DATASHEET
ISL28191, ISL28291
Single and Dual Single Supply Ultra-Low Noise, Low Distortion Rail-to-Rail Output, Op Amp
FN6156 Rev 10.00
July 22, 2014
The ISL28191 and ISL28291 are tiny single and dual ultra-low noise, ultra-low distortion operational amplifiers. They are fully specified to operate down to +3V single supply. These amplifiers have outputs that swing rail-to-rail and an input common mode voltage that extends to ground
(ground sensing).
The ISL28191 and ISL28291 are unity gain stable with an input referred voltage noise of 1.7nV/Hz. Both parts feature 0.00018% THD+N at 1kHz.
The ISL28191 is available in the space-saving 6 Ld UTDFN (1.6mmx1.6mm) and 6 Ld SOT-23 packages. The ISL28291 is available in the 8 Ld SOIC, 10 Ld 1.8mmx1.4mm UTQFN and 10 Ld MSOP packages. All devices are guaranteed over -40°C to +125°C.
PART NUMBER | PART MARKING | PACKAGE (Pb-free) | PKG. DWG. # |
GABJ | 6 Ld SOT-23 | P6.064A | |
M8 | 6 Ld UTDFN | L6.1.6x1.6A | |
8291Z | 10 Ld MSOP | M10.118A | |
8291Z | 10 Ld MSOP | M10.118A | |
28291 FBZ | 8 Ld SOIC | M8.15E | |
28291 FBZ | 8 Ld SOIC | M8.15E | |
F | 10 Ld UTQFN | L10.1.8x1.4A | |
ISL28191EVAL1Z | Evaluation Board | ||
ISL28291EVAL1Z | Evaluation Board |
NOTES:
Please refer to TB347 for details on reel specifications.
For Moisture Sensitivity Level (MSL), please see device information page for ISL28191, ISL28291. For more information on MSL please see techbrief TB363.
1.7nV/√Hz input voltage noise at 1kHz
1kHz THD+N typical 0.00018% at 2VP-P VOUT
Harmonic Distortion -76dBc, -70dBc, fo = 1MHz
61MHz -3dB bandwidth
630µV maximum offset voltage
3µA input bias current
100dB typical CMRR
3V to 5.5V single supply voltage range
Rail-to-rail output
Ground Sensing
Enable pin (not available in the 8 Ld SOIC package option)
Pb-free (RoHS compliant)
Low noise signal processing
Low noise microphones/preamplifiers
ADC buffers
DAC output amplifiers
Digital scales
Strain gauges/sensor amplifiers
Radio systems
Portable equipment
Infrared detectors
AN1343: ISL2829xEVAL1Z, ISL5529xEVAL1Z Evaluation Board User’s Guide
FN6156 Rev 10.00 Page 1 of 18
ISL28191 (6 LD SOT-23)
TOP VIEW
ISL28191
(6 LD 1.6X1.6X0.5 UTDFN) TOP VIEW
OUT 1
6 V +
OUT 1
6 V+
V- 2
+ -
IN+ 3
5 EN
4 IN-
IN- 2
IN+ 3
5 EN
- +
4 V-
ISL28291 (8 LD SOIC) TOP VIEW
ISL28291 (10 LD MSOP)
TOP VIEW
1
OUT_A
2
IN-_A -
3
IN+_A +
-
4
V- +
5
6
7
8
V+ OUT_B IN-_B IN+_B
OUT_A 1
IN-_A 2 -
IN+_A 3 +
V- 4
10 V+
9 OUT_B
- 8 IN-_B
+ 7 IN+_B
EN_A 5 6 EN_B
ISL28291 (10 LD UTQFN)
OUT_A
V+
OUT_B
TOP VIEW
10
9
8
1
IN-_A
-
+
V-
EN_A
EN_B
IN+_A 2
IN-_B
7
-
6
+
IN+_B
3
4
5
ISL28191 (6 Ld SOT-23) | ISL28191 (6 Ld UTDFN) | ISL28291 (8 Ld SOIC) | ISL28291 (10 Ld MSOP) | ISL28291 (10 Ld UTQFN) | PIN NAME | FUNCTION | EQUIVALENT CIRCUIT | ||||
