DATASHEET


ISL28191, ISL28291

Single and Dual Single Supply Ultra-Low Noise, Low Distortion Rail-to-Rail Output, Op Amp


FN6156 Rev 10.00

July 22, 2014


The ISL28191 and ISL28291 are tiny single and dual ultra-low noise, ultra-low distortion operational amplifiers. They are fully specified to operate down to +3V single supply. These amplifiers have outputs that swing rail-to-rail and an input common mode voltage that extends to ground

(ground sensing).

The ISL28191 and ISL28291 are unity gain stable with an input referred voltage noise of 1.7nV/Hz. Both parts feature 0.00018% THD+N at 1kHz.

The ISL28191 is available in the space-saving 6 Ld UTDFN (1.6mmx1.6mm) and 6 Ld SOT-23 packages. The ISL28291 is available in the 8 Ld SOIC, 10 Ld 1.8mmx1.4mm UTQFN and 10 Ld MSOP packages. All devices are guaranteed over -40°C to +125°C.

Ordering Information


PART NUMBER

(Note 5)

PART MARKING

PACKAGE

(Pb-free)

PKG. DWG. #

ISL28191FHZ-T7 (Notes 1, 2)

GABJ

(Note 4)

6 Ld SOT-23

P6.064A

ISL28191FRUZ-T7 (Notes 1, 3)

M8

6 Ld UTDFN

L6.1.6x1.6A

ISL28291FUZ (Note 2)

8291Z

10 Ld MSOP

M10.118A

ISL28291FUZ-T7 (Notes 1, 2)

8291Z

10 Ld MSOP

M10.118A

ISL28291FBZ (Note 2)

28291 FBZ

8 Ld SOIC

M8.15E

ISL28291FBZ-T7 (Notes 1, 2)

28291 FBZ

8 Ld SOIC

M8.15E

ISL28291FRUZ-T7 (Notes 1, 3)

F

10 Ld UTQFN

L10.1.8x1.4A

ISL28191EVAL1Z

Evaluation Board

ISL28291EVAL1Z

Evaluation Board

NOTES:

  1. Please refer to TB347 for details on reel specifications.

  2. These Intersil Pb-free plastic packaged products employ special Pb- free material sets, molding compounds/die attach materials, and 100% matte tin plate plus anneal (e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations). Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb- free requirements of IPC/JEDEC J STD-020.

  3. These Intersil Pb-free plastic packaged products employ special Pb- free material sets; molding compounds/die attach materials and NiPdAu plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020.

  4. The part marking is located on the bottom of the part.

  5. For Moisture Sensitivity Level (MSL), please see device information page for ISL28191, ISL28291. For more information on MSL please see techbrief TB363.

    Features

  6. JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.

  7. JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379.

  8. For JC, the “case temp” location is the center of the exposed metal pad on the package underside.

  9. For JC, the “case temp” location is taken at the package top center.


    Electrical Specifications V+ = 5.0V, V- = GND, RL = Open RF = 1k AV = -1 unless otherwise specified. Parameters are per amplifier. Typical values are at V+= 5V, TA = +25°C. Boldface limits apply over the operating temperature range, -40°C to +125°C.


    PARAMETER


    DESCRIPTION


    CONDITIONS

    MIN

    (Note 10)


    TYP

    MAX

    (Note 10)


    UNIT

    DC SPECIFICATIONS

    VOS

    Input Offset Voltage



    270

    630

    µV

    840

    VOS

    ----------------

    T

    Input Offset Drift vs Temperature

    Figure 21


    3.1


    µV/°C

    IIO

    Input Offset Current



    35

    500

    nA

    900

    IB

    Input Bias Current



    3

    6

    µA

    7

    CMIR

    Common-Mode Input Range


    0


    3.8

    V

    CMRR

    Common-Mode Rejection Ratio

    VCM = 0V to 3.8V

    78

    100


    dB

    PSRR

    Power Supply Rejection Ratio

    VS = 3V to 5V

    74

    80


    dB

    AVOL

    Large Signal Voltage Gain

    VO = 0.5V to 4V, RL = 1k

    90

    98


    dB

    86

    VOUT

    Maximum Output Voltage Swing

    Output low, RL = 1k


    20

    50

    mV

    80

    Output high, RL = 1k V+ = 5V

    4.95

    4.97


    V

    4.92

    IS,ON

    Supply Current per Amplifier, Enabled



    2.6

    3.5

    mA

    3.9

    IS,OFF

    Supply Current per Amplifier, Disabled



    26

    35

    µA

    48

    IO+

    Short-Circuit Output Current

    RL = 10

    95

    130


    mA

    90


    Electrical Specifications V+ = 5.0V, V- = GND, RL = Open RF = 1k AV = -1 unless otherwise specified. Parameters are per amplifier. Typical values are at V+= 5V, TA = +25°C. Boldface limits apply over the operating temperature range, -40°C to +125°C. (Continued)


