Published March 5, 2022 | Version v1
Conference paper Open

Assembly of mobile 5G transceiver based on photonic motherboard

  • 1. PHIX Photonics Assembly
  • 2. Fraunhofer Heinrich Hertz Institute
  • 3. Fraunhofer Institute for Telecommunications Einsteinufer 37 Terahertz Sensors and Systems,Berlin,Germany,10587

Description

We describe the assembly of a 5G transceiver leveraging photonics for the generation, emission and detection of
THz wireless signals. The transceiver and all associated control electronics and power supplies are designed for
mounting in a mobile aerial unit. A photonics motherboard concept that brings together polymer, III-V and SiN based
photonic platforms and provides optical fiber connectivity is used for the assembly. In addition, scalable
integration of 3D components, in this case an antenna rod or rod array, is demonstrated. Thermal considerations
arising from the dense integration of photonic and electronic components and the resulting concentrated heat
load are also discussed.

Files

Assembly of mobile 5G transceiver based on photonic motherboard, Photonics West, 2022.pdf

Additional details

Funding

TERAWAY – Terahertz technology for ultra-broadband and ultra-wideband operation of backhaul and fronthaul links in systems with SDN management of network and radio resources 871668
European Commission