4 | 2 | 2 (A) 6 (B) | 2 (A) 8 (B) | 1 (A) 7 (B) | IN- IN-_A IN-_B | Inverting input | IN- | Circuit 1 | V+ IN+ V- | ||
3 | 3 | 3 (A) 5 (B) | 3 (A) 7 (B) | 2 (A) 6 (B) | IN+ IN+_B IN+_B | Non-inverting input | (See circuit 1) | ||||
2 | 4 | 4 | 4 | 3 | V- | Negative supply | |||||
1 | 1 | 1 (A) 7 (B) | 1 (A) 9 (B) | 10 (A) 8 (B) | OUT OUT_A OUT_B | Output | Circuit 2 | V+ OUT V- | |||
6 | 6 | 8 | 10 | 9 | V+ | Positive supply | |||||
5 | 5 | N/A | 5 (A) 6 (B) | 4 (A) 5 (B) | EN EN_A EN_B | Enable BAR pin internal pull-down; Logic “1” selects the disabled state; Logic “0” selects the enabled state. | EN | Circuit 3 | V+ V- |
Absolute Maximum Ratings (TA = +25°C) | |||
Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5V | Thermal Resistance (Typical) | JA (°C/W) | JC (°C/W) |
Supply Turn On Voltage Slew Rate . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1V/µs | 6 Ld SOT-23 Package (Notes 6, 9) . . . . . . . | 170 | 105 |
Differential Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5mA | 6 Ld UTDFN Package (Notes 7, 8) . . . . . . . | 125 | 80 |
Differential Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0.5V | 8 Ld SOIC Package (Notes 6, 9) . . . . . . . . . | 110 | 82 |
Input Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V- - 0.5V to V+ + 0.5V | 10 Ld MSOP Package (Notes 6, 9) . . . . . . . | 175 | 90 |
ESD Tolerance | 10 Ld UTQFN Package (Notes 6, 9) . . . . . . | 190 | 140 |
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300V
Charged Device Model (CDM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1200V
Ambient Operating Temperature Range . . . . . . . . . . . . . .-40°C to +125°C Maximum Operating Junction Temperature . . . . . . . . . . . . . . . . . +125°C Supply Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3V to 5.5V
Storage Temperature Range. . . . . . . . . . . . . . . . . . . . . . . .-65°C to +150°C
Pb-Free Reflow Profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . see link below http://www.intersil.com/pbfree/Pb-FreeReflow.asp
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and result in failures not covered by warranty.
NOTE:
JA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
JA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379.
For JC, the “case temp” location is the center of the exposed metal pad on the package underside.
For JC, the “case temp” location is taken at the package top center.
Electrical Specifications V+ = 5.0V, V- = GND, RL = Open RF = 1k AV = -1 unless otherwise specified. Parameters are per amplifier. Typical values are at V+= 5V, TA = +25°C. Boldface limits apply over the operating temperature range, -40°C to +125°C.