    PARAMETER


    DESCRIPTION


    CONDITIONS

    MIN

    (Note 10)


    TYP

    MAX

    (Note 10)


    UNIT

    IO-

    Short-Circuit Output Current

    RL = 10

    95

    130


    mA

    90

    VSUPPLY

    Supply Operating Range

    V+ to V-

    3


    5.5

    V

    VENH

    EN High Level

    Referred to V-

    2



    V

    VENL

    EN Low Level

    Referred to V-



    0.8

    V

    IENH

    EN Pin Input High Current

    VEN = V+


    0.8

    1.1

    µA

    1.3

    IENL

    EN Pin Input Low Current

    VEN = V-


    20

    80

    nA

    100

    AC SPECIFICATIONS

    GBW

    -3dB Unity Gain Bandwidth

    RF = 0 CL = 20pF, AV = 1, RL = 10k


    61


    MHz

    THD+N

    Total Harmonic Distortion + Noise

    f = 1kHz. VOUT + 2VP-P, AV = +1, RL = 10k


    0.0001


    %

    8

    HD (1MHz)

    2nd Harmonic Distortion

    2VP-P output voltage, AV = 1


    -76


    dBc

    3rd Harmonic Distortion


    -70


    dBc

    ISO

    Off-state Isolation fO = 100kHz

    AV = +1, VIN = 100mVP-P, RF = 0 CL = 20pF, AV = 1, RL = 10k


    -38


    dB

    X-TALK ISL28291

    Channel-to-Channel Crosstalk fO = 100kHz

    VS = ±2.5V, AV = +1, VIN = 1VP-P,

    RF = 0 CL = 20pF, AV = 1, RL = 10k


    -105


    dB

    PSRR

    Power Supply Rejection Ratio fO = 100kHz

    VS = ±2.5V, AV = +1, VSOURCE = 1VP-P, RF = 0 CL = 20pF, AV = 1, RL = 10k


    -70


    dB

    CMRR

    Common Mode Rejection Ratio fO = 100kHz

    VS = ±2.5V, AV = +1, VCM = 1VP-P,

    RF = 0 CL = 20pF, AV = 1, RL = 10k


    -65


    dB

    en

    Input Referred Voltage Noise

    fO = 1kHz


    1.7


    nV/√Hz

    in

    Input Referred Current Noise

    fO = 1kHz


    1.8


    pA/√Hz

    TRANSIENT RESPONSE

    SR

    Slew Rate


    12

    17


    V/µs

    12

    tr, tf, Small Signal

    Rise Time, tr 10% to 90%

    AV = 1, VOUT = 0.1VP-P, RL = 10k, CL = 1.2pF


    7


    ns

    Fall Time, tf 90% to 10%


    12


    ns

    tr, tf Large Signal

    Rise Time, tr 10% to 90%

    AV = 2, VOUT = 1VP-P; RL = 10k RF /RG = 499499 CL = 1.2pF


    44


    ns

    Fall Time, tf 90% to 10%


    50


    ns

    Rise Time, tr 10% to 90%

    AV = 2, VOUT = 4.7VP-P; RL = 10k RF /RG = 499499 CL = 1.2pF


    190


    ns

    Fall Time, tf 90% to 10%


    190


    ns

    tEN

    ENABLE to Output Turn-on Delay Time; 10% EN - 10% VOUT

    AV = 1, VOUT = 1VDC, RL = 10k, CL = 1.2pF


    330


    ns

    ENABLE to Output Turn-off Delay Time; 10% EN - 10% VOUT

    AV = 1, VOUT = 0VDC, RL = 10k, CL = 1.2pF


    50


    ns

    NOTE:

  10. Compliance to datasheet limits is assured by one or more methods: production test, characterization and/or design.


Typical Performance Curves

3 10

RL = 100k

2

CLOSED LOOP GAIN (dB)

1

0

-1

-2 RL = 10k

-3

8 CL = 110pF

CLOSED LOOP GAIN (dB)

6 CL = 57pF

4 CL = 57pF

2 CL = 32pF

0

-2 CL = 10pF

-4 V+ = 5V

-5 AV = +1

RL = 1k

-4 V+ = 5V

-6 AV = +1

CL = 20pF

CL = 10pF

-6 VOUT = 10mVP-P

-7

RL = 100


-8

-10

RL = 10k

VOUT = 10mVP-P

10k 100k 1M 10M 100M FREQUENCY (Hz)

10k 100k 1M 10M 100M FREQUENCY (Hz)

FIGURE 1. GAIN vs FREQUENCY FOR VARIOUS RLOAD FIGURE 2. GAIN vs FREQUENCY FOR VARIOUS CLOAD


2 VOUT = 1mVP-P

1 VOUT = 10mVP-P

CLOSED LOOP GAIN (dB)

0

-1

-2 VOUT = 100mVP-P

70

AV = 1000, RF = 499k, RG = 499

60


50


GAIN (dB)

40


V+ = 5V RL = 10k

VOUT = 100mVP-P

-3

-4

-5 V+ = 5V

-6 AV = +1 RL = 10k

-7 CL = 10pF

-8


VOUT = 1VP-P

30


20


10


0


-10

AV = 100, RF = 49.9k, RG = 499


AV = 10, RF = 4.42k, RG = 499


AV = 1, RF = 0, RG = INF

10k 100k 1M 10M 100M FREQUENCY (Hz)

10k 100k 1M 10M 100M FREQUENCY (Hz)

FIGURE 3. -3dB BANDWIDTH vs VOUT FIGURE 4. FREQUENCY RESPONSE vs CLOSED LOOP GAIN



OUTPUT IMPEDANCE ()

1M 100k



V+ = 5V, 3V

ENABLED AND DISABLED VSOURCE = 1VP-P

INPUT IMPEDANCE ()

100k


10k


10k


V+ = 5V, 3V VSOURCE = 1VP-P


1k

1k



10k

100k

1M

10M

100M

10k

100k

1M

10M

100M



FREQUENCY (Hz)





FREQUENCY (Hz)



100 100


FIGURE 5. INPUT IMPEDANCE vs FREQUENCY FIGURE 6. DISABLED OUTPUT IMPEDANCE vs FREQUENCY


Typical Performance Curves (Continued)

100

V+ = 5V, 3V


OUTPUT IMPEDANCE ()

VSOURCE = 1V

10


VSOURCE = 0.1V

1


0.10


10

0

-10

-20

CMRR (dB)

-30

-40

-50

-60

-70

-80

-90

-100


V+ = 5V AV = +1 RL = 10k CL = 10pF

VOUT = 100mVP-P

10k 100k 1M 10M 100M

1k 10k

100k

1M 10M

100M

FREQUENCY (Hz) FREQUENCY (Hz)

FIGURE 7. ENABLED OUTPUT IMPEDANCE vs FREQUENCY FIGURE 8. CMRR vs FREQUENCY



10

0

-10

-20

PSRR (dB)

-30

-40

-50

-60

-70

-80

-90

-100


V+ = 5V AV = +1 RL = 10k

CL = 10pF

VOUT = 100mVP-P


PSRR+


PSRR-+


0


-10


OFF ISOLATION (dB)

-20


-30


-40


-50


-60


-70


-80


VP-P = 1V

VP-P = 10mV VP-P = 100mV


V+ = 5V AV = +1 RL = 10k

CL = 10pF

1k 10k

100k

1M 10M

100M

10k 100k 1M 10M 100M 1G

FREQUENCY (Hz) FREQUENCY (Hz)

FIGURE 9. PSRR vs FREQUENCY FIGURE 10. OFF ISOLATION vs FREQUENCY


-30

-40

CROSSTALK (dB)

-50

-60

-70

-80

-90

-100

-110

10k

100k

1M 10M

100M

1G

0

2k 4k 6k 8k 10k 12k 14k 16k 18k 20k



FREQUENCY (Hz)




FREQUENCY (Hz)

-120


VP-P = 1V

0.1


THD + NOISE (%)

