LM158, LM158A, LM258, LM258A LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V
SLOS068W – JUNE 1976 – REVISED OCTOBER 2019
Industry-Standard Dual Operational Amplifiers
3 Description
Quiescent current: 300 µA per amplifier (B version, typical)
Common-mode input voltage range includes ground, enabling direct sensing near ground
Low input offset voltage of 3 mV at 25°C (A and B versions, maximum)
Internal RF and EMI filter (B version)
On products compliant to MIL-PRF-38535, all parameters are tested unless otherwise noted. On all other products, production processing does not necessarily include testing of all parameters.
Multi-function printers
Desktop PC and motherboard
Indoor and outdoor air conditioners
Washers, dryers, and refrigerators
AC inverters, string inverters, central inverters, and voltage frequency drives
Uninterruptible power supplies
Programmable logic controllers
Electronic point-of-sale systems
Single-Pole, Low-Pass Filter
RG RF
The LM358B and LM2904B devices are the next- generation versions of the industry-standard operational amplifiers (op amps) LM358 and LM2904, which include two high-voltage (36-V) op amps. These devices provide outstanding value for cost- sensitive applications, with features including low offset (300 µV, typical), common-mode input range to ground, and high differential input voltage capability.
The LM358B and LM2904B op amps simplify circuit design with enhanced features such as unity-gain stability, lower offset voltage of 3 mV (maximum at room temperature), and lower quiescent current of 300 µA per amplifier (typical). High ESD (2 kV, HBM) and integrated EMI and RF filters enable the LM358B and LM2904B devices to be used in the most rugged, environmentally challenging applications.
The LM358B and LM2904B amplifiers are available in industry standard packages, including SOIC, TSSOP, and VSSOP.
PART NUMBER | PACKAGE | BODY SIZE (NOM) |
LM358B, LM2904B, LM358, LM358A, LM2904, LM2904V, LM258, LM258A | SOIC (8) | 4.90 mm × 3.90 mm |
LM358B(2), LM2904B(2), LM358, LM358A, LM2904, LM2490V | TSSOP (8) | 3.00 mm × 4.40 mm |
LM358B(2), LM2904B(2), LM358, LM358A, LM2904, LM2904V, LM258, LM258A | VSSOP (8) | 3.00 mm × 3.00 mm |
LM358, LM2904 | SO (8) | 5.20 mm × 5.30 mm |
LM358, LM2904, LM358A, LM258, LM258A | PDIP (8) | 9.81 mm × 6.35 mm |
LM158, LM158A | CDIP (8) | 9.60 mm × 6.67 mm |
LM158, LM158A | LCCC (20) | 8.89 mm × 8.89 mm |
For all available packages, see the orderable addendum at the end of the data sheet.
Package is for preview only.
R1
VIN
C1
f3 dB = 1
2R1C1
VOUT
= 1 +
(
VIN
RG
1 + sR1C1
VOUT ( RF 1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. UNLESS OTHERWISE NOTED, this document contains PRODUCTION DATA.
Features 1
Applications 1
Description 1
Revision History 2
Device Comparison Table 4
Pin Configuration and Functions 5
Specifications 6
Absolute Maximum Ratings 6
ESD Ratings 6
Recommended Operating Conditions 7
Thermal Information 7
Electrical Characteristics: LM358, LM358A 10
Electrical Characteristics: LM2904, LM2904V 11
Electrical Characteristics: LM158, LM158A 12
Electrical Characteristics: LM258, LM258A 13
Typical Characteristics 14
Typical Characteristics 21
Parameter Measurement Information 23
Detailed Description 24
Application and Implementation 26
Power Supply Recommendations 27
Layout 27
Device and Documentation Support 29
Documentation Support 29
Related Links 29
Receiving Notification of Documentation Updates 29 13.4 Community Resources 29
Mechanical, Packaging, and Orderable Information 30
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision V (September 2018) to Revision W Page
Added specification in the Device Comparison Table 4
Changed CDM ESD rating for LM358B and LM2904B in ESD Ratings 6
Changed VS to V+ in Recommended Operating Conditions 7
Changed Thermal Information for the LM158FK and LM158JG devices 7
Added Typical Characteristics section for the LM358B and LM2490B op amps 14
Added test circuit for THD+N and small-signal step response, G = –1 in the Parameter Measurement Information
section 23
Deleted preview designator from LM358B and LM2904B in the Related Links section 29
Changes from Revision U (January 2017) to Revision V Page
Changed the data sheet title 1
Changed first four items in the Features section 1
Changed the first item in the Applications section and added four new items 1
Changed voltage values in the first paragraph of the Description section 1
Changed text in the second paragraph of the Description section 1
Added devices LM358B and LM2904B to data sheet 1
Changed the first three rows of the Device Information table and added a a cross-referenced note for PREVIEW-
status devices 1
Added Device Comparison table 4
Added a table note to the Pin Functions table 5
Changed "free-air temperature" to "ambient temperature" in the Absolute Maximum Ratings condition statement 6
Changed all entries in the Absolute Maximum Ratings table except TJ and Tstg 6
Deleted lead temperature and case temperature from Absolute Maximum Ratings 6
Changed device listings and their voltage values in the ESD Ratings table 6
Changed "free-air temperature" to "ambient temperature" in the Recommended Operating Conditions condition
statement 7
Changed table entries for all parameters in the Recommended Operating Conditions table 7
Added rows to the Thermal Information table, and a table note regarding device-package combinations 7
Deleted the Operating Conditions table. 13
Added a condition statement to the Typical Characteristics section 21
Changed specific voltages to a Recommended Operating Conditions reference 24
Changed unity-gain bandwidth from 0.7 MHz for all devices to 1.2 MHz for B-version devices 25
Changed slew rate from.3 V/µs for all devices to o.5 V/µs for B-version devices. 25
Changed the Input Common Mode Range section in multiple places throughout 25
Changed VCC to VS in the Application Information section 26
Subscripted the suffixes fro RI and RF 26
Changed Operational Amplifier Board Layout for Noninverting Configuration with an image that includes a dual op amp 28
Added Preview designation to the LM358B and LM2904B devices in Table 1 29
Changes from Revision T (April 2015) to Revision U Page
Changed data sheet title 1
Added Receiving Notification of Documentation Updates section and Community Resources section 29
Changes from Revision S (January 2014) to Revision T Page
Added Applications section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation
Support section, and Mechanical, Packaging, and Orderable Information section 1
Changes from Revision R (July 2010) to Revision S Page
Converted this data sheet from the QS format to DocZone using the PDF on the web 1
Deleted Ordering Information table 1
Updated Features to include Military Disclaimer 1
Added Typical Characteristics section 21
Added ESD warning 29
PART NUMBER | SUPPLY VOLTAGE | TEMPERATURE RANGE | VOS (MAXIMUM AT 25°C) | IQ / CH (TYPICAL AT 25°C) | INTEGRATED EMI FILTER | PACKAGE |
3 V–36 V | –40°C to 85°C | 3 mV | 300 µA | Yes | D, DGK, PW | |
LM2904B | 3 V–36 V | –40°C to 125°C | 3 mV | 300 µA | Yes | D, DGK, PW |
LM358 | 3 V–32 V | 0°C to 70°C | 7 mV | 350 µA | No | D, PW, DGK, P, PS |
LM2904 | 3 V–26 V | –40°C to 125°C | 7 mV | 350 µA | No | D, PW, DGK, P, PS |
LM358A | 3 V–32 V | 0°C to 70°C | 3 mV | 350 µA | No | D, PW, DGK, P |
3 V–32 V | –40°C to 125°C | 7 mV | 350 µA | No | D, PW | |
LM158 | 3 V–32 V | –55°C to 125°C | 5 mV | 350 µA | No | JG, FK |
LM158A | 3 V–32 V | –55°C to 125°C | 3 mV | 350 µA | No | JG, FK |
LM258 | 3 V–32 V | –25°C to 85°C | 5 mV | 350 µA | No | D, DGK, P |
LM258A | 3 V–32 V | –25°C to 85°C | 3 mV | 350 µA | No | D, DGK, P |
Pin Configuration and Functions
D, DGK, P, PS, PW, and JG Packages
8-Pin SOIC, VSSOP, PDIP, SO, TSSOP, and CDIP
Top View
FK Package 20-Pin LCCC
Top View
NC
OUT1
NC
V+
NC
OUT1 1 8 V+
3
2
1
20
19
IN1- 2
OUT2
IN1+ 3
V- 4
6 IN2-
5 IN2+
NC 4
IN1- 5
18 NC
17 OUT2
Not to scale
NC 6
IN1+ 7
16 NC
15 IN2-
9
10
11
12
13
NC 8 14 NC
NC
V-
NC
IN2+
NC
Not to scale
Pin Functions
NC - No internal connection
PIN | I/O | DESCRIPTION | ||
NAME | LCCC (1) | SOIC, SSOP, CDIP, PDIP, SO, TSSOP, CFP(1) | ||
IN1– | 5 | 2 | I | Negative input |
IN1+ | 7 | 3 | I | Positive input |
IN2– | 15 | 6 | I | Negative input |
IN2+ | 12 | 5 | I | Positive input |
OUT1 | 2 | 1 | O | Output |
OUT2 | 17 | 7 | O | Output |
V– | 10 | 4 | — | Negative (lowest) supply or ground (for single- supply operation) |
NC | 1, 3, 4, 6, 8, 9, 11, 13, 14, 16, 18, 19 | — | — | No internal connection |
20 | 8 | — | Positive (highest) supply |
(1) For a listing of which devices are available in what packages, see Device Comparison Table.
over operating ambient temperature range (unless otherwise noted)(1)
MAX | UNIT | |||||
LM358B, LM358BA, LM2904B, LM2904BA | ±20 or 40 | V | ||||
LM158, LM258, LM358, LM158A, LM258A, LM358A, LM2904V | ±16 or 32 | |||||
LM2904 | ±13 or 26 | |||||
Differential input voltage, VID(2) | LM358B, LM358BA, LM2904B, LM2904BA,LM158, LM258, LM358, LM158A, LM258A, LM358A, LM2904V | –32 | 32 | V | ||
LM2904 | –26 | 26 | ||||
Input voltage, VI | Either input | LM358B, LM358BA, LM2904B, LM2904BA | –0.3 | 40 | V | |
LM158, LM258, LM358, LM158A, LM258A, LM358A, LM2904V | –0.3 | 32 | ||||
LM2904 | –0.3 | 26 | ||||
Duration of output short circuit (one amplifier) to ground at (or below) TA = 25°C, VS ≤ 15 V(3) | Unlimited | s | ||||
LM158, LM158A | –55 | 125 | °C | |||
LM258, LM258A | –25 | 85 | ||||
LM358B, LM358BA | –40 | 85 | ||||
LM358, LM358A | 0 | 70 | ||||
LM2904B, LM2904BA, LM2904, LM2904V | –40 | 125 | ||||
Operating virtual-junction temperature, TJ | 150 | °C | ||||
Storage temperature, Tstg | –65 | 150 | °C |
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings only, and do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
Differential voltages are at IN+, with respect to IN−.
Short circuits from outputs to VS can cause excessive heating and eventual destruction.