PARAMETER | DESCRIPTION | CONDITIONS | MIN (Note 10) | TYP | MAX (Note 10) | UNIT |
DC SPECIFICATIONS | ||||||
VOS | Input Offset Voltage | 270 | 630 | µV | ||
840 | ||||||
VOS ---------------- T | Input Offset Drift vs Temperature | 3.1 | µV/°C | |||
IIO | Input Offset Current | 35 | 500 | nA | ||
900 | ||||||
IB | Input Bias Current | 3 | 6 | µA | ||
7 | ||||||
CMIR | Common-Mode Input Range | 0 | 3.8 | V | ||
CMRR | Common-Mode Rejection Ratio | VCM = 0V to 3.8V | 78 | 100 | dB | |
PSRR | Power Supply Rejection Ratio | VS = 3V to 5V | 74 | 80 | dB | |
AVOL | Large Signal Voltage Gain | VO = 0.5V to 4V, RL = 1k | 90 | 98 | dB | |
86 | ||||||
VOUT | Maximum Output Voltage Swing | Output low, RL = 1k | 20 | 50 | mV | |
80 | ||||||
Output high, RL = 1k V+ = 5V | 4.95 | 4.97 | V | |||
4.92 | ||||||
IS,ON | Supply Current per Amplifier, Enabled | 2.6 | 3.5 | mA | ||
3.9 | ||||||
IS,OFF | Supply Current per Amplifier, Disabled | 26 | 35 | µA | ||
48 | ||||||
IO+ | Short-Circuit Output Current | RL = 10 | 95 | 130 | mA | |
90 |
Electrical Specifications V+ = 5.0V, V- = GND, RL = Open RF = 1k AV = -1 unless otherwise specified. Parameters are per amplifier. Typical values are at V+= 5V, TA = +25°C. Boldface limits apply over the operating temperature range, -40°C to +125°C. (Continued)
PARAMETER | DESCRIPTION | CONDITIONS | MIN (Note 10) | TYP | MAX (Note 10) | UNIT |
IO- | Short-Circuit Output Current | RL = 10 | 95 | 130 | mA | |
90 | ||||||
VSUPPLY | Supply Operating Range | V+ to V- | 3 | 5.5 | V | |
VENH | EN High Level | Referred to V- | 2 | V | ||
VENL | EN Low Level | Referred to V- | 0.8 | V | ||
IENH | EN Pin Input High Current | VEN = V+ | 0.8 | 1.1 | µA | |
1.3 | ||||||
IENL | EN Pin Input Low Current | VEN = V- | 20 | 80 | nA | |
100 | ||||||
AC SPECIFICATIONS | ||||||
GBW | -3dB Unity Gain Bandwidth | RF = 0 CL = 20pF, AV = 1, RL = 10k | 61 | MHz | ||
THD+N | Total Harmonic Distortion + Noise | f = 1kHz. VOUT + 2VP-P, AV = +1, RL = 10k | 0.0001 | % | ||
8 | ||||||
HD (1MHz) | 2nd Harmonic Distortion | 2VP-P output voltage, AV = 1 | -76 | dBc | ||
3rd Harmonic Distortion | -70 | dBc | ||||
ISO | Off-state Isolation fO = 100kHz | AV = +1, VIN = 100mVP-P, RF = 0 CL = 20pF, AV = 1, RL = 10k | -38 | dB | ||
X-TALK ISL28291 | Channel-to-Channel Crosstalk fO = 100kHz | VS = ±2.5V, AV = +1, VIN = 1VP-P, RF = 0 CL = 20pF, AV = 1, RL = 10k | -105 | dB | ||
PSRR | Power Supply Rejection Ratio fO = 100kHz | VS = ±2.5V, AV = +1, VSOURCE = 1VP-P, RF = 0 CL = 20pF, AV = 1, RL = 10k | -70 | dB | ||
CMRR | Common Mode Rejection Ratio fO = 100kHz | VS = ±2.5V, AV = +1, VCM = 1VP-P, RF = 0 CL = 20pF, AV = 1, RL = 10k | -65 | dB | ||
en | Input Referred Voltage Noise | fO = 1kHz | 1.7 | nV/√Hz | ||
in | Input Referred Current Noise | fO = 1kHz | 1.8 | pA/√Hz | ||
TRANSIENT RESPONSE | ||||||
SR | Slew Rate | 12 | 17 | V/µs | ||
12 | ||||||