0.01


0.001


0.0001


V+ = 5V RL = 10k

RF = 0, AV = 1 VOUT = 2VP-P

400Hz TO 22kHz FILTER



FIGURE 11. CHANNEL TO CHANNEL CROSSTALK vs FREQUENCY FIGURE 12. THD+N vs FREQUENCY


Typical Performance Curves (Continued)

1


THD +NOISE (%)

0.1

V+ = 5V 10

INPUT VOLTAGE NOISE (nV/ÖHz)

AV = +1 RL = 10k

FREQUENCY = 1kHz

FILTER = 400Hz TO 22kHz


0.01



0.001



0.1

1

10 100 1k

10k

100k




VOUT (VP-P)






FREQUENCY (Hz)



0.0001 1

0 0.5 1.0 1.5 2.0 2.5 3.0 3.5


FIGURE 13. THD+N @ 1kHz vs VOUT FIGURE 14. INPUT REFERRED NOISE VOLTAGE vs FREQUENCY


CURRENT NOISE (pA/Hz)

100


10

5


4


VOLTS (V)

3


2

ENABLE


EN INPUT


DISABLE


V+ = 5V AV = +1 RL = 10k CL = 10pF

VIN = 1VDC


ENABLE



1

0.1


1 10 100 1k 10k FREQUENCY (Hz)


100k

1


OUTPUT

0

-1 0 1 2 3 4

TIME (µs)

FIGURE 15. INPUT REFERRED NOISE CURRENT vs FREQUENCY FIGURE 16. ENABLE/DISABLE TIMING


0.08


0.06


SMALL SIGNAL (V)

0.04


0.02


0


-0.02


-0.04


V+ = ±2.5V AV = +1

RL = 10k


VIN


VOUT

0.8


0.6


LARGE SIGNAL (V)

0.4


0.2


0


-0.2


-0.4


VOUT VIN


V+ = ±2.5V AV = +2

RF = RG = 499

-0.06


-0.08

VOUT = 100mVP-P


0 20 40 60 80 100 120 140 160 180 200

TIME (ns)

-0.6


-0.8

RL = 10k VOUT = 1VP-P

0 100 200 300 400 500 600 700 800

TIME (ns)

FIGURE 17. SMALL SIGNAL STEP RESPONSE FIGURE 18. LARGE SIGNAL (1V) STEP RESPONSE


Typical Performance Curves (Continued)

3

VOUT

2

3.5

3.3

3.1


n = 100


MEDIAN


MAX

LARGE SIGNAL (V)

VIN

1


0


-1 V+ = ±2.5V

AV = +2

-2 RF = RG = 499

RL = 10k

VOUT = 4.7VP-P

2.9

CURRENT (mA)

2.7

2.5

2.3

2.1

1.9

1.7


MIN

-3 0 400 800 1200 1600 2000

TIME (ns)

1.5

-40

-20 0 20 40 60 80 100 120

TEMPERATURE (°C)

FIGURE 19. LARGE SIGNAL (4.7V) STEP RESPONSE FIGURE 20. SUPPLY CURRENT vs TEMPERATURE,

VS = ±2.5V ENABLED, RL = INF


800

700

600

500

VOS (µV)

400

300

200

100

0

-100

-200


n = 100


N

MEDIA



MAX


MIN

-3.0


-3.2


-3.4


IBIAS+ (µA)

-3.6


-3.8


-4.0


-4.2


-4.4


-4.6


n = 100


MEDIAN


MAX


MIN

-40 -20 0 20 40 60 80 100 120

TEMPERATURE (°C)

-40 -20 0 20 40 60 80 100 120

TEMPERATURE (°C)

FIGURE 21. VOS vs TEMPERATURE, VS = ±2.5V FIGURE 22. IBIAS+ vs TEMPERATURE, VS = ±2.5V



-3.0

-3.2

-3.4

-3.6

IBIAS- (µA)

-3.8

-4.0

-4.2

-4.4

-4.6

-4.8

-5.0


n = 100

MAX



MEDIAN


800


600


IIO (nA)

400


200


0


-200


-400


n = 100


MIN

MEDIAN


MAX



MIN

-40 -20 0 20 40 60 80 100 120

TEMPERATURE (°C)

-40 -20 0 20 40 60 80 100 120

TEMPERATURE (°C)