VALUE | UNIT | ||
LM358B, LM358BA, LM2904B, AND LM2904BA | |||
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) | ±2000 | V | |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±1000 | ||
LM158, LM258, LM358, LM158, LM258A, LM358A, LM2904, AND LM2904V | |||
V(ESD) Electrostatic discharge | Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001 (1) | ±500 | V |
Charged-device model (CDM), per JEDEC specification JESD22-C101(2) | ±1000 |
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
Recommended Operating Conditions
over operating ambient temperature range (unless otherwise noted)
MAX | UNIT | ||||
Supply voltage, VS= ([V+] – [V–]) | LM358B, LM358BA, LM2904B, LM2904BA | 3 | 36 | V | |
LM158, LM258, LM358, LM158A, LM258A, LM358A, LM2904V | 3 | 30 | |||
LM2904 | 3 | 26 | |||
VCM | Common-mode voltage | V– | V+ – 2 | V | |
TA | Operating ambient temperature | LM358B, LM358BA | –40 | 85 | °C |
LM2904B, LM2904BA, LM2904, LM2904V | –40 | 125 | |||
LM358, LM358A | 0 | 70 | |||
LM258, LM258A | –20 | 85 | |||
LM158, LM158A | –55 | 125 |
LM258, LM258A, LM358, LM358A, LM358B, LM358BA, LM2904, LM2904B, LM2904BA, LM2904V (2) | LM158, LM158A | UNIT | |||||||
D (SOIC) | DGK (VSSOP) | P (PDIP) | PS (SO) | PW (TSSOP) | FK (LCCC) | JG (CDIP) | |||
8 PINS | 8 PINS | 8 PINS | 8 PINS | 8 PINS | 20 PINS | 8 PINS | |||
RθJA | Junction-to-ambient thermal resistance | 124.7 | 181.4 | 80.9 | 116.9 | 171.7 | 84.0 | 112.4 | °C/W |
RθJC(top) | Junction-to-case (top) thermal resistance | 66.9 | 69.4 | 70.4 | 62.5 | 68.8 | 56.9 | 63.6 | °C/W |
RθJB | Junction-to-board thermal resistance | 67.9 | 102.9 | 57.4 | 68.6 | 99.2 | 57.5 | 100.3 | °C/W |
ψJT | Junction-to-top characterization parameter | 19.2 | 11.8 | 40 | 21.9 | 11.5 | 51.7 | 35.7 | °C/W |
ψJB | Junction-to-board characterization parameter | 67.2 | 101.2 | 56.9 | 67.6 | 97.9 | 57.1 | 93.3 | °C/W |
RθJC(bot) | Junction-to-case (bottom) thermal resistance | — | — | — | — | — | 10.6 | 22.3 | °C/W |
Electrical Characteristics: LM358B and LM358BA
VS = (V+) – (V–) = 5 V - 36 V (±2.5 V - ±18 V), TA = 25°C, VCM = VOUT = VS/2, RL = 10k connected to VS/2
(unless otherwise noted)
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |||
OFFSET VOLTAGE | ||||||||
VOS | Input offset voltage | LM358B | ±0.3 | ±3.0 | mV | |||
TA = –40°C to +85°C | ±4 | mV | ||||||
LM358BA | ±2.0 | mV | ||||||
TA = –40°C to +85°C | ±2.5 | mV | ||||||
dVOS/dT | Input offset voltage drift | TA = -40°C to +85°C(1) | ±3.5 | 11 | µV/°C | |||
PSRR | Power Supply Rejection Ratio | ±2 | 15 | µV/V | ||||
Channel separation, dc | f = 1 kHz to 20 kHz | ±1 | µV/V | |||||
INPUT VOLTAGE RANGE | ||||||||
VCM | Common-mode voltage range | VS = 3 V to 36 V | (V–) | (V+) – 1.5 | V | |||
VS = 5 V to 36 V | TA = –40°C to +85°C | (V–) | (V+) – 2 | V | ||||
CMRR | Common-mode rejection ratio | (V–) ≤ VCM ≤ (V+) – 1.5 V | VS = 3 V to 36 V | 20 | 100 | µV/V | ||
(V–) ≤ VCM ≤ (V+) – 2.0 V | VS = 5 V to 36 V | TA = –40°C to +85°C | 25 | 316 | ||||
INPUT BIAS CURRENT | ||||||||
IB | Input bias current | ±10 | ±35 | nA | ||||
TA = –40°C to +85°C(1) | ±50 | nA | ||||||
IOS | Input offset current | 0.5 4 | nA | |||||
TA = –40°C to +85°C(1) | 5 | nA | ||||||
dIOS/dT | Input offset current drift | TA = –40°C to +85°C | 10 | pA/℃ | ||||
NOISE | ||||||||
En | Input voltage noise | f = 0.1 to 10 Hz | 3 | µVPP | ||||
en | Input voltage noise density | f = 1 kHz | 40 | nV/√/Hz | ||||
INPUT IMPEDANCE | ||||||||
ZID | Differential | 10 || 0.1 | MΩ|| pF | |||||
ZIC | Common-mode | 4 || 1.5 | GΩ|| pF | |||||
OPEN-LOOP GAIN | ||||||||
AOL | Open-loop voltage gain | VS = 15 V; VO = 1 V to 11 V; RL ≥ 10 kΩ, connected to (V-) | 70 | 140 | V/mV | |||
TA = –40°C to +85°C | 35 | V/mV | ||||||
FREQUENCY RESPONSE | ||||||||
GBW | Gain bandwidth product | 1.2 | MHz | |||||
SR | Slew rate | G = + 1 | 0.5 | V/µs | ||||
Θm | Phase margin | G = + 1, RL = 10kΩ, CL = 20 pF | 56 | ° | ||||
tOR | Overload recovery time | VIN × gain > VS | 10 | µs | ||||
ts | Settling time | To 0.1%, VS = 5 V, 2-V Step , G = +1, CL = 100 pF | 4 | µs | ||||
THD+N | Total harmonic distortion + noise | G = + 1, f = 1 kHz, VO = 3.53 VRMS, VS = 36V, RL = 100k, IOUT ≤ ±50µA, BW = 80 kHz | 0.001 | % | ||||
OUTPUT | ||||||||
VO | Voltage output swing from rail | Positive Rail (V+) | IOUT = 50 µA | 1.35 | 1.42 | V | ||
IOUT = 1 mA | 1.4 | 1.48 | V | |||||
IOUT = 5 mA(1) | 1.5 | 1.61 | V | |||||
Negative Rail (V-) | IOUT = 50 µA | 100 | 150 | mV | ||||
IOUT = 1 mA | 0.75 1 | V | ||||||
VS = 5 V, RL ≤ 10 kΩ connected to (V–) | TA = –40°C to +85°C | 5 | 20 | mV | ||||
IO | Output current | VS = 15 V; VO = V-; VID = 1 V | Source(1) | -20 | -30 | mA | ||
TA = –40°C to +85°C | -10 | |||||||
VS = 15 V; VO = V+; VID = -1 V | Sink(1) | 10 | 20 | |||||
TA = –40°C to +85°C | 5 | |||||||
VID = -1 V; VO = (V-) + 200 mV | 60 | 100 | μA | |||||
ISC | Short-circuit current | VS = 20 V, (V+) = 10 V, (V-) = -10 V, VO = 0 V | ±40 | ±60 | mA | |||
CLOAD | Capacitive load drive | 100 | pF | |||||
RO | Open-loop output resistance | f = 1 MHz, IO = 0 A | 300 | Ω | ||||
POWER SUPPLY | ||||||||
IQ | Quiescent current per amplifier | VS = 5 V; IO = 0 A | TA = –40°C to +85°C | 300 | 460 | µA | ||
IQ | Quiescent current per amplifier | VS = 36 V; IO = 0 A | 800 | µA |
(1) Specified by characterization only
Electrical Characteristics: LM2904B and LM2904B
VS = (V+) – (V–) = 5 V - 36 V (±2.5 V - ±18 V), TA = 25°C, VCM = VOUT = VS/2, RL = 10k connected to VS/2
(unless otherwise noted)
PARAMETER | TEST CONDITIONS | MIN | TYP | MAX | UNIT | |||
OFFSET VOLTAGE | ||||||||
VOS | Input offset voltage | LM2904B | ±0.3 | ±3.0 | mV | |||
TA = –40°C to +125°C | ±4 | mV | ||||||
LM2904BA | ±2.0 | mV | ||||||
TA = –40°C to +125°C | ±2.5 | mV | ||||||
dVOS/dT | Input offset voltage drift | TA = –40°C to +125°C(1) | ±3.5 | 12 | µV/°C | |||
PSRR | Power Supply Rejection Ratio | ±2 | 15 | µV/V | ||||
Channel separation, dc | f = 1 kHz to 20 kHz | ±1 | µV/V | |||||
INPUT VOLTAGE RANGE | ||||||||
VCM | Common-mode voltage range | VS = 3 V to 36 V | (V–) | (V+) – 1.5 | V | |||
VS = 5 V to 36 V | TA = –40°C to +125°C | (V–) | (V+) – 2 | V | ||||
CMRR | Common-mode rejection ratio | (V–) ≤ VCM ≤ (V+) – 1.5 V | VS = 3 V to 36 V | 20 | 100 | µV/V | ||
(V–) ≤ VCM ≤ (V+) – 2.0 V | VS = 5 V to 36 V | TA = –40°C to +125°C | 25 | 316 | ||||
INPUT BIAS CURRENT | ||||||||
IB | Input bias current | ±10 | ±35 | nA | ||||
TA = –40°C to +125°C(1) | ±50 | nA | ||||||
IOS | Input offset current | 0.5 4 | nA | |||||
TA = –40°C to +125°C(1) | 5 | nA | ||||||
dIOS/dT | Input offset current drift | TA = –40°C to +125°C | 10 | pA/℃ | ||||
NOISE | ||||||||
En | Input voltage noise | f = 0.1 to 10 Hz | 3 | µVPP | ||||
en | Input voltage noise density | f = 1 kHz | 40 | nV/√/Hz | ||||
INPUT IMPEDANCE | ||||||||
ZID | Differential | 10 || 0.1 | MΩ|| pF | |||||
ZIC | Common-mode | 4 || 1.5 | GΩ|| pF | |||||
OPEN-LOOP GAIN | ||||||||
AOL | Open-loop voltage gain | VS = 15 V; VO = 1 V to 11 V; RL ≥ 10 kΩ, connected to (V-) | 70 | 140 | V/mV | |||
TA = –40°C to +125°C | 35 | V/mV | ||||||
FREQUENCY RESPONSE | ||||||||
GBW | Gain bandwidth product | 1.2 | MHz | |||||
SR | Slew rate | G = + 1 | 0.5 | V/µs | ||||
Θm | Phase margin | G = + 1, RL = 10kΩ, CL = 20 pF | 56 | ° | ||||
tOR | Overload recovery time | VIN × gain > VS | 10 | µs | ||||
ts | Settling time | To 0.1%, VS = 5 V, 2-V Step , G = +1, CL = 100 pF | 4 | µs | ||||
THD+N | Total harmonic distortion + noise | G = + 1, f = 1 kHz, VO = 3.53 VRMS, VS = 36V, RL = 100k, IOUT ≤ ±50µA, BW = 80 kHz | 0.001 | % | ||||
OUTPUT | ||||||||
VO | Voltage output swing from rail | Positive Rail (V+) | IOUT = 50 µA | 1.35 | 1.42 | V | ||
IOUT = 1 mA | 1.4 | 1.48 | V | |||||
IOUT = 5 mA(1) | 1.5 | 1.61 | V | |||||
Negative Rail (V-) | IOUT = 50 µA | 100 | 150 | mV | ||||
IOUT = 1 mA | 0.75 1 | V | ||||||
VS = 5 V, RL ≤ 10 kΩ connected to (V–) | TA = –40°C to +125°C | 5 | 20 | mV | ||||
IO | Output current | VS = 15 V; VO = V-; VID = 1 V | Source(1) | -20 | -30 | mA | ||
TA = –40°C to +125°C | -10 | |||||||
VS = 15 V; VO = V+; VID = -1 V | Sink(1) | 10 | 20 | |||||
TA = –40°C to +125°C | 5 | |||||||
VID = -1 V; VO = (V-) + 200 mV | 60 | 100 | μA | |||||
ISC | Short-circuit current | VS = 20 V, (V+) = 10 V, (V-) = -10 V, VO = 0 V | ±40 | ±60 | mA | |||
CLOAD | Capacitive load drive | 100 | pF | |||||
RO | Open-loop output resistance | f = 1 MHz, IO = 0 A | 300 | Ω | ||||
POWER SUPPLY | ||||||||
IQ | Quiescent current per amplifier | VS = 5 V; IO = 0 A | TA = –40°C to +125°C | 300 | 460 | µA | ||
IQ | Quiescent current per amplifier | VS = 36 V; IO = 0 A | 800 | µA |
(1) Specified by characterization only
Electrical Characteristics: LM358, LM358A
For VS = (V+) – (V–) = 5 V, TA = 25 °C, (unless otherwise noted)
PARAMETER | TEST CONDITIONS(1) | MIN | TYP(2) | MAX | UNIT | |||
OFFSET VOLTAGE | ||||||||
VOS | Input offset voltage | VS = 5 V to 30 V; VCM = 0 V; VO = 1.4 V | LM358 | 3 | 7 | mV | ||
TA = 0°C to 70°C | 9 | |||||||
LM358A | 2 | 3 | ||||||
TA = 0°C to 70°C | 5 | |||||||
dVOS/dT | Input offset voltage drift | LM358 | TA = 0°C to 70°C | 7 | µV/°C | |||
LM358A | TA = 0°C to 70°C | 7 | 20 | |||||
PSRR | Input offset voltage vs power supply (ΔVIO/ΔVS) | VS = 5 V to 30 V | 65 | 100 | dB | |||
VO1/ VO2 | Channel separation | f = 1 kHz to 20 kHz | 120 | dB | ||||
INPUT VOLTAGE RANGE | ||||||||
VCM | Common-mode voltage range | VS = 5 V to 30 V | LM358 | (V–) | (V+) – 1.5 | V | ||
VS = 30 V | LM358A | |||||||
VS = 5 V to 30 V | LM358 | TA = 0°C to 70°C | (V–) | (V+) – 2 | ||||
VS = 30 V | LM358A | |||||||
CMRR | Common-mode rejection ratio | VS = 5 V to 30 V; VCM = 0 V | 65 | 80 | dB | |||
INPUT BIAS CURRENT | ||||||||
IB | Input bias current | VO = 1.4 V | LM358 | –20 | –250 | nA | ||
TA = 0°C to 70°C | –500 | |||||||
LM358A | –15 | –100 | ||||||
TA = 0°C to 70°C | –200 | |||||||
IOS | Input offset current | VO = 1.4 V | LM358 | 2 | 50 | nA | ||
TA = 0°C to 70°C | 150 | |||||||
LM358A | 2 | 30 | ||||||
TA = 0°C to 70°C | 75 | |||||||
dIOS/dT | Input offset current drift | 10 | pA/°C | |||||
LM358A | TA = 0°C to 70°C | 300 | ||||||
NOISE | ||||||||
en | Input voltage noise density | f = 1 kHz | 40 | nV/√Hz | ||||
OPEN-LOOP GAIN | ||||||||
AOL | Open-loop voltage gain | VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ | 25 | 100 | V/mV | |||
TA = 0°C to 70°C | 15 | |||||||
FREQUENCY RESPONSE | ||||||||
GBW | Gain bandwidth product | 0.7 | MHz | |||||
SR | Slew rate | G = +1 | 0.3 | V/µs | ||||
OUTPUT | ||||||||
VO | Voltage output swing from rail | Positive rail | VS = 30 V; RL = 2 kΩ | TA = 0°C to 70°C | 4 | V | ||
VS = 30 V; RL ≥ 10 kΩ | 2 | 3 | ||||||
VS = 5 V; RL ≥ 2 kΩ | 1.5 | |||||||
Negative rail | VS = 5 V; RL ≤ 10 kΩ | TA = 0°C to 70°C | 5 | 20 | mV | |||
IO | Output current | VS = 15 V; VO = 0 V; VID = 1 V | Source | –20 | –30 | mA | ||
LM358A | –60 | |||||||
TA = 0°C to 70°C | –10 | |||||||
VS = 15 V; VO = 15 V; VID = –1 V | Sink | 10 | 20 | |||||
TA = 0°C to 70°C | 5 | |||||||
VID = –1 V; VO = 200 mV | 12 | 30 | µA | |||||
ISC | Short-circuit current | VS = 10 V; VO = VS / 2 | ±40 | ±60 | mA | |||
POWER SUPPLY | ||||||||
IQ | Quiescent current per amplifier | VO = 2.5 V; IO = 0 A | TA = 0°C to 70°C | 350 | 600 | µA | ||
VS = 30 V; VO = 15 V; IO = 0 A | 500 | 1000 |
All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. Maximum VS for testing purposes is 30 V for LM358 and LM358A.
