Conference paper Open Access
Assembly of mobile 5G transceiver based on photonic motherboard
Bradley W. Snyder;
Zerihun G. Tegegne;
Nienke Nijenhuis;
Tianwen Qian;
David de Felipe;
Simon Nellen;
Milan Deumer;
Y. Durvasa Gupta;
Moritz Baier;
Björn Globisch;
Norbert Keil;
Joost Van Kerkhof
We describe the assembly of a 5G transceiver leveraging photonics for the generation, emission and detection of
THz wireless signals. The transceiver and all associated control electronics and power supplies are designed for
mounting in a mobile aerial unit. A photonics motherboard concept that brings together polymer, III-V and SiN based
photonic platforms and provides optical fiber connectivity is used for the assembly. In addition, scalable
integration of 3D components, in this case an antenna rod or rod array, is demonstrated. Thermal considerations
arising from the dense integration of photonic and electronic components and the resulting concentrated heat
load are also discussed.
| Name | Size | |
|---|---|---|
|
Assembly of mobile 5G transceiver based on photonic motherboard, Photonics West, 2022.pdf
md5:faa8bdfc82f14b6e7e3e7d6e5bda0b5d |
19.0 MB | Download |
| Views | 24 |
| Downloads | 14 |
| Data volume | 265.7 MB |
| Unique views | 20 |
| Unique downloads | 13 |
- Publication date:
- March 5, 2022
- DOI:
-
- Keyword(s):
- Photonics hybrid integration 5G transceiver photonic motherboard
- Grants:
-
European Commission:
- TERAWAY - Terahertz technology for ultra-broadband and ultra-wideband operation of backhaul and fronthaul links in systems with SDN management of network and radio resources (871668)
- Meeting:
- Photonics West 2022, San Francisco, California, United States, 25 - 27 January 2022
- Communities:
- License (for files):
- Creative Commons Attribution 4.0 International