FIGURE 23. IBIAS- vs TEMPERATURE, VS = ±2.5V FIGURE 24. IIO vs TEMPERATURE, VS = ±2.5V


Typical Performance Curves (Continued)

n = 100

160


82 n = 100

150

140

CMRR (dB)

130

120

110

100

90

80

70


MEDIAN

MAX


MIN

80 MAX


MEDIAN

PSRR (dB)

78


76


MIN

74


72


70

-40 -20 0 20 40 60 80 100 120

TEMPERATURE (°C)

FIGURE 25. CMRR vs TEMPERATURE, VCM = 3.8V, VS = ±2.5V

-40 -20 0 20 40 60 80 100 120

TEMPERATURE (°C)

FIGURE 26. PSRR vs TEMPERATURE ±1.5V TO ±2.5V


4.990


4.985


VOUT (V)

4.980


4.975


4.970


4.965


4.960

60

n = 100

55

50

45

VOUT (mV)

40

35

30

25 MEDIAN 20

15

n = 100
















MAX





MEDIAN





























MIN





10


MAX


MIN

-40 -20 0 20 40 60 80 100 120

TEMPERATURE (°C)

-40 -20 0 20 40 60 80 100 120

TEMPERATURE (°C)

FIGURE 27. POSITIVE VOUT vs TEMPERATURE, RL = 1k VS = ±2.5V FIGURE 28. NEGATIVE VOUT vs TEMPERATURE, RL = 1k

VS = ±2.5V



VCM OVERHEAD TO SUPPLY RAILS (V)

1.2

1.0

0.8

0.6

0.4

0.2

0

-0.2

-0.4

-0.6

-0.8


INPUT VOLTAGE TO

THE POSITIVE RAIL (V+ - VCM)


INPUT VOLTAGE TO

THE NEGATIVE RAIL (V- + VCM)

-60 -40 -20 0 20 40 60 80 100 120 140

TEMPERATURE (°C)


FIGURE 29. INPUT COMMON MODE VOLTAGE vs TEMPERATURE


Applications Information

Product Description

The ISL28191 and ISL28291 are voltage feedback operational amplifiers designed for communication and imaging applications requiring low distortion, very low voltage and current noise. Both parts feature high bandwidth while drawing moderately low supply current. They use a classical voltage-feedback topology, which allows them to be used in a variety of applications where

current-feedback amplifiers are not appropriate because of restrictions placed upon the feedback element used with the amplifier.

Enable/Power-Down

The ISL28191 and ISL28291 amplifiers are disabled by applying a voltage greater than 2V to the EN pin, with respect to the V- pin. In this condition, the output(s) will be in a high impedance state and the amplifier(s) current will be reduced to 13µA/Amp. By disabling the part, multiple parts can be connected together as a MUX. The outputs are tied together in parallel and a channel can be selected by the EN pin. The EN pin also has an internal

pull-down. If left open, the EN pin will pull to the negative rail and the device will be enabled by default.

Input Protection

All input terminals have internal ESD protection diodes to both positive and negative supply rails, limiting the input voltage to within one diode beyond the supply rails. Both parts have additional back-to-back diodes across the input terminals

(as shown in Figure 30). In pulse applications where the input Slew Rate exceeds the Slew Rate of the amplifier, the possibility exists for the input protection diodes to become forward biased. This can cause excessive input current and distortion at the outputs. If overdriving the inputs is necessary, the external input current must never exceed 5mA. An external series resistor may be used to limit the current, as shown in Figure 30.


-

R

+


FIGURE 30. LIMITING THE INPUT CURRENT TO LESS THAN 5mA

Using Only One Channel

The ISL28291 is a dual channel op amp. If the application only requires one channel when using the ISL28291, the user must configure the unused channel to prevent it from oscillating.

Oscillation can occur if the input and output pins are floating. This will result in higher than expected supply currents and possible noise injection into the channel being used. The proper way to prevent this oscillation is to short the output to the negative input and ground the positive input (as shown in Figure 31).


-


+


FIGURE 31. PREVENTING OSCILLATIONS IN UNUSED CHANNELS


Power Supply Bypassing and Printed Circuit Board Layout

As with any high frequency device, good printed circuit board layout is necessary for optimum performance. Low impedance ground plane construction is essential. Surface mount components are recommended, but if leaded components are used, lead lengths should be as short as possible. The power supply pins must be well bypassed to reduce the risk of oscillation. The combination of a 4.7µF tantalum capacitor in parallel with a 0.01µF capacitor has been shown to work well when placed at each supply pin.