All typical values are TA = 25°C.
Electrical Characteristics: LM2904, LM2904V
For VS = (V+) – (V–) = 5 V, TA = 25 °C, (unless otherwise noted)
PARAMETER | TEST CONDITIONS(1) | MIN | TYP (2) | MAX | UNIT | |||||
OFFSET VOLTAGE | ||||||||||
VOS | Input offset voltage | VS = 5 V to maximum; VCM = 0 V; VO = 1.4 V | Non-A suffix devices | 3 | 7 | mV | ||||
TA = –40°C to 125°C | 10 | |||||||||
A-suffix devices | 1 | 2 | ||||||||
TA = –40°C to 125°C | 4 | |||||||||
dVOS/dT | Input offset voltage drift | TA = –40°C to 125°C | 7 | µV/°C | ||||||
PSRR | Input offset voltage vs power supply (ΔVIO/ΔVS) | VS = 5 V to 30 V | 65 | 100 | dB | |||||
VO1/ VO2 Channel separation | f = 1 kHz to 20 kHz | 120 | dB | |||||||
INPUT VOLTAGE RANGE | ||||||||||
VCM | Common-mode voltage range | VS = 5 V to maximum | (V–) | (V+) – 1.5 | V | |||||
TA = –40°C to 125°C | (V–) | (V+) – 2 | ||||||||
CMRR | Common-mode rejection ratio | VS = 5 V to maximum; VCM = 0 V | 65 | 80 | dB | |||||
INPUT BIAS CURRENT | ||||||||||
IB | Input bias current | VO = 1.4 V | –20 | –250 | nA | |||||
TA = –40°C to 125°C | –500 | |||||||||
IOS | Input offset current | VO = 1.4 V | Non-V suffix device | 2 | 50 | nA | ||||
TA = –40°C to 125°C | 300 | |||||||||
V-suffix device | 2 | 50 | ||||||||
TA = –40°C to 125°C | 150 | |||||||||
dIOS/dT | Input offset current drift | TA = –40°C to 125°C | 10 | pA/°C | ||||||
NOISE | ||||||||||
en | Input voltage noise density | f = 1 kHz | 40 | nV/√Hz | ||||||
OPEN-LOOP GAIN | ||||||||||
AOL | Open-loop voltage gain | VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ | 25 | 100 | V/mV | |||||
TA = –40°C to 125°C | 15 | |||||||||
FREQUENCY RESPONSE | ||||||||||
GBW | Gain bandwidth product | 0.7 | MHz | |||||||
SR | Slew rate | G = +1 | 0.3 | V/µs | ||||||
OUTPUT | ||||||||||
VO | Voltage output swing from rail | Positive rail | RL ≥ 10 kΩ | VS – 1.5 | V | |||||
Non-V suffix device | VS = maximum; RL = 2 kΩ | TA = –40°C to 125°C | 4 | |||||||
VS = maximum; RL ≥ 10 kΩ | 2 | 3 | ||||||||
V-suffix device | VS = maximum; RL = 2 kΩ | 6 | ||||||||
VS = maximum; RL ≥ 10 kΩ | 4 | 5 | ||||||||
Negative rail | VS = 5 V; RL ≤ 10 kΩ | TA = –40°C to 125°C | 5 | 20 | mV | |||||
IO | Output current | VS = 15 V; VO = 0 V; VID = 1 V | Source | –20 | –30 | mA | ||||
TA = –40°C to 125°C | –10 | |||||||||
VS = 15 V; VO = 15 V; VID = –1 V | Sink | 10 | 20 | |||||||
TA = –40°C to 125°C | 5 | |||||||||
VID = -1 V; VO = 200 mV | Non-V suffix device | 30 | µA | |||||||
V-suffix device | 12 | 40 | ||||||||
ISC | Short-circuit current | VS = 10 V; VO = VS / 2 | ±40 | ±60 | mA | |||||
POWER SUPPLY | ||||||||||
IQ | Quiescent current per amplifier | VO = 2.5 V; IO = 0 A | TA = –40°C to 125°C | 350 | 600 | µA | ||||
VS = maximum; VO = maximum / 2; IO = 0 A | 500 | 1000 |
All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. Maximum VS for testing purposes is 26 V for LM2904 and 32 V for LM2904V.
All typical values are TA = 25°C.
Electrical Characteristics: LM158, LM158A
For VS = (V+) – (V–) = 5 V, TA = 25 °C, (unless otherwise noted)
PARAMETER | TEST CONDITIONS(1) | MIN | TYP(2) | MAX | UNIT | |||
OFFSET VOLTAGE | ||||||||
VOS | Input offset voltage | VS = 5 V to 30 V; VCM = 0 V; VO = 1.4 V | LM158 | 3 | 5 | mV | ||
TA = –55°C to 125°C | 7 | |||||||
LM158A | 2 | |||||||
TA = –55°C to 125°C | 4 | |||||||
dVOS/dT Input offset voltage drift | LM158 | TA = –55°C to 125°C | 7 | µV/°C | ||||
LM158A | TA = –55°C to 125°C | 7 | 15(3) | |||||
PSRR | Input offset voltage vs power supply (ΔVIO/ΔVS) | VS = 5 V to 30 V | 65 | 100 | dB | |||
VO1/ VO2 Channel separation | f = 1 kHz to 20 kHz | 120 | dB | |||||
INPUT VOLTAGE RANGE | ||||||||
VCM | Common-mode voltage range | VS = 5 V to 30 V | LM158 | (V–) | (V+) – 1.5 | V | ||
VS = 30 V | LM158A | |||||||
VS = 5 V to 30 V | LM158 | TA = –55°C to 125°C | (V–) | (V+) – 2 | ||||
VS = 30 V | LM158A | |||||||
CMRR | Common-mode rejection ratio | VS = 5 V to 30 V; VCM = 0 V | 70 | 80 | dB | |||
INPUT BIAS CURRENT | ||||||||
IB | Input bias current | VO = 1.4 V | LM158 | –20 | –150 | nA | ||
TA = –55°C to 125°C | –300 | |||||||
LM158A | –15 | –50 | ||||||
TA = –55°C to 125°C | –100 | |||||||
IOS | Input offset current | VO = 1.4 V | LM158 | 2 | 30 | nA | ||
TA = –55°C to 125°C | 100 | |||||||
LM158A | 2 | 10 | ||||||
TA = –55°C to 125°C | 30 | |||||||
dIOS/dT | Input offset current drift | 10 | pA/°C | |||||
LM158A | TA = –55°C to 125°C | 200 | ||||||
NOISE | ||||||||
en | Input voltage noise density | f = 1 kHz | 40 | nV/√Hz | ||||
OPEN-LOOP GAIN | ||||||||
AOL | Open-loop voltage gain | VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ | 50 | 100 | V/mV | |||
TA = –55°C to 125°C | 25 | |||||||
FREQUENCY RESPONSE | ||||||||
GBW | Gain bandwidth product | 0.7 | MHz | |||||
SR | Slew rate | G = +1 | 0.3 | V/µs | ||||
OUTPUT | ||||||||
VO | Voltage output swing from rail | Positive rail | VS = 30 V; RL = 2 kΩ | TA = –55°C to 125°C | 4 | V | ||
VS = 30 V; RL ≥ 10 kΩ | 2 | 3 | ||||||
VS = 5 V; RL ≥ 2 kΩ | 1.5 | |||||||
Negative rail | VS = 5 V; RL ≤ 10 kΩ | TA = –55°C to 125°C | 5 | 20 | mV | |||
IO | Output current | VS = 15 V; VO = 0 V; VID = 1 V | Source | –20 | –30 | mA | ||
LM158A | –60 | |||||||
TA = –55°C to 125°C | –10 | |||||||
VS = 15 V; VO = 15 V; VID = –1 V | Sink | 10 | 20 | |||||
TA = –55°C to 125°C | 5 | |||||||
VID = –1 V; VO = 200 mV | 12 | 30 | µA | |||||
ISC | Short-circuit current | VS = 10 V; VO = VS / 2 | ±40 | ±60 | mA | |||
POWER SUPPLY | ||||||||
IQ | Quiescent current per amplifier | VO = 2.5 V; IO = 0 A | TA = –55°C to 125°C | 350 | 600 | µA | ||
VS = 30 V; VO = 15 V; IO = 0 A | 500 | 1000 |
All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. Maximum VS for testing purposes is 30 V for LM158 and LM158A.
All typical values are TA = 25°C.
On products compliant to MIL-PRF-38535, this parameter is not production tested.
