Published February 28, 2024 | Version CC-BY-NC-ND 4.0
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A Comprehensive Study on Failure Modes and Mechanisms of Thin Film Chip Resistors

  • 1. Department of Space, U R Rao Satellite Center, Components Quality Control Group, Spacecraft Reliability and Quality Area, Bengaluru (Karnataka), India.

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  • 1. Department of Space, U R Rao Satellite Center, Components Quality Control Group, Spacecraft Reliability and Quality Area, Bengaluru (Karnataka), India.
  • 2. Department of Space, U R Rao Satellite Center, Components Quality Control Group, Spacecraft Reliability and Quality Area, Bengaluru (Karnataka), India.

Description

Abstract: Usually, resistors and capacitors populate majority portion of a common electrical circuit, hence miniaturization drive of any package or subsystem starts with miniaturized resistor and capacitors. In this context, thin film chip resistors are the most sought-after components for any electronic/electrical circuit due to their small size, wide range of values, military temperature range, stringent tolerance, low TCR value (recognised with PPM). Increased use of thin-film surface mount chip resistors in military and space application has led to an increased awareness of its potential failure modes in harsh environments. Thin film resistor with lower TCR (5PPM, 10PPM and 25PPM) are most preferable and widely used because of very low temperature coefficient of resistance (TCR) and high resistivity, which suits for high precision measurement application. Low temperature coefficients characteristics of thin film resistors also makes them stable and reliable. Because of their high-volume usage in recent times, failure in thin film resistor with lower TCR/PPM (Parts per Million) are also being seen more predominantly. In general, there are two types of thin film chip resistors, one is discrete type and the other is die type or wire bondable type. Discrete type chip resistor are used directly on cards, whereas, die type/wire bondable type chip resistors used in hermetically sealed HMC packages. Standard failure mode of a resistor is open mode or high resistance mode, whereas short mode failure has a very low probability. Hence in this paper, failure modes and mechanisms of both types of thin film chip resistors, with respect to common failure causes such as EOS, ESD are discussed, which is in continuation to Fabrication/Workmanship related failures discussed in our earlier technical paper. With this, all possible failure modes and mechanism related thin film chip resistors are explained. Discussion in totality always provide in depth analysis on a subject of concern, which in turn facilitate reliability assessment of the component and corrective action, if any.

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Accepted
2024-02-15
Manuscript received on 01 January 2024 | Revised Manuscript received on 10 January 2024 | Manuscript Accepted on 15 February 2024 | Manuscript published on 28 February 2024.

References

  • Larry Bos, IEEE Transactions on Components, Packaging, And Manufacturing Technology-Part A. VOL. 17, No. 3, September, 1994, Pp.359. https://doi.org/10.1109/95.311744
  • C.L. Au, M.A. Jackson, W.A. Anderson, Structural and Electrical Properties of Stable Ni/Cr Thin Films, J. Electron. Mater., 16 (1987) Pp.301. https://doi.org/10.1007/BF02653370
  • G. Nocerino, K.E. Singer, Resistance Stabilization of Ni-Cr Films by Surface Oxide Formation, J. Vac. Sci. Technol., 16 (1979) Pp.147. https://doi.org/10.1116/1.569890
  • S. Hofmann, A. Zalar, Correlation Between Electrical Properties and AES Concentration-Depth Profiles of NiCr Thin Films, Thin Solid Films 39 (1976) Pp.219. https://doi.org/10.1016/0040- 6090(76)90639-8
  • T. Couteau, "High Sheet Resistance Thin Films Tor Precision Resistor Applications," In Proc. Capacitor and Resistor Technology Symp. 1991, Pp. 152-156.
  • Time Dependent Open mode failures in Thin Film Chip Resistors, S.K. Dash and M.P. James, International Journal of Emerging Technology and Advanced Engineering, Volume 10, Issue 05, May 2020, Pp.50.
  • Mustapha, I., Ashfaq, M., & Qureshi, M. I. (2019). A New Integrated Framework for ISO 9001 Quality Management System Maintenance in Malaysia. In International Journal of Innovative Technology and Exploring Engineering (Vol. 9, Issue 2, pp. 4519–4527). https://doi.org/10.35940/ijitee.b9019.129219
  • Poetri, I. A. V., Pratama, V. A., & Sari, E. T. (2020). Maximum Profit on the Electrical Appliance Store in Sidoarjo. In International Journal of Management and Humanities (Vol. 4, Issue 9, pp. 162–165). https://doi.org/10.35940/ijmh.i0925.054920
  • Bhargava, C., Gulati, S., & Sharma, P. K. (2019). Estimation of Residual Lifetime of Electrolytic Capacitor using Analytical Techniques. In International Journal of Recent Technology and Engineering (IJRTE) (Vol. 8, Issue 2, pp. 2015–2019). https://doi.org/10.35940/ijrte.b2082.078219
  • Brahamne, P., Chawla, Assoc. Prof. M. P. S., & Verma, Dr. H. K. (2023). Optimal Sizing of Hybrid Renewable Energy System using Manta Ray Foraging Technique. In International Journal of Emerging Science and Engineering (Vol. 11, Issue 3, pp. 8–16). https://doi.org/10.35940/ijese.c2545.0211323
  • Sengar, N., & Parakh, A. (2020). Remote Control, Protection and Monitoring of Pump for Agricultural Purposes. In International Journal of Innovative Science and Modern Engineering (Vol. 6, Issue 12, pp. 7–10). https://doi.org/10.35940/ijisme.l1271.1261220