tr, tf, Small Signal | Rise Time, tr 10% to 90% | AV = 1, VOUT = 0.1VP-P, RL = 10k, CL = 1.2pF | 7 | ns | ||
Fall Time, tf 90% to 10% | 12 | ns | ||||
tr, tf Large Signal | Rise Time, tr 10% to 90% | AV = 2, VOUT = 1VP-P; RL = 10k RF /RG = 499499 CL = 1.2pF | 44 | ns | ||
Fall Time, tf 90% to 10% | 50 | ns | ||||
Rise Time, tr 10% to 90% | AV = 2, VOUT = 4.7VP-P; RL = 10k RF /RG = 499499 CL = 1.2pF | 190 | ns | |||
Fall Time, tf 90% to 10% | 190 | ns | ||||
tEN | ENABLE to Output Turn-on Delay Time; 10% EN - 10% VOUT | AV = 1, VOUT = 1VDC, RL = 10k, CL = 1.2pF | 330 | ns | ||
ENABLE to Output Turn-off Delay Time; 10% EN - 10% VOUT | AV = 1, VOUT = 0VDC, RL = 10k, CL = 1.2pF | 50 | ns |
NOTE:
3 10
RL = 100k
2
CLOSED LOOP GAIN (dB)
1
0
-1
-2 RL = 10k
-3
8 CL = 110pF
CLOSED LOOP GAIN (dB)
6 CL = 57pF
4 CL = 57pF
2 CL = 32pF
0
-2 CL = 10pF
-4 V+ = 5V
-5 AV = +1
RL = 1k
-4 V+ = 5V
-6 AV = +1
CL = 20pF
CL = 10pF
-6 VOUT = 10mVP-P
-7
RL = 100
-8
-10
RL = 10k
VOUT = 10mVP-P
10k 100k 1M 10M 100M FREQUENCY (Hz)
10k 100k 1M 10M 100M FREQUENCY (Hz)
FIGURE 1. GAIN vs FREQUENCY FOR VARIOUS RLOAD FIGURE 2. GAIN vs FREQUENCY FOR VARIOUS CLOAD
2 VOUT = 1mVP-P
1 VOUT = 10mVP-P
CLOSED LOOP GAIN (dB)
0
-1
-2 VOUT = 100mVP-P
70
AV = 1000, RF = 499k, RG = 499
60
50
GAIN (dB)
40
V+ = 5V RL = 10k
VOUT = 100mVP-P
-3
-4
-5 V+ = 5V
-6 AV = +1 RL = 10k
-7 CL = 10pF
-8
VOUT = 1VP-P
30
20
10
0
-10
AV = 100, RF = 49.9k, RG = 499
AV = 10, RF = 4.42k, RG = 499
AV = 1, RF = 0, RG = INF
10k 100k 1M 10M 100M FREQUENCY (Hz)
10k 100k 1M 10M 100M FREQUENCY (Hz)
FIGURE 3. -3dB BANDWIDTH vs VOUT FIGURE 4. FREQUENCY RESPONSE vs CLOSED LOOP GAIN
OUTPUT IMPEDANCE ()
1M 100k
V+ = 5V, 3V
ENABLED AND DISABLED VSOURCE = 1VP-P
INPUT IMPEDANCE ()
100k
10k
10k
V+ = 5V, 3V VSOURCE = 1VP-P
1k
1k
10k | 100k | 1M | 10M | 100M | 10k | 100k | 1M | 10M | 100M |
FREQUENCY (Hz) | FREQUENCY (Hz) |
100 100
FIGURE 5. INPUT IMPEDANCE vs FREQUENCY FIGURE 6. DISABLED OUTPUT IMPEDANCE vs FREQUENCY
100
V+ = 5V, 3V
OUTPUT IMPEDANCE ()
VSOURCE = 1V
10
VSOURCE = 0.1V
1
0.10
10
0
-10
-20
CMRR (dB)
-30
-40
-50
-60
-70
-80
-90
-100
V+ = 5V AV = +1 RL = 10k CL = 10pF
VOUT = 100mVP-P
10k 100k 1M 10M 100M
1k 10k
100k
1M 10M
100M
FREQUENCY (Hz) FREQUENCY (Hz)
FIGURE 7. ENABLED OUTPUT IMPEDANCE vs FREQUENCY FIGURE 8. CMRR vs FREQUENCY
10
0
-10
-20
PSRR (dB)
-30
-40
-50
-60
-70
-80
-90
-100
V+ = 5V AV = +1 RL = 10k
CL = 10pF
VOUT = 100mVP-P
PSRR+
PSRR-+
0
-10
OFF ISOLATION (dB)
-20
-30
-40
-50
-60
-70
-80
VP-P = 1V
VP-P = 10mV VP-P = 100mV
V+ = 5V AV = +1 RL = 10k
CL = 10pF
1k 10k
100k
1M 10M
100M
10k 100k 1M 10M 100M 1G
FREQUENCY (Hz) FREQUENCY (Hz)
FIGURE 9. PSRR vs FREQUENCY FIGURE 10. OFF ISOLATION vs FREQUENCY
-30
-40
CROSSTALK (dB)
-50
-60
-70
-80
-90
-100
-110
10k | 100k | 1M 10M | 100M | 1G | 0 | 2k 4k 6k 8k 10k 12k 14k 16k 18k 20k |
FREQUENCY (Hz) | FREQUENCY (Hz) |
-120
VP-P = 1V
0.1
THD + NOISE (%)
0.01
0.001
0.0001
V+ = 5V RL = 10k
RF = 0, AV = 1 VOUT = 2VP-P
400Hz TO 22kHz FILTER