Electrical Characteristics: LM258, LM258A
For VS = (V+) – (V–) = 5 V, TA = 25 °C, (unless otherwise noted)
PARAMETER | TEST CONDITIONS(1) | MIN | TYP(2) | MAX | UNIT | |||
OFFSET VOLTAGE | ||||||||
VOS | Input offset voltage | VS = 5 V to 30 V; VCM = 0 V; VO = 1.4 V | LM258 | 3 | 5 | mV | ||
TA = –25°C to 85°C | 7 | |||||||
LM258A | 2 | 3 | ||||||
TA = –25°C to 85°C | 4 | |||||||
dVOS/dT Input offset voltage drift | LM258 | TA = –25°C to 85°C | 7 | µV/°C | ||||
LM258A | 7 | 15 | ||||||
PSRR | Input offset voltage vs power supply (ΔVIO/ΔVS) | VS = 5 V to 30 V | 65 | 100 | dB | |||
VO1/ VO2 Channel separation | f = 1 kHz to 20 kHz | 120 | dB | |||||
INPUT VOLTAGE RANGE | ||||||||
VCM | Common-mode voltage range | VS = 5 V to 30 V | LM258 | (V–) | (V+) – 1.5 | V | ||
VS = 30 V | LM258A | |||||||
VS = 5 V to 30 V | LM258 | TA = –25°C to 85°C | (V–) | (V+) – 2 | ||||
VS = 30 V | LM258A | |||||||
CMRR | Common-mode rejection ratio | VS = 5 V to 30 V; VCM = 0 V | 70 | 80 | dB | |||
INPUT BIAS CURRENT | ||||||||
IB | Input bias current | VO = 1.4 V | LM258 | –20 | –150 | nA | ||
TA = –25°C to 85°C | –300 | |||||||
LM258A | –15 | –80 | ||||||
TA = –25°C to 85°C | –100 | |||||||
IOS | Input offset current | VO = 1.4 V | LM258 | 2 | 30 | nA | ||
TA = –25°C to 85°C | 100 | |||||||
LM258A | 2 | 15 | ||||||
TA = –25°C to 85°C | 30 | |||||||
dIOS/dT | Input offset current drift | 10 | pA/°C | |||||
LM258A | TA = –25°C to 85°C | 200 | ||||||
NOISE | ||||||||
en | Input voltage noise density | f = 1 kHz | 40 | nV/√Hz | ||||
OPEN-LOOP GAIN | ||||||||
AOL | Open-loop voltage gain | VS = 15 V; VO = 1 V to 11 V; RL ≥ 2 kΩ | 50 | 100 | V/mV | |||
TA = –25°C to 85°C | 25 | |||||||
FREQUENCY RESPONSE | ||||||||
GBW | Gain bandwidth product | 0.7 | MHz | |||||
SR | Slew rate | G = +1 | 0.3 | V/µs | ||||
OUTPUT | ||||||||
VO | Voltage output swing from rail | Positive rail | VS = 30 V; RL = 2 kΩ | TA = –25°C to 85°C | 4 | V | ||
VS = 30 V; RL ≥ 10 kΩ | 2 | 3 | ||||||
VS = 5 V; RL ≥ 2 kΩ | 1.5 | |||||||
Negative rail | VS = 5 V; RL ≤ 10 kΩ | TA = –25°C to 85°C | 5 | 20 | mV | |||
IO | Output current | VS = 15 V; VO = 0 V; VID = 1 V | Source | –20 | –30 | mA | ||
LM258A | –60 | |||||||
TA = –25°C to 85°C | –10 | |||||||
VS = 15 V; VO = 15 V; VID = –1 V | Sink | 10 | 20 | |||||
TA = –25°C to 85°C | 5 | |||||||
VID = –1 V; VO = 200 mV | 12 | 30 | µA | |||||
ISC | Short-circuit current | VS = 10 V; VO = VS / 2 | ±40 | ±60 | mA | |||
POWER SUPPLY | ||||||||
Quiescent current per amplifier | VO = 2.5 V; IO = 0 A | TA = –25°C to 85°C | 350 | 600 | µA | |||
VS = 30 V; VO = 15 V; IO = 0 A | 500 | 1000 |
All characteristics are measured under open-loop conditions, with zero common-mode input voltage, unless otherwise specified. Maximum VS for testing purposes is 30 V for LM258 and LM258A.
All typical values are TA = 25°C.
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
20
18
16
Amplifiers (%)
14
12
10
8
6
4
2
0
-1800 -1200 -600 0 600 1200 1800
30
27
24
Amplifiers (%)
21
18
15
12
9
6
3
0
0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 2.75
Offset Voltage (µV)
DC11 Offset Voltage Drift (µV/°C)
DC12
Figure 1. Offset Voltage Production Distribution Figure 2. Offset Voltage Drift Distribution
750 500
450 300
Offset Voltage (µV)
Offset Voltage (µV)
150 100
-150 -100
-450 -300
-750
-40 -20 0 20 40 60 80 100 120
-500
-18 -12 -6 0 6 12 17
Temperature (°C)
DC10 Common-Mode Voltage (V)
DC10
Figure 3. Offset Voltage vs Temperature Figure 4. Offset Voltage vs Common-Mode Voltage
Open Loop Voltage Gain (dB)
80 | 90 | ||||||||
70 | 80 | ||||||||
60 | 70 | ||||||||
50 | 60 | ||||||||
40 | 50 | ||||||||
30 | 40 | ||||||||
20 | 30 |
90 100
Phase ()
10 20
0 10
70
G = 1
G = 10
G = 100
Closed Lopp Voltage Gain (dB)
60
G = 1000
50
G = –1
40
30
20
10
0
-10
-10 Gain (dB)
Phase (°)
0 -20
-20 -10
1k 10k 100k 1M
-30
1k 10k 100k 1M
Frequency (Hz)
D012
Frequency (Hz)
D017
Figure 5. Open-Loop Gain and Phase vs Frequency Figure 6. Closed-Loop Gain vs Frequency
Typical Characteristics (continued)
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
IB+ IB–
-5
Input Bias Current (nA)
-7.5
-10
-12.5
-15
-20 -15 -10 -5 0 5 10 15 20
120
100
Input Offset Current (pA)
80
60
40
20
0
-20
-40
-20 -15 -10 -5 0 5 10 15 20
Common-Mode Voltage (V)
DC3I
Common-Mode Voltage (V)
DC3I
-6
Input Bias Current (nA)
-7
-8
-9
-10
-11
Figure 7. Input Bias Current vs Common-Mode Voltage Figure 8. Input Offset Current vs Common-Mode Voltage
IB+ IB– | |||||
0.06
Input Offset Current (nA)
0.045
0.03
0.015
0
-0.015
-12
-40 -10 20 50 80 110 130
-0.03
-40 -10 20 50 80 110 130
Temperature (°C)
DCIB
Temperature (°C)
DCIO
V+
Output Voltage (V)
(V+) – 3 V
(V+) – 6 V
(V+) – 9 V
Figure 9. Input Bias Current vs Temperature Figure 10. Input Offset Current vs Temperature
–40C 25C 125C | |||||||
(V–) + 18 V
(V–) + 15 V
Output Voltage (V)
(V–) + 12 V
(V–) + 9 V
(V–) + 6 V
–40C 25C
125C
(V–) + 3 V
(V+) – 12 V
0 10 20 30 40 50
V–
0 5 10 15 20 25 30 35 40
Output Current (mA)
DC13
Output Current (mA)
DC1-
Figure 11. Output Voltage Swing vs Output Current (Sourcing)
Figure 12. Output Voltage Swing vs Output Current (Sinking)
Typical Characteristics (continued)
PSRR+
PSRR-
CMRR
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
100
90
PSRR and CMRR (dB)
80
70
60
50
40
30
20
10
0
1k 10k 100k 1M
120
Common-Mode Rejection Ratio (dB)
VS = 36V VS = 5V | |||||
115
110
105
100
95
90
85
-40 -10 20 50 80 110 130
Frequency (Hz)
D00
Temperature (°C)
DC2_
Figure 13. CMRR and PSRR vs Frequency Figure 14. Common-Mode Rejection Ratio vs Temperature (dB)
Power Supply Rejection Ratio (dB)
-118
-119
-120
-121
-122
-123
-40 -20 0 20 40 60 80 100 120 140
1.6
1.2
0.8
Voltage (µV)
0.4
0
-0.4
-0.8
-1.2
-1.6
-2
0 1 2 3 4 5 6 7 8 9 10
Voltage Noise Spectral Density (nV/✓Hz)
100
Temperature (°C)
VS = 5 V to 36 V
Figure 15. Power Supply Rejection Ratio vs Temperature (dB)
DC8_ Time (s)
Figure 16. 0.1-Hz to 10-Hz Noise
-32
D011
90
80
70
60
50
40
30
20
10
0
10 100 1k 10k 100k
10 k
-40 2 k
-48
THD+N (dB)
-56
-64
-72
-80
-88
-96
-104
-112
100 1k 10k
Frequency (Hz)
Frequency (Hz)
D010
G = 1, f = 1 kHz, BW = 80 kHz,
VOUT = 10 VPP, RL connected to V–
D013
Figure 17. Input Voltage Noise Spectral Density vs Frequency
Figure 18. THD+N Ratio vs Frequency, G = 1
Typical Characteristics (continued)
10 k
2 k
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
-32
-40
-48
THD+N (dB)
-56
-64
-72
-80
-88
-96
-104
100 1k 10k
-30
-40
-50
THD+N (dB)
-60
-70
-80
-90
10 k
2 k
-100
-110
-120
0.001 0.01 0.1 1 10 20
-20
Frequency (Hz)
G = –1, f = 1 kHz, BW = 80 kHz,
VOUT = 10 VPP, RL connected to V–
Figure 19. THD+N Ratio vs Frequency, G = –1
D014
460
Amplitude (VPP)
G = 1, f = 1 kHz, BW = 80 kHz,
RL connected to V–
Figure 20. THD+N vs Output Amplitude, G = 1
D015
-35
THD+N (dB)
-50
-65
-80
-95
430
Quiescent Current (µA)
400
370
340
310
10 k
2 k
-110
0.001 0.01 0.1 1 10 20
280
3 9 15 21 27 33 36
Amplitude (VPP)
G = –1, f = 1 kHz, BW = 80 kHz,
RL connected to V–
D016
Supply Voltage (V)
DC_S
Figure 21. THD+N vs Output Amplitude, G = –1 Figure 22. Quiescent Current vs Supply Voltage
Quiescent Current per Amplifier (µA)
VS = 36V VS = 5V | |||||||||
600 500
Open Loop Output Impedance ()
540
400
480
420 300
360
200
300
240
-40 -20 0 20 40 60 80 100 120
100
1k 10k 100k 1M
Temperature (°C)
DC4_
Frequency (Hz)
D006
Figure 23. Quiescent Current vs Temperature Figure 24. Open-Loop Output Impedance vs Frequency
Typical Characteristics (continued)
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
Overshoot (+) Overshoot (-) | ||||||||
44
40
36
Overshoot (%)
32
28
24
20
16
12
8
0 40 80 120 160 200 240 280 320 360
18
Overshoot (+)
Overshoot (–)
16
14
Overshoot (%)
12
10
8
6
4
2
0
40 80 120 160 200 240 280 320 360
Capacitance load (pF)
G = 1, 100-mV output step, RL = open
D019
Capacitance load (pF)
G = –1, 100-mV output step, RL = open
D020
Figure 25. Small-Signal Overshoot vs Capacitive Load
60
57
54
Phase Margin (°)
51
48
45
42
39
36
33
30
0 40 80 120 160 200 240 280 320 360
20
Voltage (V)
10
0
-10
-20
Figure 26. Small-Signal Overshoot vs Capacitive Load
Input Output
0 200 400 600 800 1000
Capacitance Load (pF)
Figure 27. Phase Margin vs Capacitive Load
Input Output | ||||||
10
Time (s)
D018
G = –10
Figure 28. Overload Recovery
Input Output | |||||
10
D021
7.5
5
Voltage (mV)
2.5
0
-2.5
-5
-7.5
7.5
5
Voltage (mV)
2.5
0
-2.5
-5
-7.5
-10
0 20 40 60 80 100
-10
0 20 40 60 80 100
Time (s)
G = 1, RL = open
Figure 29. Small-Signal Step Response, G = 1
D022
Time (s)
G = –1, RL = open, RFB = 10K
Figure 30. Small-Signal Step Response, G = –1
D023
Typical Characteristics (continued)
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
20
Output Delta from Final Value (mV)
16
12
8
4
0
-4
-8
-12
-16
-20
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
40
Output Delta from Final Value (mV)
32
24
16
8
0
-8
-16
-24
-32
-40
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5
Time (s)
G = 1, RL = open
D003 Time (s)
G = 1, RL = open
D004
2.5
2
1.5
1
Votlage (V)
0.5
0
-0.5
-1
-1.5
-2
-2.5
Figure 31. Large-Signal Step Response (Rising)
Output Input | ||||||
0.675
0.625
Slew Rate(V/s)
0.575
0.525
0.475
0.425
Figure 32. Large-Signal Step Response (Falling)
Positive Negative
0 20 40 60 80 100 -40 -25 -10 5 20 35 50 65 80 95 110 125
Time (µs)
G = 1, RL = open
AC_S
Temp(C)
D009
60
Short-Circuit Current (mA)
40
20
0
-20
-40
-60
Figure 33. Large-Signal Step Response Figure 34. Slew Rate vs Temperature
Sinking Sourcing | ||||||||||
15
14
Maximum Output Voltage (VPP)
13
12
11
10
9
8
7
6
5
4
3
2
1
0
-40 -25 -10 5 20 35 50 65 80 95 110 125
1k 10k 100k 1M
Temperature (°C)
DC7_
Frequency (Hz)
VS = 15 V
D005
Figure 35. Short-Circuit Current vs Temperature Figure 36. Maximum Output Voltage vs Frequency
Typical Characteristics (continued)
D007
90
84
78
72
66
60
54
48
42
36
30
24
1M
D008
-135
1k
-125
-115
-105
-95
-85
-75
Channel Separation (dB)
EMIRR (dB)
Typical characteristics section is applicable for LM358B and LM2904B. The typical characteristics data section was taken with TA = 25°C, VS = 36 V (±18 V), VCM = VS / 2, RLOAD = 10 kΩ connected to VS / 2 (unless otherwise noted).
