Taghikhani, Parastoo
Buisman, Koen
Versleijen, Martin
Perez-Cisneros, Jose-Ramon
Fager, Christian
2021-12-23
<p>In this paper, we propose an efficient methodology for the electrothermal characterization of power amplifier (PA) integrated circuits. The proposed electrothermal analysis method predicts the effect of temperature variations on the key performances of PAs, such as gain and linearity, under realistic dynamic operating conditions. A comprehensive technique for identifying an equivalent compact thermal model, using data from 3-D finite element method thermal simulation and nonlinear curve fitting algorithms, is described. Two efficient methods for electrothermal analysis applying the developed compact thermal model are reported. The validity of the methods is evaluated using commercially available electrothermal computer-aided design (CAD) tools and through extensive pulsed RF signal measurements of a PA device under test. The measurement results confirm the validity of the proposed electrothermal analysis methods. The proposed methods show significantly faster simulation speed comparing to available CAD tools for electrothermal analysis. Moreover, the results reveal the importance of electrothermal characterization in the</p>
https://doi.org/10.5281/zenodo.5801076
oai:zenodo.org:5801076
eng
Zenodo
https://zenodo.org/communities/serena-h2020
https://zenodo.org/communities/eu
https://doi.org/10.5281/zenodo.5801075
info:eu-repo/semantics/openAccess
Creative Commons Attribution 4.0 International
https://creativecommons.org/licenses/by/4.0/legalcode
IEEE Transactions on Microwave Theory and Techniques, (2021-12-23)
Electrothermal characterization
thermal modeling
thermal network extraction
heat dissipation
thermal impedance identification
power amplifier linearity
EVM
Temperature-dependent Characterization of Power Amplifiers Using an Efficient Electrothermal Analysis Technique
info:eu-repo/semantics/article