FIGURE 11. CHANNEL TO CHANNEL CROSSTALK vs FREQUENCY FIGURE 12. THD+N vs FREQUENCY
1
THD +NOISE (%)
0.1
V+ = 5V 10
INPUT VOLTAGE NOISE (nV/ÖHz)
AV = +1 RL = 10k
FREQUENCY = 1kHz
FILTER = 400Hz TO 22kHz
0.01
0.001
0.1 | 1 | 10 100 1k | 10k | 100k | |||||||
VOUT (VP-P) | FREQUENCY (Hz) |
0.0001 1
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
FIGURE 13. THD+N @ 1kHz vs VOUT FIGURE 14. INPUT REFERRED NOISE VOLTAGE vs FREQUENCY
CURRENT NOISE (pA/Hz)
100
10
5
4
VOLTS (V)
3
2
ENABLE
EN INPUT
DISABLE
V+ = 5V AV = +1 RL = 10k CL = 10pF
VIN = 1VDC
ENABLE
1
0.1
1 10 100 1k 10k FREQUENCY (Hz)
100k
1
OUTPUT
0
-1 0 1 2 3 4
TIME (µs)
FIGURE 15. INPUT REFERRED NOISE CURRENT vs FREQUENCY FIGURE 16. ENABLE/DISABLE TIMING
0.08
0.06
SMALL SIGNAL (V)
0.04
0.02
0
-0.02
-0.04
V+ = ±2.5V AV = +1
RL = 10k
VIN
VOUT
0.8
0.6
LARGE SIGNAL (V)
0.4
0.2
0
-0.2
-0.4
VOUT VIN
V+ = ±2.5V AV = +2
RF = RG = 499
-0.06
-0.08
VOUT = 100mVP-P
0 20 40 60 80 100 120 140 160 180 200
TIME (ns)
-0.6
-0.8
RL = 10k VOUT = 1VP-P
0 100 200 300 400 500 600 700 800
TIME (ns)
FIGURE 17. SMALL SIGNAL STEP RESPONSE FIGURE 18. LARGE SIGNAL (1V) STEP RESPONSE
3
VOUT
2
3.5
3.3
3.1
n = 100
MEDIAN
MAX
LARGE SIGNAL (V)
VIN
1
0
-1 V+ = ±2.5V
AV = +2
-2 RF = RG = 499
RL = 10k
VOUT = 4.7VP-P
2.9
CURRENT (mA)
2.7
2.5
2.3
2.1
1.9
1.7
MIN
-3 0 400 800 1200 1600 2000
TIME (ns)
1.5
-40
-20 0 20 40 60 80 100 120
TEMPERATURE (°C)
FIGURE 19. LARGE SIGNAL (4.7V) STEP RESPONSE FIGURE 20. SUPPLY CURRENT vs TEMPERATURE,
VS = ±2.5V ENABLED, RL = INF
800
700
600
500
VOS (µV)
400
300
200
100
0
-100
-200
n = 100
N
MEDIA
MAX
MIN
-3.0
-3.2
-3.4
IBIAS+ (µA)
-3.6
-3.8
-4.0
-4.2
-4.4
-4.6
n = 100
MEDIAN
MAX
MIN
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
FIGURE 21. VOS vs TEMPERATURE, VS = ±2.5V FIGURE 22. IBIAS+ vs TEMPERATURE, VS = ±2.5V
-3.0
-3.2
-3.4
-3.6
IBIAS- (µA)
-3.8
-4.0
-4.2
-4.4
-4.6
-4.8
-5.0
n = 100
MAX
MEDIAN
800
600
IIO (nA)
400
200
0
-200
-400
n = 100
MIN
MEDIAN
MAX
MIN
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
FIGURE 23. IBIAS- vs TEMPERATURE, VS = ±2.5V FIGURE 24. IIO vs TEMPERATURE, VS = ±2.5V
n = 100
160
82 n = 100
150
140
CMRR (dB)
130
120
110
100
90
80
70
MEDIAN
MAX
MIN
80 MAX
MEDIAN
PSRR (dB)
78
76
MIN
74
72
70
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
FIGURE 25. CMRR vs TEMPERATURE, VCM = 3.8V, VS = ±2.5V
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
FIGURE 26. PSRR vs TEMPERATURE ±1.5V TO ±2.5V
4.990
4.985
VOUT (V)
4.980
4.975
4.970
4.965
4.960
60
n = 100
55
50
45
VOUT (mV)
40
35
30
25 MEDIAN 20
15
n = 100 | ||||||||
MAX | ||||||||
MEDIAN | ||||||||
MIN |
10
MAX
MIN
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
-40 -20 0 20 40 60 80 100 120
TEMPERATURE (°C)
FIGURE 27. POSITIVE VOUT vs TEMPERATURE, RL = 1k VS = ±2.5V FIGURE 28. NEGATIVE VOUT vs TEMPERATURE, RL = 1k
VS = ±2.5V
VCM OVERHEAD TO SUPPLY RAILS (V)
1.2
1.0
0.8
0.6
0.4
0.2
0
-0.2
-0.4
-0.6
-0.8