10k
100k
Frequency (Hz)
1M
10M
100M
Frequency (Hz)
1G
Figure 37. Channel Separation vs Frequency
Figure 38. EMIRR (Electromagnetic Interference Rejection Ratio) vs Frequency
Typical characteristics section is applicable for LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and LM2904V.
5Vdc 15Vdc 30Vdc | ||||||||
18
Input Current (nAdc)
16
14
12
10
8
6
4
2
0
–55 –35 –15 5 25 45 65 85 105 125
Temperature (°C)
0.36
0.34
Supply Current (mA)
0.32
0.3
0.28
0.26
0.24
0.22
0.2
–55C 0C 125C | ||||||
0 5 10 15 20 25 30
Supply Voltage (Vdc)
160
140
Avol Voltage Gain (dB)
120
100
80
60
40
20
0
Figure 39. Input Current vs Temperature Figure 40. Supply Current vs Supply Voltage
RL=20K RL=2K | |||||||
CMRR | ||||
100
90
80
70
CMRR (dB)
60
50
40
30
20
10
0
0 5 10 15 20 25 30 35 40 0.1 1 10 100 1000
V+ Supply Voltage (Vdc)
Frequency (kHz)
C001
3.5
3.0
Voltage (V)
2.5
2.0
1.5
1.0
0.5
Figure 41. Voltage Gain vs Supply Voltage Figure 42. Common-Mode Rejection Ratio vs Frequency
VOUT | |||||||||
VOUT |
0.50
0.45
Voltage (V)
0.40
0.35
0.30
0.25
0.0
0 4 8 12 16 20 24 28 32 36 40
0.20
0 2 4 6 8 10
Time (µs)
C001
Time (µs)
C001
Figure 43. Voltage Follower Large Signal Response (50 pF) Figure 44. Voltage Follower Small Signal Response (50 pF)
Typical Characteristics (continued)
85 105 125
65
45
25
5
–55 –35 –15
90
80
70
60
50
40
30
20
10
0
100
10
1
0.1
0.01
0.001 0.01
0.1
1
5Vdc
15Vdc 30Vdc
10
Output Sink Current (mAdc)
10
Output Voltage (Vdc)
Output Swing (Vp-p)
Output Current (mAdc)
Output Voltage (Vdc) relative to Vcc
Typical characteristics section is applicable for LM158, LM158A, LM258, LM258A, LM358, LM358A, LM2904, and LM2904V.
20
17.5
15
12.5
10
7.5
5
2.5
0
1
100
Frequency (kHz)
1k
8
7
6
5
4
3
2
1
0.001
0.01
0.1
1
10
100
Figure 45. Maximum Output Swing vs Frequency (VCC = 15 V)
Figure 46. Output Sourcing Characteristics
Output Sink Current (mAdc)
Temperature (°C)
Figure 47. Output Sinking Characteristics
Figure 48. Source Current Limiting
VCC+
−
100 Ω
900 Ω
VCC+
VI +
VCC− CL
VO VI = 0 V
RS
RL
−
VO
+
VCC−
Figure 49. Unity-Gain Amplifier Figure 50. Noise-Test Circuit
10 k
VIN
– +18V
+
RL
-18V
GND GND
Figure 51. Test Circuit, G = –1, for THD+N and Small-Signal Step Response
These devices consist of two independent, high-gain frequency-compensated operational amplifiers designed to operate from a single supply over a wide range of voltages. Operation from split supplies also is possible if the difference between the two supplies is within the supply voltage range specified in the Recommended Operating Conditions section, and VS is at least 1.5 V more positive than the input common-mode voltage. The low supply- current drain is independent of the magnitude of the supply voltage.
Applications include transducer amplifiers, dc amplification blocks, and all the conventional operational amplifier circuits that now can be implemented more easily in single-supply-voltage systems. For example, these devices can be operated directly from the standard 5-V supply used in digital systems and easily can provide the required interface electronics without additional ±5-V supplies.
Functional Block Diagram - LM358B, LM358BA, LM2904B, LM2904BA
VCC+
~6 µA Curren t Regula tor
~6 µA Curren t Regula tor
~100 µA Curren t Regula tor
IN-
IN+
~120 µA Curren t Regula tor
OUT
These devices are powered on when the supply is connected. This device can be operated as a single-supply operational amplifier or dual-supply amplifier, depending on the application.
Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component specification, and TI does not warrant its accuracy or completeness. TI’s customers are responsible for determining suitability of components for their purposes. Customers should validate and test their design implementation to confirm system functionality.
A typical application for an operational amplifier is an inverting amplifier. This amplifier takes a positive voltage on the input, and makes it a negative voltage of the same magnitude. In the same manner, it also makes negative voltages positive.
RF
VIN
RI Vsup+
+
Vsup-
VOUT
Figure 52. Application Schematic
The supply voltage must be chosen such that it is larger than the input voltage range and output range. For instance, this application scales a signal of ±0.5 V to ±1.8 V. Setting the supply at ±12 V is sufficient to accommodate this application.
Determine the gain required by the inverting amplifier using Equation 1 and Equation 2:
A V
VIN
(1)
A V
1.8
0.5
3.6
(2)
Once the desired gain is determined, choose a value for RI or RF. [Subscripts should be fixed in the accompanying figures and equations also.] Choosing a value in the kilohm range is desirable because the amplifier circuit uses currents in the milliampere range. This ensures the part does not draw too much current. This example uses 10 kΩ for RI which means 36 kΩ is used for RF. This was determined by Equation 3.
A V RI
Typical Application (continued)
2
VIN
1.5
VOUT
1
0.5
Volts
0
-0.5
-1
-1.5
-2
0 0.5 1 1.5 2
Time (ms)
Figure 53. Input and Output Voltages of the Inverting Amplifier
CAUTION
Supply voltages larger than specified in the recommended operating region can permanently damage the device (see the Absolute Maximum Ratings).
For best operational performance of the device, use good PCB layout practices, including:
Noise can propagate into analog circuitry through the power pins of the circuit as a whole, as well as the operational amplifier. Bypass capacitors are used to reduce the coupled noise by providing low-impedance power sources local to the analog circuitry.
– Connect low-ESR, 0.1-µF ceramic bypass capacitors between each supply pin and ground, placed as close to the device as possible. A single bypass capacitor from V+ to ground is applicable for single- supply applications.
Separate grounding for analog and digital portions of circuitry is one of the simplest and most-effective methods of noise suppression. One or more layers on multilayer PCBs are usually devoted to ground planes. A ground plane helps distribute heat and reduces EMI noise pickup. Make sure to physically separate digital and analog grounds, paying attention to the flow of the ground current.
To reduce parasitic coupling, run the input traces as far away from the supply or output traces as possible. If it is not possible to keep them separate, it is much better to cross the sensitive trace perpendicular as opposed to in parallel with the noisy trace. [Things in parallel never cross, by definition]
Place the external components as close to the device as possible. Keeping RF and RG close to the inverting input minimizes parasitic capacitance, as shown in Layout Examples.
Keep the length of input traces as short as possible. Always remember that the input traces are the most sensitive part of the circuit.
Consider a driven, low-impedance guard ring around the critical traces. A guard ring can significantly reduce leakage currents from nearby traces that are at different potentials.
RF
away from the supply lines as possible
Place components close to
device and to each other to reduce parasitic errors
VS+
OUT1
V+
RG
GND
IN1-
OUT2
VIN
IN1+
IN2-
GND
RIN
V-
IN2+
Only needed for
dual-supply operation
Use low-ESR, ceramic
bypass capacitor
GND
Ground (GND) plane on another layer
VS-
(or GND for single supply)
Figure 54. Operational Amplifier Board Layout for Noninverting Configuration
VIN
RIN
+
RG
RF
VOUT
Figure 55. Operational Amplifier Schematic for Noninverting Configuration
Device and Documentation Support
The table below lists quick access links. Categories include technical documents, support and community resources, tools and software, and quick access to order now.
Table 1. Related Links
PRODUCT FOLDER | ORDER NOW | TECHNICAL DOCUMENTS | TOOLS & SOFTWARE | SUPPORT & COMMUNITY | |
LM158 | |||||
LM158A | |||||
LM258 | |||||
LM258A | |||||
LM358 | |||||
LM358A | |||||
LM2904 | |||||
LM2904B | |||||
LM2904V |
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Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms and definitions.
The following pages include mechanical packaging and orderable information. This information is the most- current data available for the designated devices. This data is subject to change without notice and without revision of this document. For browser based versions of this data sheet, see the left-hand navigation pane.