For good AC performance, parasitic capacitance should be kept to a minimum, especially at the inverting input. When ground plane construction is used, it should be removed from the area near the inverting input to minimize any stray capacitance at that node. Carbon or Metal-Film resistors are acceptable with the Metal-Film resistors giving slightly less peaking and bandwidth because of additional series inductance. Use of sockets, particularly for the SOIC package, should be avoided if possible. Sockets add parasitic inductance and capacitance, which will result in additional peaking and overshoot.

Current Limiting

The ISL28191 and ISL28291 have no internal current-limiting circuitry. If the output is shorted, it is possible to exceed the Absolute Maximum Rating for output current or power dissipation, potentially resulting in the destruction of the device. This is why the output short circuit current is specified and tested with RL = 10.


Power Dissipation

It is possible to exceed the +125°C maximum junction temperatures under certain load and power-supply conditions. It is therefore important to calculate the maximum junction

temperature (TJMAX) for all applications to determine if power supply voltages, load conditions, or package type need to be

modified to remain in the safe operating area. These parameters are related in Equation 1:

TJMAX = TMAX + JAxPDMAXTOTAL

(EQ. 1)


where:


Revision History

The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest revision.

DATE

REVISION

CHANGE

July 22, 2014

FN6156.10

Updated location of note references.

Updated Theta JA in the "Thermal Information" table on page 4 and added Theta JC to table.

January 18, 2012

FN6156.9

Page 1 - Ordering Information Update: Added Eval Board ISL28191EVAL1Z

Changed micro TDFN and TQFN to Ultra matching POD Description Added SOT-23 Note

Page 10 - Typical Performance Curves:

Added Figure 29 - INPUT COMMON MODE VOLTAGE vs TEMPERATURE


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Package Outline Drawing

P6.064A

6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE

Rev 0, 2/10

1.90


0.95

0-3°

D 0.08-0.20

A

6 5 4

PIN 1 INDEX AREA

3

1.60

2.80

3 5


0.15 C D

2x 1 2

B

3


0.20 M

C

A-B

D

0.40 ±0.05

0.20 C 2x

3

SEE DETAIL X

(0.60)

TOP VIEW END VIEW


10° TYP

A-B

C

0.15

2.90

5 (2 PLCS)

2x


H


1.14 ±0.15


1.45 MAX

C



SIDE VIEW


0.05-0.15

C

0.10

SEATING PLANE

(0.25) GAUGE

PLANE


DETAIL "X" 0.45±0.1 4


(0.60)


(1.20)



NOTES:

(2.40)


(0.95)


  1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only.

  2. Dimensioning and tolerancing conform to ASME Y14.5M-1994.

  3. Dimension is exclusive of mold flash, protrusions or gate burrs.

  4. Foot length is measured at reference to guage plane.

  5. This dimension is measured at Datum “H”.

  6. Package conforms to JEDEC MO-178AA.


(1.90)


TYPICAL RECOMMENDED LAND PATTERN


Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN)


PIN 1 REFERENCE

0.15

2X


E A B

6 4


D


A

L6.1.6x1.6A

6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE

C


SYMBOL

MILLIMETERS


NOTES

MIN

NOMINAL

MAX

A

0.45

0.50

0.55

-

A1

-

-

0.05

-

A3

0.127 REF

-

b

0.15

0.20

0.25

-

D

1.55

1.60

1.65

4

D2

0.40

0.45

0.50

-

E

1.55

1.60

1.65

4

E2

0.95

1.00

1.05

-

e

0.50 BSC

-

L

0.25

0.30

0.35

-

1 3

C

0.15

2X

TOP VIEW A1


e

1.00 REF

4 6

L


D2 CO.2


3 1

E2


BOTTOM VIEW


DAP SIZE 1.30 x 0.76


b 6X



0.10 M

C

A

B




NOTES:

  1. Dimensions are in mm. Angles in degrees.


    Rev. 1 6/06


    0.10 C


    6X 0.08 C


    SIDE VIEW


    DETAIL A


    A3 C SEATING PLANE

  2. Coplanarity applies to the exposed pad as well as the terminals. Coplanarity shall not exceed 0.08mm.

  3. Warpage shall not exceed 0.10mm.

  4. Package length/package width are considered as special characteristics.

  5. JEDEC Reference MO-229.

  6. For additional information, to assist with the PCB Land Pattern Design effort, see Intersil Technical Brief TB389.


0.127±0.008


0.127 +0.058

-0.008

TERMINAL THICKNESS


A1


DETAIL A


0.25

0.50


1.00 0.45

1.00

2.00

0.30


1.25


LAND PATTERN 6


Package Outline Drawing

M8.15E

8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 0, 08/09


4

4.90 ± 0.10 A


DETAIL "A" 0.22 ± 0.03


B


6.0 ± 0.20


3.90 ± 0.10


4


PIN NO.1 ID MARK

5


0.43 ± 0.076


(0.35) x 45°


1.27

4° ± 4°



0.25 M C

A

B

TOP VIEW

SIDE VIEW “B”



    1. MAX


      0.175 ± 0.075


      1.45 ± 0.1



      0.25

      GAUGE PLANE C SEATING PLANE

      0.10 C

      SIDE VIEW “A


      0.63 ±0.23


      DETAIL "A"

      (1.27) (0.60)



      NOTES:

      (1.50)


      (5.40)


      1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only.

      2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.


      3. Unless otherwise specified, tolerance : Decimal ± 0.05


      4. Dimension does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side.

      5. The pin #1 identifier may be either a mold or mark feature.


      6. Reference to JEDEC MS-012.


TYPICAL RECOMMENDED LAND PATTERN


Package Outline Drawing

L10.1.8x1.4A

10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE

Rev 6, 8/13



1.80 A

B 1

C0.10

6 IN #1 ID



0.10 M

C

A

B

0.05 M

C


10


9 X 0.40

1 2

3 10X 0.20 4

0.50

1.40

6 PIN 1

INDEX AREA



0.10

2X


TOP VIEW

0.70

8


7 6

6X 0.40


5 4X 0.30

BOTTOM VIEW


SEE DETAIL "X"



(10X 0.20)

3


2.20


1


10 (0.70)


MAX. 0.55


SIDE VIEW

0.10 C

C

SEATING PLANE

    1. C



      1.80

      8

      5

      (9X 0.60) 6 7

        1. REF

          C

          (6X 0.40)

          PACKAGE OUTLINE

          0-0.05

          TYPICAL RECOMMENDED LAND PATTERN DETAIL "X"

          NOTES:


          1. Dimensions are in millimeters. Dimensions in ( ) for Reference Only.

          2. Dimensioning and tolerancing conform to ASME Y14.5m-1994.


          3. Unless otherwise specified, tolerance : Decimal ± 0.05


          4. Lead width dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip.


          5. JEDEC reference MO-255.


          6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature.


      Package Outline Drawing

      M10.118A (JEDEC MO-187-BA)

      10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE (MSOP)

      Rev 0, 9/09


      3.0 ± 0.1


      10

      A


      0.25 C A B


      DETAIL "X"


      1.10 Max



      3.0 ± 0.1

      4.9 ± 0.15

      SIDE VIEW 2 0.18 ± 0.05


      PIN# 1 ID B


      1 2


      0.5 BSC


      0.95 BSC


      TOP VIEW



      H


      0.23 +0.07/ -0.08

      0.08 C

      A

      B


      SIDE VIEW 1


      0.86 ± 0.09

      C SEATING PLANE

      0.10 ± 0.05

      0.10 C


      0.55 ± 0.15


      DETAIL "X"

      Gauge Plane


      0.25


      3°±3°



      5.80

      4.40

      3.00


      NOTES:

      1. Dimensions are in millimeters.



0.50


1.40


TYPICAL RECOMMENDED LAND PATTERN


0.30

  1. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.

  2. Plastic or metal protrusions of 0.15mm max per side are not included.

  3. Plastic interlead protrusions of 0.25mm max per side are not included.

  4. Dimensions “D” and “E1” are measured at Datum Plane “H”.


  5. This replaces existing drawing # MDP0043 MSOP10L.

Mouser Electronics


Authorized Distributor


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ISL28191FHZ-T7 ISL28191FRUZ-T7 ISL28291FBZ ISL28291FBZ-T7 ISL28291FRUZ-T7 ISL28291FUZ ISL28291FUZ-T7