INPUT VOLTAGE TO
THE POSITIVE RAIL (V+ - VCM)
INPUT VOLTAGE TO
THE NEGATIVE RAIL (V- + VCM)
-60 -40 -20 0 20 40 60 80 100 120 140
TEMPERATURE (°C)
FIGURE 29. INPUT COMMON MODE VOLTAGE vs TEMPERATURE
The ISL28191 and ISL28291 are voltage feedback operational amplifiers designed for communication and imaging applications requiring low distortion, very low voltage and current noise. Both parts feature high bandwidth while drawing moderately low supply current. They use a classical voltage-feedback topology, which allows them to be used in a variety of applications where
current-feedback amplifiers are not appropriate because of restrictions placed upon the feedback element used with the amplifier.
The ISL28191 and ISL28291 amplifiers are disabled by applying a voltage greater than 2V to the EN pin, with respect to the V- pin. In this condition, the output(s) will be in a high impedance state and the amplifier(s) current will be reduced to 13µA/Amp. By disabling the part, multiple parts can be connected together as a MUX. The outputs are tied together in parallel and a channel can be selected by the EN pin. The EN pin also has an internal
pull-down. If left open, the EN pin will pull to the negative rail and the device will be enabled by default.
All input terminals have internal ESD protection diodes to both positive and negative supply rails, limiting the input voltage to within one diode beyond the supply rails. Both parts have additional back-to-back diodes across the input terminals
-
R
+
FIGURE 30. LIMITING THE INPUT CURRENT TO LESS THAN 5mA
The ISL28291 is a dual channel op amp. If the application only requires one channel when using the ISL28291, the user must configure the unused channel to prevent it from oscillating.
-
+
FIGURE 31. PREVENTING OSCILLATIONS IN UNUSED CHANNELS
As with any high frequency device, good printed circuit board layout is necessary for optimum performance. Low impedance ground plane construction is essential. Surface mount components are recommended, but if leaded components are used, lead lengths should be as short as possible. The power supply pins must be well bypassed to reduce the risk of oscillation. The combination of a 4.7µF tantalum capacitor in parallel with a 0.01µF capacitor has been shown to work well when placed at each supply pin.
For good AC performance, parasitic capacitance should be kept to a minimum, especially at the inverting input. When ground plane construction is used, it should be removed from the area near the inverting input to minimize any stray capacitance at that node. Carbon or Metal-Film resistors are acceptable with the Metal-Film resistors giving slightly less peaking and bandwidth because of additional series inductance. Use of sockets, particularly for the SOIC package, should be avoided if possible. Sockets add parasitic inductance and capacitance, which will result in additional peaking and overshoot.