PACKAGING INFORMATION
Orderable Device | Status (1) | Package Type | Package Drawing | Pins | Package Qty | Eco Plan (2) | Lead/Ball Finish (6) | MSL Peak Temp (3) | Op Temp (°C) | Device Marking (4/5) | Samples |
5962-87710012A | ACTIVE | LCCC | FK | 20 | 1 | TBD | POST-PLATE | N / A for Pkg Type | -55 to 125 | 5962- 87710012A LM158FKB | |
5962-8771001PA | ACTIVE | CDIP | JG | 8 | 1 | TBD | Call TI | N / A for Pkg Type | -55 to 125 | 8771001PA LM158 | |
5962-87710022A | ACTIVE | LCCC | FK | 20 | 1 | TBD | POST-PLATE | N / A for Pkg Type | -55 to 125 | 5962- 87710022A LM158AFKB | |
5962-8771002PA | ACTIVE | CDIP | JG | 8 | 1 | TBD | Call TI | N / A for Pkg Type | -55 to 125 | 8771002PA LM158A | |
LM158 MW8 | ACTIVE | WAFERSALE | YS | 0 | 1 | Green (RoHS & no Sb/Br) | Call TI | Level-1-NA-UNLIM | -55 to 125 | ||
LM158AFKB | ACTIVE | LCCC | FK | 20 | 1 | TBD | POST-PLATE | N / A for Pkg Type | -55 to 125 | 5962- 87710022A LM158AFKB | |
LM158AJG | ACTIVE | CDIP | JG | 8 | 1 | TBD | Call TI | N / A for Pkg Type | -55 to 125 | LM158AJG | |
LM158AJGB | ACTIVE | CDIP | JG | 8 | 1 | TBD | Call TI | N / A for Pkg Type | -55 to 125 | 8771002PA LM158A | |
LM158FKB | ACTIVE | LCCC | FK | 20 | 1 | TBD | POST-PLATE | N / A for Pkg Type | -55 to 125 | 5962- 87710012A LM158FKB | |
LM158JG | ACTIVE | CDIP | JG | 8 | 1 | TBD | Call TI | N / A for Pkg Type | -55 to 125 | LM158JG | |
LM158JGB | ACTIVE | CDIP | JG | 8 | 1 | TBD | Call TI | N / A for Pkg Type | -55 to 125 | 8771001PA LM158 | |
LM258AD | ACTIVE | SOIC | D | 8 | 75 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -25 to 85 | LM258A | |
LM258ADGKR | ACTIVE | VSSOP | DGK | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | NIPDAUAG | Level-1-260C-UNLIM | -25 to 85 | (M3L, M3P, M3S, M3 U) | |
LM258ADR | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | SN | Level-1-260C-UNLIM | -25 to 85 | LM258A | |
LM258ADRE4 | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -25 to 85 | LM258A | |
LM258ADRG4 | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -25 to 85 | LM258A |
Orderable Device | Status (1) | Package Type | Package Drawing | Pins | Package Qty | Eco Plan (2) | Lead/Ball Finish (6) | MSL Peak Temp (3) | Op Temp (°C) | Device Marking (4/5) | Samples |
LM258AP | ACTIVE | PDIP | P | 8 | 50 | Green (RoHS & no Sb/Br) | NIPDAU | SN | N / A for Pkg Type | -25 to 85 | LM258AP | |
LM258APE4 | ACTIVE | PDIP | P | 8 | 50 | Pb-Free (RoHS) | NIPDAU | N / A for Pkg Type | -25 to 85 | LM258AP | |
LM258D | ACTIVE | SOIC | D | 8 | 75 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -25 to 85 | LM258 | |
LM258DG4 | ACTIVE | SOIC | D | 8 | 75 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -25 to 85 | LM258 | |
LM258DGKR | ACTIVE | VSSOP | DGK | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | NIPDAUAG | Level-1-260C-UNLIM | -25 to 85 | (M2L, M2P, M2S, M2 U) | |
LM258DGKRG4 | ACTIVE | VSSOP | DGK | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAUAG | Level-1-260C-UNLIM | -25 to 85 | (M2L, M2P, M2S, M2 U) | |
LM258DR | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | SN | Level-1-260C-UNLIM | -25 to 85 | LM258 | |
LM258DRG3 | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | SN | Level-1-260C-UNLIM | -25 to 85 | LM258 | |
LM258DRG4 | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -25 to 85 | LM258 | |
LM258P | ACTIVE | PDIP | P | 8 | 50 | Green (RoHS & no Sb/Br) | NIPDAU | SN | N / A for Pkg Type | -25 to 85 | LM258P | |
LM258PE4 | ACTIVE | PDIP | P | 8 | 50 | Pb-Free (RoHS) | NIPDAU | N / A for Pkg Type | -25 to 85 | LM258P | |
LM2904AVQDR | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -40 to 125 | L2904AV | |
LM2904AVQDRG4 | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -40 to 125 | L2904AV | |
LM2904AVQPWR | ACTIVE | TSSOP | PW | 8 | 2000 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -40 to 125 | L2904AV | |
LM2904AVQPWRG4 | ACTIVE | TSSOP | PW | 8 | 2000 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -40 to 125 | L2904AV | |
LM2904BAIDR | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | Level-2-260C-1 YEAR | -40 to 125 | 2904BA | |
LM2904BIDR | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | Level-2-260C-1 YEAR | -40 to 125 | L2904B | |
LM2904BIPWR | PREVIEW | TSSOP | PW | 8 | 2000 | TBD | Call TI | Call TI | -40 to 125 |
Orderable Device | Status (1) | Package Type | Package Drawing | Pins | Package Qty | Eco Plan (2) | Lead/Ball Finish (6) | MSL Peak Temp (3) | Op Temp (°C) | Device Marking (4/5) | Samples |
LM2904D | ACTIVE | SOIC | D | 8 | 75 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -40 to 125 | LM2904 | |
LM2904DE4 | ACTIVE | SOIC | D | 8 | 75 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -40 to 125 | LM2904 | |
LM2904DG4 | ACTIVE | SOIC | D | 8 | 75 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -40 to 125 | LM2904 | |
LM2904DGKR | ACTIVE | VSSOP | DGK | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | NIPDAUAG | Level-1-260C-UNLIM | -40 to 125 | (MBL, MBP, MBS, MB U) | |
LM2904DGKRG4 | ACTIVE | VSSOP | DGK | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAUAG | Level-1-260C-UNLIM | -40 to 125 | (MBL, MBP, MBS, MB U) | |
LM2904DR | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | SN | Level-1-260C-UNLIM | -40 to 125 | LM2904 | |
LM2904DRE4 | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -40 to 125 | LM2904 | |
LM2904DRG3 | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | SN | Level-1-260C-UNLIM | -40 to 125 | LM2904 | |
LM2904DRG4 | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -40 to 125 | LM2904 | |
LM2904P | ACTIVE | PDIP | P | 8 | 50 | Green (RoHS & no Sb/Br) | NIPDAU | SN | N / A for Pkg Type | -40 to 125 | LM2904P | |
LM2904PE4 | ACTIVE | PDIP | P | 8 | 50 | Pb-Free (RoHS) | NIPDAU | N / A for Pkg Type | -40 to 125 | LM2904P | |
LM2904PSR | ACTIVE | SO | PS | 8 | 2000 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -40 to 125 | L2904 | |
LM2904PW | ACTIVE | TSSOP | PW | 8 | 150 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -40 to 125 | L2904 | |
LM2904PWR | ACTIVE | TSSOP | PW | 8 | 2000 | Green (RoHS & no Sb/Br) | NIPDAU | SN | Level-1-260C-UNLIM | -40 to 125 | L2904 | |
LM2904PWRG3 | ACTIVE | TSSOP | PW | 8 | 2000 | Green (RoHS & no Sb/Br) | SN | Level-1-260C-UNLIM | -40 to 125 | L2904 | |
LM2904PWRG4-JF | ACTIVE | TSSOP | PW | 8 | 2000 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -40 to 125 | L2904 | |
LM2904QDR | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -40 to 125 | 2904Q1 | |
LM2904QDRG4 | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -40 to 125 | 2904Q1 |
Orderable Device | Status (1) | Package Type | Package Drawing | Pins | Package Qty | Eco Plan (2) | Lead/Ball Finish (6) | MSL Peak Temp (3) | Op Temp (°C) | Device Marking (4/5) | Samples |
LM2904VQDR | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -40 to 125 | L2904V | |
LM2904VQDRG4 | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -40 to 125 | L2904V | |
LM2904VQPWR | ACTIVE | TSSOP | PW | 8 | 2000 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -40 to 125 | L2904V | |
LM2904VQPWRG4 | ACTIVE | TSSOP | PW | 8 | 2000 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | -40 to 125 | L2904V | |
LM358AD | ACTIVE | SOIC | D | 8 | 75 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | 0 to 70 | LM358A | |
LM358ADE4 | ACTIVE | SOIC | D | 8 | 75 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | 0 to 70 | LM358A | |
LM358ADG4 | ACTIVE | SOIC | D | 8 | 75 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | 0 to 70 | LM358A | |
LM358ADGKR | ACTIVE | VSSOP | DGK | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | NIPDAUAG | Level-1-260C-UNLIM | 0 to 70 | (M6L, M6P, M6S, M6 U) | |
LM358ADGKRG4 | ACTIVE | VSSOP | DGK | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAUAG | Level-1-260C-UNLIM | 0 to 70 | (M6L, M6P, M6S, M6 U) | |
LM358ADR | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | SN | Level-1-260C-UNLIM | 0 to 70 | LM358A | |
LM358ADRE4 | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | 0 to 70 | LM358A | |
LM358ADRG4 | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | 0 to 70 | LM358A | |
LM358AP | ACTIVE | PDIP | P | 8 | 50 | Green (RoHS & no Sb/Br) | NIPDAU | SN | N / A for Pkg Type | 0 to 70 | LM358AP | |
LM358APE4 | ACTIVE | PDIP | P | 8 | 50 | Pb-Free (RoHS) | NIPDAU | N / A for Pkg Type | 0 to 70 | LM358AP | |
LM358APW | ACTIVE | TSSOP | PW | 8 | 150 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | 0 to 70 | L358A | |
LM358APWR | ACTIVE | TSSOP | PW | 8 | 2000 | Green (RoHS & no Sb/Br) | NIPDAU | SN | Level-1-260C-UNLIM | 0 to 70 | L358A | |
LM358APWRG4 | ACTIVE | TSSOP | PW | 8 | 2000 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | 0 to 70 | L358A | |
LM358BAIDR | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | Level-2-260C-1 YEAR | -40 to 125 | L358BA |
Orderable Device | Status (1) | Package Type | Package Drawing | Pins | Package Qty | Eco Plan (2) | Lead/Ball Finish (6) | MSL Peak Temp (3) | Op Temp (°C) | Device Marking (4/5) | Samples |
LM358BIDR | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | Level-2-260C-1 YEAR | -40 to 85 | LM358B | |
LM358BIPWR | PREVIEW | TSSOP | PW | 8 | 2000 | TBD | Call TI | Call TI | -40 to 85 | ||
LM358D | ACTIVE | SOIC | D | 8 | 75 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | 0 to 70 | LM358 | |
LM358DG4 | ACTIVE | SOIC | D | 8 | 75 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | 0 to 70 | LM358 | |
LM358DGKR | ACTIVE | VSSOP | DGK | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | NIPDAUAG | Level-1-260C-UNLIM | 0 to 70 | (M5L, M5P, M5S, M5 U) | |
LM358DGKRG4 | ACTIVE | VSSOP | DGK | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAUAG | Level-1-260C-UNLIM | 0 to 70 | (M5L, M5P, M5S, M5 U) | |
LM358DR | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | SN | Level-1-260C-UNLIM | 0 to 70 | LM358 | |
LM358DRE4 | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | 0 to 70 | LM358 | |
LM358DRG3 | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | SN | Level-1-260C-UNLIM | 0 to 70 | LM358 | |
LM358DRG4 | ACTIVE | SOIC | D | 8 | 2500 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | 0 to 70 | LM358 | |
LM358P | ACTIVE | PDIP | P | 8 | 50 | Green (RoHS & no Sb/Br) | NIPDAU | SN | N / A for Pkg Type | 0 to 70 | LM358P | |
LM358PE3 | ACTIVE | PDIP | P | 8 | 50 | Pb-Free (RoHS) | SN | N / A for Pkg Type | 0 to 70 | LM358P | |
LM358PE4 | ACTIVE | PDIP | P | 8 | 50 | Green (RoHS & no Sb/Br) | NIPDAU | N / A for Pkg Type | 0 to 70 | LM358P | |
LM358PSR | ACTIVE | SO | PS | 8 | 2000 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | 0 to 70 | L358 | |
LM358PW | ACTIVE | TSSOP | PW | 8 | 150 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | 0 to 70 | L358 | |
LM358PWR | ACTIVE | TSSOP | PW | 8 | 2000 | Green (RoHS & no Sb/Br) | NIPDAU | SN | Level-1-260C-UNLIM | 0 to 70 | L358 | |
LM358PWRG3 | ACTIVE | TSSOP | PW | 8 | 2000 | Green (RoHS & no Sb/Br) | SN | Level-1-260C-UNLIM | 0 to 70 | L358 | |
LM358PWRG4 | ACTIVE | TSSOP | PW | 8 | 2000 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | 0 to 70 | L358 |
Orderable Device | Status (1) | Package Type | Package Drawing | Pins | Package Qty | Eco Plan (2) | Lead/Ball Finish (6) | MSL Peak Temp (3) | Op Temp (°C) | Device Marking (4/5) | Samples |
LM358PWRG4-JF | ACTIVE | TSSOP | PW | 8 | 2000 | Green (RoHS & no Sb/Br) | NIPDAU | Level-1-260C-UNLIM | 0 to 70 | L358 | |
PLM2904BIPWR | ACTIVE | TSSOP | PW | 8 | 2000 | TBD | Call TI | Call TI | -40 to 125 | ||
