °

    8

    DETAIL E


    0.25 (0.010)

    N

    M

    N


    F


    DETAIL E


    TSSOP−14 CASE 948G ISSUE C


    T

    V S

    T

    14X K REF

    0.15 (0.006)

    U S

    0.10 (0.004) M

    U S

    0.25 (0.010)

    N

    2X L/2

    14

    8

    M

    L B

    NOTES:

    1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

    2. CONTROLLING DIMENSION: MILLIMETER.

    3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE.

    4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE.

    5. DIMENSION K DOES NOT INCLUDE DAMBAR


      T

      PIN 1 IDENT.


      0.15 (0.006)

      U S


      C


      1


      A

      −V−

      −U−


      7

      N


      J J1


      F DETAIL E

      K K1


      SECTION N−N

      PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION.

    6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY.


      DIM

      MILLIMETERS

      INCHES

      MIN

      MAX

      MIN

      MAX

      A

      4.90

      5.10

      0.193

      0.200

      B

      4.30

      4.50

      0.169

      0.177

      C

      −−−

      1.20

      −−−

      0.047

      D

      0.05

      0.15

      0.002

      0.006

      F

      0.50

      0.75

      0.020

      0.030

      G

      0.65 BSC

      0.026 BSC

      H

      0.50

      0.60

      0.020

      0.024

      J

      0.09

      0.20

      0.004

      0.008

      J1

      0.09

      0.16

      0.004

      0.006

      K

      0.19

      0.30

      0.007

      0.012

      K1

      0.19

      0.25

      0.007

      0.010

      L

      6.40 BSC

      0.252 BSC

      M

      0 °

      8 °

      0 °

      8 °

    7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE −W−.


−W−


0.10 (0.004)

−T−

D

G

SEATING PLANE

H DETAIL E


SOLDERING FOOTPRINT*


7.06


1


0.65

PITCH


14X

0.36


14X

1.26


DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.


D A

B


14 8


H E


SOIC−14 NB CASE 751A−03 ISSUE L


A3


L


NOTES:

  1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.

  2. CONTROLLING DIMENSION: MILLIMETERS.

  3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE PROTRUSION SHALL BE 0.13 TOTAL IN EXCESS OF AT MAXIMUM MATERIAL CONDITION.

  4. DIMENSIONS D AND E DO NOT INCLUDE MOLD PROTRUSIONS.


    DIM

    MILLIMETERS

    INCHES

    MIN

    MAX

    MIN

    MAX

    A

    1.35

    1.75

    0.054

    0.068

    A1

    0.10

    0.25

    0.004

    0.010

    A3

    0.19

    0.25

    0.008

    0.010

    b

    0.35

    0.49

    0.014

    0.019

    D

    8.55

    8.75

    0.337

    0.344

    E

    3.80

    4.00

    0.150

    0.157

    e

    1.27 BSC

    0.050 BSC

    H

    5.80

    6.20

    0.228

    0.244

    h

    0.25

    0.50

    0.010

    0.019

    L

    0.40

    1.25

    0.016

    0.049

    M

    0 °

    7 °

    0 °

    7 °

  5. MAXIMUM MOLD PROTRUSION 0.15 PER SIDE.

1 7


0.25 M

B M

13X b


0.25 M

C

A S

B S


A

DETAIL A


h

X 45 °


DETAIL A



0.10

e A1


M

C

SEATING PLANE

SOLDERING FOOTPRINT*

6.50


1


14X

1.18


1.27

PITCH


14X

0.58


DIMENSIONS: MILLIMETERS

*For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.


ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.


PUBLICATION ORDERING INFORMATION

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com



N. American Technical Support: 800−282−9855 Toll Free USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050


www.onsemi.com

25


ON Semiconductor Website: www.onsemi.com


Order Literature: http://www.onsemi.com/orderlit


For additional information, please contact your local Sales Representative


NCS20071/D

Mouser Electronics


Authorized Distributor


Click to View Pricing, Inventory, Delivery & Lifecycle Information:


ON Semiconductor:

NCS20074DR2G NCV20074DTBR2G NCV20074DR2G NCS20072DR2G NCS20072DTBR2G NCV20072DR2G NCS20074DTBR2G NCV20072DMR2G NCS20072DMR2G NCV20072DTBR2G NCV20071SN2T1G