The ISL28191 and ISL28291 have no internal current-limiting circuitry. If the output is shorted, it is possible to exceed the Absolute Maximum Rating for output current or power dissipation, potentially resulting in the destruction of the device. This is why the output short circuit current is specified and tested with RL = 10.
It is possible to exceed the +125°C maximum junction temperatures under certain load and power-supply conditions. It is therefore important to calculate the maximum junction
temperature (TJMAX) for all applications to determine if power supply voltages, load conditions, or package type need to be
modified to remain in the safe operating area. These parameters are related in Equation 1:
TJMAX = TMAX + JAxPDMAXTOTAL
where:
PDMAXTOTAL is the sum of the maximum power dissipation of each amplifier in the package (PDMAX)
PDMAX for each amplifier can be calculated in Equation 2:
VOUTMAX
R
PDMAX = 2*VS ISMAX + VS - VOUTMAX ----------------------------
L
where:
TMAX = Maximum ambient temperature
JA = Thermal resistance of the package
PDMAX = Maximum power dissipation of 1 amplifier
VS = Supply voltage
IMAX = Maximum supply current of 1 amplifier
VOUTMAX = Maximum output voltage swing of the application
RL = Load resistance
The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest revision.
DATE | REVISION | CHANGE |
July 22, 2014 | FN6156.10 | Updated location of note references. Updated Theta JA in the "Thermal Information" table on page 4 and added Theta JC to table. |
January 18, 2012 | FN6156.9 | Page 1 - Ordering Information Update: Added Eval Board ISL28191EVAL1Z Changed micro TDFN and TQFN to Ultra matching POD Description Added SOT-23 Note Page 10 - Typical Performance Curves: Added Figure 29 - INPUT COMMON MODE VOLTAGE vs TEMPERATURE |
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6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE
Rev 0, 2/10
1.90
0.95
0-3°
D 0.08-0.20
A
6 5 4
PIN 1 INDEX AREA
3
1.60
2.80
3 5
0.15 C D
2x 1 2
B
3
0.20 M | C | A-B | D |
0.40 ±0.05
0.20 C 2x
3
SEE DETAIL X
(0.60)
TOP VIEW END VIEW
10° TYP
A-B
C
0.15
2.90
5 (2 PLCS)
2x
H
1.14 ±0.15
1.45 MAX
C
SIDE VIEW
0.05-0.15
C
0.10
SEATING PLANE
(0.25) GAUGE
PLANE
DETAIL "X" 0.45±0.1 4
(0.60)
(1.20)
NOTES:
(2.40)
(0.95)
Dimensions are in millimeters. Dimensions in ( ) for Reference Only.
Dimensioning and tolerancing conform to ASME Y14.5M-1994.
Dimension is exclusive of mold flash, protrusions or gate burrs.
Foot length is measured at reference to guage plane.
This dimension is measured at Datum “H”.
Package conforms to JEDEC MO-178AA.
(1.90)
TYPICAL RECOMMENDED LAND PATTERN
Ultra Thin Dual Flat No-Lead Plastic Package (UTDFN)
PIN 1 REFERENCE
0.15
2X
E A B
6 4
D
A
L6.1.6x1.6A
6 LEAD ULTRA THIN DUAL FLAT NO-LEAD PLASTIC PACKAGE
C
SYMBOL | MILLIMETERS | NOTES | ||
MIN | NOMINAL | MAX | ||
A | 0.45 | 0.50 | 0.55 | - |
A1 | - | - | 0.05 | - |
A3 | 0.127 REF | - | ||
b | 0.15 | 0.20 | 0.25 | - |
D | 1.55 | 1.60 | 1.65 | 4 |
D2 | 0.40 | 0.45 | 0.50 | - |
E | 1.55 | 1.60 | 1.65 | 4 |
E2 | 0.95 | 1.00 | 1.05 | - |
e | 0.50 BSC | - | ||
L | 0.25 | 0.30 | 0.35 | - |
1 3
C
0.15
2X
TOP VIEW A1
e
1.00 REF
4 6
L
D2 CO.2
3 1
E2
BOTTOM VIEW
DAP SIZE 1.30 x 0.76
b 6X
0.10 M | C | A | B | ||
NOTES:
Dimensions are in mm. Angles in degrees.