PLM358BIPWR | ACTIVE | TSSOP | PW | 8 | 2000 | TBD | Call TI | Call TI | -40 to 85 |
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF LM258A, LM2904, LM2904B :
Automotive: LM2904-Q1, LM2904B-Q1
Enhanced Product: LM258A-EP, LM2904-EP
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Enhanced Product - Supports Defense, Aerospace and Medical Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device | Package Type | Package Drawing | Pins | SPQ | Reel Diameter (mm) | Reel Width W1 (mm) | A0 (mm) | B0 (mm) | K0 (mm) | P1 (mm) | W (mm) | Pin1 Quadrant |
LM258ADGKR | VSSOP | DGK | 8 | 2500 | 330.0 | 12.4 | 5.3 | 3.4 | 1.4 | 8.0 | 12.0 | Q1 |
LM258ADR | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM258ADR | SOIC | D | 8 | 2500 | 330.0 | 15.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM258ADR | SOIC | D | 8 | 2500 | 330.0 | 12.8 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM258ADR | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM258ADRG4 | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM258ADRG4 | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM258DGKR | VSSOP | DGK | 8 | 2500 | 330.0 | 12.4 | 5.3 | 3.4 | 1.4 | 8.0 | 12.0 | Q1 |
LM258DR | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM258DR | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM258DR | SOIC | D | 8 | 2500 | 330.0 | 15.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM258DR | SOIC | D | 8 | 2500 | 330.0 | 12.8 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM258DRG3 | SOIC | D | 8 | 2500 | 330.0 | 12.8 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM258DRG3 | SOIC | D | 8 | 2500 | 330.0 | 15.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM258DRG4 | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM258DRG4 | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM2904AVQDR | SOIC | D | 8 | 2500 | 330.0 | 12.5 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM2904AVQDRG4 | SOIC | D | 8 | 2500 | 330.0 | 12.5 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
Device | Package Type | Package Drawing | Pins | SPQ | Reel Diameter (mm) | Reel Width W1 (mm) | A0 (mm) | B0 (mm) | K0 (mm) | P1 (mm) | W (mm) | Pin1 Quadrant |
LM2904AVQPWR | TSSOP | PW | 8 | 2000 | 330.0 | 12.4 | 7.0 | 3.6 | 1.6 | 8.0 | 12.0 | Q1 |
LM2904AVQPWRG4 | TSSOP | PW | 8 | 2000 | 330.0 | 12.4 | 7.0 | 3.6 | 1.6 | 8.0 | 12.0 | Q1 |
LM2904BAIDR | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM2904BIDR | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM2904DGKR | VSSOP | DGK | 8 | 2500 | 330.0 | 12.4 | 5.3 | 3.4 | 1.4 | 8.0 | 12.0 | Q1 |
LM2904DGKR | VSSOP | DGK | 8 | 2500 | 330.0 | 12.4 | 5.3 | 3.4 | 1.4 | 8.0 | 12.0 | Q1 |
LM2904DR | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM2904DR | SOIC | D | 8 | 2500 | 330.0 | 15.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM2904DR | SOIC | D | 8 | 2500 | 330.0 | 12.8 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM2904DR | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM2904DRG3 | SOIC | D | 8 | 2500 | 330.0 | 15.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM2904DRG3 | SOIC | D | 8 | 2500 | 330.0 | 12.8 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM2904DRG4 | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM2904DRG4 | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM2904PWR | TSSOP | PW | 8 | 2000 | 330.0 | 12.4 | 7.0 | 3.6 | 1.6 | 8.0 | 12.0 | Q1 |
LM2904PWR | TSSOP | PW | 8 | 2000 | 330.0 | 12.4 | 7.0 | 3.6 | 1.6 | 8.0 | 12.0 | Q1 |
LM2904PWRG3 | TSSOP | PW | 8 | 2000 | 330.0 | 12.4 | 7.0 | 3.6 | 1.6 | 8.0 | 12.0 | Q1 |
LM2904PWRG4-JF | TSSOP | PW | 8 | 2000 | 330.0 | 12.4 | 7.0 | 3.6 | 1.6 | 8.0 | 12.0 | Q1 |
LM2904QDR | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM2904VQDR | SOIC | D | 8 | 2500 | 330.0 | 12.5 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM2904VQPWR | TSSOP | PW | 8 | 2000 | 330.0 | 12.4 | 7.0 | 3.6 | 1.6 | 8.0 | 12.0 | Q1 |
LM2904VQPWRG4 | TSSOP | PW | 8 | 2000 | 330.0 | 12.4 | 7.0 | 3.6 | 1.6 | 8.0 | 12.0 | Q1 |
LM358ADGKR | VSSOP | DGK | 8 | 2500 | 330.0 | 12.4 | 5.3 | 3.4 | 1.4 | 8.0 | 12.0 | Q1 |
LM358ADR | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM358ADR | SOIC | D | 8 | 2500 | 330.0 | 15.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM358ADR | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM358ADR | SOIC | D | 8 | 2500 | 330.0 | 12.8 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM358ADRG4 | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM358ADRG4 | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM358APWR | TSSOP | PW | 8 | 2000 | 330.0 | 12.4 | 7.0 | 3.6 | 1.6 | 8.0 | 12.0 | Q1 |
LM358APWR | TSSOP | PW | 8 | 2000 | 330.0 | 12.4 | 7.0 | 3.6 | 1.6 | 8.0 | 12.0 | Q1 |
LM358APWRG4 | TSSOP | PW | 8 | 2000 | 330.0 | 12.4 | 7.0 | 3.6 | 1.6 | 8.0 | 12.0 | Q1 |
LM358BAIDR | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM358BIDR | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM358DGKR | VSSOP | DGK | 8 | 2500 | 330.0 | 12.4 | 5.3 | 3.4 | 1.4 | 8.0 | 12.0 | Q1 |
LM358DGKR | VSSOP | DGK | 8 | 2500 | 330.0 | 12.4 | 5.3 | 3.4 | 1.4 | 8.0 | 12.0 | Q1 |
LM358DR | SOIC | D | 8 | 2500 | 330.0 | 12.8 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM358DR | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM358DR | SOIC | D | 8 | 2500 | 330.0 | 15.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM358DR | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM358DRG3 | SOIC | D | 8 | 2500 | 330.0 | 15.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM358DRG3 | SOIC | D | 8 | 2500 | 330.0 | 12.8 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM358DRG4 | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
Device | Package Type | Package Drawing | Pins | SPQ | Reel Diameter (mm) | Reel Width W1 (mm) | A0 (mm) | B0 (mm) | K0 (mm) | P1 (mm) | W (mm) | Pin1 Quadrant |
LM358DRG4 | SOIC | D | 8 | 2500 | 330.0 | 12.4 | 6.4 | 5.2 | 2.1 | 8.0 | 12.0 | Q1 |
LM358PWR | TSSOP | PW | 8 | 2000 | 330.0 | 12.4 | 7.0 | 3.6 | 1.6 | 8.0 | 12.0 | Q1 |
LM358PWR | TSSOP | PW | 8 | 2000 | 330.0 | 12.4 | 7.0 | 3.6 | 1.6 | 8.0 | 12.0 | Q1 |
LM358PWRG3 | TSSOP | PW | 8 | 2000 | 330.0 | 12.4 | 7.0 | 3.6 | 1.6 | 8.0 | 12.0 | Q1 |
LM358PWRG4 | TSSOP | PW | 8 | 2000 | 330.0 | 12.4 | 7.0 | 3.6 | 1.6 | 8.0 | 12.0 | Q1 |
LM358PWRG4-JF | TSSOP | PW | 8 | 2000 | 330.0 | 12.4 | 7.0 | 3.6 | 1.6 | 8.0 | 12.0 | Q1 |
*All dimensions are nominal
Device | Package Type | Package Drawing | Pins | SPQ | Length (mm) | Width (mm) | Height (mm) |
LM258ADGKR | VSSOP | DGK | 8 | 2500 | 364.0 | 364.0 | 27.0 |
LM258ADR | SOIC | D | 8 | 2500 | 340.5 | 338.1 | 20.6 |
LM258ADR | SOIC | D | 8 | 2500 | 333.2 | 345.9 | 28.6 |
LM258ADR | SOIC | D | 8 | 2500 | 364.0 | 364.0 | 27.0 |
LM258ADR | SOIC | D | 8 | 2500 | 367.0 | 367.0 | 35.0 |
LM258ADRG4 | SOIC | D | 8 | 2500 | 340.5 | 338.1 | 20.6 |
LM258ADRG4 | SOIC | D | 8 | 2500 | 367.0 | 367.0 | 35.0 |
LM258DGKR | VSSOP | DGK | 8 | 2500 | 364.0 | 364.0 | 27.0 |
LM258DR | SOIC | D | 8 | 2500 | 340.5 | 338.1 | 20.6 |
LM258DR | SOIC | D | 8 | 2500 | 367.0 | 367.0 | 35.0 |
LM258DR | SOIC | D | 8 | 2500 | 333.2 | 345.9 | 28.6 |
Device | Package Type | Package Drawing | Pins | SPQ | Length (mm) | Width (mm) | Height (mm) |
LM258DR | SOIC | D | 8 | 2500 | 364.0 | 364.0 | 27.0 |
LM258DRG3 | SOIC | D | 8 | 2500 | 364.0 | 364.0 | 27.0 |
LM258DRG3 | SOIC | D | 8 | 2500 | 333.2 | 345.9 | 28.6 |
LM258DRG4 | SOIC | D | 8 | 2500 | 340.5 | 338.1 | 20.6 |
LM258DRG4 | SOIC | D | 8 | 2500 | 367.0 | 367.0 | 35.0 |
LM2904AVQDR | SOIC | D | 8 | 2500 | 340.5 | 338.1 | 20.6 |
LM2904AVQDRG4 | SOIC | D | 8 | 2500 | 340.5 | 338.1 | 20.6 |
LM2904AVQPWR | TSSOP | PW | 8 | 2000 | 367.0 | 367.0 | 35.0 |
LM2904AVQPWRG4 | TSSOP | PW | 8 | 2000 | 367.0 | 367.0 | 35.0 |
LM2904BAIDR | SOIC | D | 8 | 2500 | 340.5 | 338.1 | 20.6 |
LM2904BIDR | SOIC | D | 8 | 2500 | 340.5 | 338.1 | 20.6 |
LM2904DGKR | VSSOP | DGK | 8 | 2500 | 364.0 | 364.0 | 27.0 |
LM2904DGKR | VSSOP | DGK | 8 | 2500 | 358.0 | 335.0 | 35.0 |
LM2904DR | SOIC | D | 8 | 2500 | 340.5 | 338.1 | 20.6 |
LM2904DR | SOIC | D | 8 | 2500 | 333.2 | 345.9 | 28.6 |
LM2904DR | SOIC | D | 8 | 2500 | 364.0 | 364.0 | 27.0 |
LM2904DR | SOIC | D | 8 | 2500 | 367.0 | 367.0 | 35.0 |
LM2904DRG3 | SOIC | D | 8 | 2500 | 333.2 | 345.9 | 28.6 |
LM2904DRG3 | SOIC | D | 8 | 2500 | 364.0 | 364.0 | 27.0 |
LM2904DRG4 | SOIC | D | 8 | 2500 | 367.0 | 367.0 | 35.0 |
LM2904DRG4 | SOIC | D | 8 | 2500 | 340.5 | 338.1 | 20.6 |
LM2904PWR | TSSOP | PW | 8 | 2000 | 364.0 | 364.0 | 27.0 |
LM2904PWR | TSSOP | PW | 8 | 2000 | 367.0 | 367.0 | 35.0 |
LM2904PWRG3 | TSSOP | PW | 8 | 2000 | 364.0 | 364.0 | 27.0 |
LM2904PWRG4-JF | TSSOP | PW | 8 | 2000 | 367.0 | 367.0 | 35.0 |
LM2904QDR | SOIC | D | 8 | 2500 | 350.0 | 350.0 | 43.0 |
LM2904VQDR | SOIC | D | 8 | 2500 | 340.5 | 338.1 | 20.6 |
LM2904VQPWR | TSSOP | PW | 8 | 2000 | 367.0 | 367.0 | 35.0 |
LM2904VQPWRG4 | TSSOP | PW | 8 | 2000 | 367.0 | 367.0 | 35.0 |
LM358ADGKR | VSSOP | DGK | 8 | 2500 | 364.0 | 364.0 | 27.0 |
LM358ADR | SOIC | D | 8 | 2500 | 367.0 | 367.0 | 35.0 |
LM358ADR | SOIC | D | 8 | 2500 | 333.2 | 345.9 | 28.6 |
LM358ADR | SOIC | D | 8 | 2500 | 340.5 | 338.1 | 20.6 |
LM358ADR | SOIC | D | 8 | 2500 | 364.0 | 364.0 | 27.0 |
LM358ADRG4 | SOIC | D | 8 | 2500 | 367.0 | 367.0 | 35.0 |
LM358ADRG4 | SOIC | D | 8 | 2500 | 340.5 | 338.1 | 20.6 |
LM358APWR | TSSOP | PW | 8 | 2000 | 367.0 | 367.0 | 35.0 |
LM358APWR | TSSOP | PW | 8 | 2000 | 364.0 | 364.0 | 27.0 |
LM358APWRG4 | TSSOP | PW | 8 | 2000 | 367.0 | 367.0 | 35.0 |
LM358BAIDR | SOIC | D | 8 | 2500 | 340.5 | 338.1 | 20.6 |
LM358BIDR | SOIC | D | 8 | 2500 | 340.5 | 338.1 | 20.6 |
LM358DGKR | VSSOP | DGK | 8 | 2500 | 358.0 | 335.0 | 35.0 |
LM358DGKR | VSSOP | DGK | 8 | 2500 | 364.0 | 364.0 | 27.0 |
LM358DR | SOIC | D | 8 | 2500 | 364.0 | 364.0 | 27.0 |
Device | Package Type | Package Drawing | Pins | SPQ | Length (mm) | Width (mm) | Height (mm) |
LM358DR | SOIC | D | 8 | 2500 | 367.0 | 367.0 | 35.0 |
LM358DR | SOIC | D | 8 | 2500 | 333.2 | 345.9 | 28.6 |
LM358DR | SOIC | D | 8 | 2500 | 340.5 | 338.1 | 20.6 |
LM358DRG3 | SOIC | D | 8 | 2500 | 333.2 | 345.9 | 28.6 |
LM358DRG3 | SOIC | D | 8 | 2500 | 364.0 | 364.0 | 27.0 |
LM358DRG4 | SOIC | D | 8 | 2500 | 340.5 | 338.1 | 20.6 |
LM358DRG4 | SOIC | D | 8 | 2500 | 367.0 | 367.0 | 35.0 |
LM358PWR | TSSOP | PW | 8 | 2000 | 364.0 | 364.0 | 27.0 |
LM358PWR | TSSOP | PW | 8 | 2000 | 367.0 | 367.0 | 35.0 |
LM358PWRG3 | TSSOP | PW | 8 | 2000 | 364.0 | 364.0 | 27.0 |
LM358PWRG4 | TSSOP | PW | 8 | 2000 | 367.0 | 367.0 | 35.0 |
LM358PWRG4-JF | TSSOP | PW | 8 | 2000 | 367.0 | 367.0 | 35.0 |
MECHANICAL DATA
FK ( S - CQCC - N * * ) LE ADLESS CERA M I C CH IP CARRIER
28 TERMINAL SHOWN
NO. OF TERMINALS ** | A | B | ||
MIN | MAX | MIN | MAX | |
20 | 0.342 (8,69) | 0.358 (9,09) | 0.307 (7,80) | 0.358 (9,09) |
28 | 0.442 (11,23) | 0.458 (11,63) | 0.406 (10,31) | 0.458 (11,63) |
44 | 0640 (16,26) | 0.660 (16,76) | 0.495 (12,58) | 0.560 (14,22) |
52 | 0.740 (18,78) | 0.761 (19,32) | 0.495 (12,58) | 0.560 (14,22) |
68 | 0.938 (23,83) | 0.962 (24,43) | 0.850 (21,6) | 0.858 (21,8) |
84 | 1.1 41 (28,99) | 1.165 (29,59) | 1.047 (26,6) | 1.063 (27,0) |
18 1 7 16 15 1 4 13 12
(
B SO
A SO
19 11
20 10
21 9
22 8
23 7
24 6
25 5
\
26 27 28 2 3 4
0.020 (0,51) , I I 0.080 (2,03)
---r
0.010 (0,25)- - I
0.020 (0,51)
0.010 (0,25)
□
0.06 4 (1,63)
0.055 (1,40)
0.045 (1,14)
0.028 (0,71)- -
0.022 (0,54)
----.I-
0.045 (1,14)
•
0.035 (0,89)
0 050 (1,27)
: 045 (1,14:
0.035 (0,89)
4040 1 40 /D 01 /11
NOTES: A. All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a metal lid.
Falls wi thin JEDEC MS-004
.Ii:& TEY""
INS n UM EN-
D0008A
PACKAGE OUTLINE
SOIC - 1.75 mm max height
SCALE 2.800
SMALL OUTLINE INTEGRATED CIRCUIT
C
A
.189-.197
[4.81-5.00]
NOTE 3
.228-.244 TYP
[5.80-6.19]
.050
[1.27]
PIN 1 ID AREA
6X
1 8
2X
.150
[3.81]
C
SEATING PLANE
.004 [0.1]
4
B .150-.157
[3.81-3.98]
NOTE 4
5
8X .012-.020
.010 [0.25] | C | A | B |
[0.31-0.51]
4X (0 -15 )
MAX
[1.75]
.005-.010 TYP
[0.13-0.25]
4X (0 -15 )
SEE DETAIL A
.010
[0.25]
0 - 8
.004-.010
[0.11-0.25]
.016-.050
[0.41-1.27]
(.041)
[1.04]
DETAIL A
TYPICAL
4214825/C 02/2019
NOTES:
Linear dimensions are in inches [millimeters]. Dimensions in parenthesis are for reference only. Controlling dimensions are in inches. Dimensioning and tolerancing per ASME Y14.5M.
This drawing is subject to change without notice.
This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed .006 [0.15] per side.
This dimension does not include interlead flash.
Reference JEDEC registration MS-012, variation AA.
D0008A
EXAMPLE BOARD LAYOUT
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
1
8X (.024)
[0.6]
4
6X (.050 )
[1.27]
SYMM
(.213)
[5.4]
LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE:8X
SEE DETAILS
8
SYMM
(R.002 ) TYP
5 [0.05]
METAL SOLDER MASK
SOLDER MASK METAL UNDER
OPENING
OPENING
SOLDER MASK
EXPOSED METAL
.0028 MAX
[0.07]
ALL AROUND
EXPOSED
METAL
.0028 MIN
[0.07]
ALL AROUND
NON SOLDER MASK DEFINED
SOLDER MASK DEFINED
SOLDER MASK DETAILS
4214825/C 02/2019
NOTES: (continued)
Publication IPC-7351 may have alternate designs.
Solder mask tolerances between and around signal pads can vary based on board fabrication site.
D0008A
EXAMPLE STENCIL DESIGN
SOIC - 1.75 mm max height
SMALL OUTLINE INTEGRATED CIRCUIT
8X (.061 )
[1.55]
1
SYMM
8
8X (.024)
[0.6]
SYMM
4
6X (.050 )
[1.27]
(.213)
[5.4]
(R.002 ) TYP
5 [0.05]
SOLDER PASTE EXAMPLE
BASED ON .005 INCH [0.125 MM] THICK STENCIL SCALE:8X
4214825/C 02/2019
NOTES: (continued)
Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
Board assembly site may have different recommendations for stencil design.
MECHANICAL DATA
7,40
ge Pld J
_J
l0!!}
5,00
5,60 8,20
R7l
PS (R-PDSO-G8) PLASTIC SMALL-OUTLINE PACKAGE
hI, i:;; ♦l , lo 2s@I
LlLlLilJlj ._
0,15
0 05
Seating Plane
- 2,00 MAX
0010
4040063/C 03/03
t
- '
\
I I
I I
I I
I I
.-----
0,95
+- 0,55
--+
o·-B·
5,90
NOTES: A. All linear dimensions ore in millimeters.
This drawing is subject to change without notice.
Body dimensions do not include mold flash or protrusion, not to exceed 0,15.
"li>TEXAS INSTRUMENTS
LAN D PATTERN DATA
------- l
,--- -) ---- _l
I : ', -- ,/
//--,_
6 x1,27
r - s , xo 55
Stencil Open ings
7- (Note D)
L
Example Board Layout (Note C)
7 r - 6x1,27
------7
7,40
PS (R-PDSO-G8) PLASTIC SM AL L OU TLI NE
Example
1,80
\
- -1
-
0,07
I
- ---,,, _
/,
/
4212 188/ A 09/11
Around /
All
\
I:
L
Example
Non-Solder Mask Opening (See Note E)
' \
/,
I
\
-
',
Example Pad Geometry (See Note C)
-,
',,,
'
0,60
/
// 1
' 1
t, , /
Non Soldermask Defined Pad
, :- ------ --- --------"-
NOTES: A. All linear dimensions are in millimeters.
This drawing is subjec t to change without not ice.
Publi cation IPC- 7351 is recommended for alternate designs.
Laser cutting apertures with trapezoidal walls and also rounding corners will offer better paste release. Custome rs should contact their board assembly site for stencil design recommendations. Re fer to IPC- 7525 for other stencil recommenda tions.
Customers should contact their board fabrica tion site for solder mask tolerances between and around signal pads.
◄
T XA"'
I' S-T
MENS
MECHANICALDATA
MCER001A – JANUARY 1995 – REVISED JANUARY 1997
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE
0.400 (10,16)
0.355 (9,00)
8 5
0.280 (7,11)
0.245 (6,22)
1 4
0.065 (1,65)
0.045 (1,14)
0.063 (1,60)
0.015 (0,38)
0.020 (0,51) MIN
0.200 (5,08) MAX
0.130 (3,30) MIN
Seating Plane
0.310 (7,87)
0.290 (7,37)
0.023 (0,58)
0.015 (0,38)
0.100 (2,54)
0.014 (0,36)
0.008 (0,20)
0–15
4040107/C 08/96
NOTES: A. All linear dimensions are in inches (millimeters).
This drawing is subject to change without notice.
This package can be hermetically sealed with a ceramic lid using glass frit.
Index point is provided on cap for terminal identification.
Falls within MIL STD 1835 GDIP1-T8
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
0.045 (1,1 4)
i
i
P (R-PDIP-T8) PL AS TIC DUAL-IN-LINE PACKAGE
0.400 (10,16)
+- 0.355 (9,02) .
8 5
0.260 (6,60)
0.240 (6,10)
0
L007: (1. 78)
0.045 (1,1 4)
0.030 (0,76)
0.020 (0,51) MIN
0.325 (8,26)
._ 0.300 (7,62) _.
0.021 (0,53)
._ 0.015 (0,38)
!410 010 (0,25)@
4040082/ E 04/ 2010
MAX
I
k-0.430 (10,92)
0.010 (0,25) NOM
Gauge Plane
-f
0.200 (5,08) MAX
t
y_ i Sea ting Plane
t 0.125 (3,18) MIN
t
0 100 (2,54) 1
NOTES: A. All linear dimensions are in inches (mi llimeters) .
This drawing is subject to change without notice.
Falls wit hin JEDEC MS-001 variation BA.
.., A
MECHANICAL DATA
0,328
DGK (S-PDSO-GB) PLASTIC SMALL-OUTLINE PACKAGE
r- 1 ls5
0, 5
-$- 0,13 @
0,23
0,13
5,05
4,75
\
0,70
0,40
t,
j
Seating Plane
4073329/E 05/06
10,1
0,05
'
NOTES: A. All linear dimensions ore in millimeters.
B. This drawing is subject to change wi thout notice.
Body length does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 per end.
[Q:> Body width does not include interleod flash. lnter leod flash shall not exceed 0.50 per side.
E. Falls within JEDEC M0-187 variation A/\ except inter leod flash.
.. I\
,l
'
', i
f
J_
)
♦
1
DGK (S-PDSO-G8) PLASTIC SMALL OUTLINE PACKAGE
Example Board Layout
Example Stencil Openings Based on a stencil thickness
of .127mm (.005inch).
(See Note D)
H(0,65)TYP. 8X(0,457)
j-
H(0,65)TYP.
8
5
--------r
8X(1,45
------!
PKG-------t-------
1
I'
(4,4)
PKG-------+-------
(4,4)
/
/
1
4
_l
_l
I
I
4221236/A 11/13
/
,,,,,.
"'-- /
',
I
/
--11-- (0,05)
All Around I
I
\
I
I
Pad Geometry
(See Note C)
\
I
(1,45)
l
\
Example Solder Mask Opening
(See Note E)
I I
' ,
- I I - (0,45) \
t
I
I
I
I
I
Example
, Non Soldermask Defined Pad
I --------
y -l [
/
PKG
G
I ,, "---- --./ Pi
NOTES: A. All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Publication IPC-7351 is recommended for alternate designs.
Laser cutting apertures with trapezoidal walls and also rounding corners will offer better paste release. Customers should contact their board assembly site for stencil design recommendations. Refer to IPC-7525 for other stencil recommendations.
Customers should contact their board fabrication site for solder mask tolerances between and around signal pads.
TEXAS
IN STRUMEN
PW0008A
PACKAGE OUTLINE
TSSOP - 1.2 mm max height
SCALE 2.800
SMALL OUTLINE PACKAGE
A
3.1
2.9
NOTE 3
6.6
TYP
6.2
PIN 1 ID AREA
1 8
C
6X
0.65
2X
1.95
C
SEATING PLANE
0.1
4
B
4.5
4.3
NOTE 4
5
8X
0.30
0.1 | C | A | B |
0.19
1.2 MAX
SEE DETAIL A
(0.15) TYP
0.25
GAGE PLANE
0 - 8
0.75
0.50
DETAIL A
TYPICAL
0.15
0.05
4221848/A 02/2015
NOTES:
All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M.
This drawing is subject to change without notice.
This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not exceed 0.15 mm per side.
This dimension does not include interlead flash. Interlead flash shall not exceed 0.25 mm per side.
Reference JEDEC registration MO-153, variation AA.
PW0008A
EXAMPLE BOARD LAYOUT
TSSOP - 1.2 mm max height
(R0.05) TYP
1
SMALL OUTLINE PACKAGE
8X (0.45)
8X (1.5)
SYMM
8
SYMM
6X (0.65)
4
5
(5.8)
LAND PATTERN EXAMPLE
SCALE:10X
SOLDER MASK OPENING
METAL
METAL UNDER SOLDER MASK
SOLDER MASK OPENING
0.05 MAX ALL AROUND
0.05 MIN
ALL AROUND
NON SOLDER MASK DEFINED
SOLDER MASK DEFINED
SOLDER MASK DETAILS
NOT TO SCALE
4221848/A 02/2015
NOTES: (continued)
Publication IPC-7351 may have alternate designs.
Solder mask tolerances between and around signal pads can vary based on board fabrication site.
PW0008A
EXAMPLE STENCIL DESIGN
TSSOP - 1.2 mm max height
1
SMALL OUTLINE PACKAGE
8X (0.45)
8X (1.5)
SYMM
(R0.05) TYP
8
SYMM
6X (0.65)
4
5
(5.8)
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL SCALE:10X
4221848/A 02/2015
NOTES: (continued)
Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations.
Board assembly site may have different recommendations for stencil design.
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