Rev. 1 6/06
0.10 C
6X 0.08 C
SIDE VIEW
DETAIL A
A3 C SEATING PLANE
Coplanarity applies to the exposed pad as well as the terminals. Coplanarity shall not exceed 0.08mm.
Warpage shall not exceed 0.10mm.
Package length/package width are considered as special characteristics.
JEDEC Reference MO-229.
For additional information, to assist with the PCB Land Pattern Design effort, see Intersil Technical Brief TB389.
0.127±0.008
0.127 +0.058
-0.008
TERMINAL THICKNESS
A1
DETAIL A
0.25
0.50
1.00 0.45
1.00
2.00
0.30
1.25
LAND PATTERN 6
8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE Rev 0, 08/09
4
4.90 ± 0.10 A
DETAIL "A" 0.22 ± 0.03
B
6.0 ± 0.20
3.90 ± 0.10
4
PIN NO.1 ID MARK
5
0.43 ± 0.076
(0.35) x 45°
1.27
4° ± 4°
0.25 M C | A | B |
TOP VIEW
SIDE VIEW “B”
MAX
0.175 ± 0.075
1.45 ± 0.1
0.25
GAUGE PLANE C SEATING PLANE
0.10 C
SIDE VIEW “A
0.63 ±0.23
DETAIL "A"
(1.27) (0.60)
NOTES:
(1.50)
(5.40)
Dimensions are in millimeters. Dimensions in ( ) for Reference Only.
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
Unless otherwise specified, tolerance : Decimal ± 0.05
Dimension does not include interlead flash or protrusions. Interlead flash or protrusions shall not exceed 0.25mm per side.
The pin #1 identifier may be either a mold or mark feature.
Reference to JEDEC MS-012.
TYPICAL RECOMMENDED LAND PATTERN
10 LEAD ULTRA THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 6, 8/13
1.80 A
B 1
C0.10
6 IN #1 ID
0.10 M | C | A | B | |
0.05 M | C |
10
9 X 0.40
1 2
3 10X 0.20 4
0.50
1.40
6 PIN 1
INDEX AREA
0.10
2X
TOP VIEW
0.70
8
7 6
6X 0.40
5 4X 0.30
BOTTOM VIEW
SEE DETAIL "X"
(10X 0.20)
3
2.20
1
10 (0.70)
MAX. 0.55
SIDE VIEW
0.10 C
C
SEATING PLANE
C
1.80
8
5
(9X 0.60) 6 7
REF
C
(6X 0.40)
PACKAGE OUTLINE
0-0.05
TYPICAL RECOMMENDED LAND PATTERN DETAIL "X"
NOTES:
Dimensions are in millimeters. Dimensions in ( ) for Reference Only.
Dimensioning and tolerancing conform to ASME Y14.5m-1994.
Unless otherwise specified, tolerance : Decimal ± 0.05
Lead width dimension applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip.
JEDEC reference MO-255.
The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature.
10 LEAD MINI SMALL OUTLINE PLASTIC PACKAGE (MSOP)
Rev 0, 9/09
3.0 ± 0.1
10
A
0.25 C A B
DETAIL "X"
1.10 Max
3.0 ± 0.1
4.9 ± 0.15
SIDE VIEW 2 0.18 ± 0.05
PIN# 1 ID B
1 2
0.5 BSC
0.95 BSC
TOP VIEW
H
0.23 +0.07/ -0.08
0.08 C | A | B |
SIDE VIEW 1
0.86 ± 0.09
C SEATING PLANE
0.10 ± 0.05
0.10 C
0.55 ± 0.15
DETAIL "X"
Gauge Plane
0.25
3°±3°
5.80
4.40
3.00
NOTES:
Dimensions are in millimeters.
0.50
1.40
TYPICAL RECOMMENDED LAND PATTERN
0.30
Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
Plastic or metal protrusions of 0.15mm max per side are not included.
Plastic interlead protrusions of 0.25mm max per side are not included.
Dimensions “D” and “E1” are measured at Datum Plane “H”.
This replaces existing drawing # MDP0043 MSOP10L.
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