December 23, 2021 Journal article Open Access

Taghikhani, Parastoo; Buisman, Koen; Versleijen, Martin; Perez-Cisneros, Jose-Ramon; Fager, Christian

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<?xml version='1.0' encoding='utf-8'?>
<resource xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns="http://datacite.org/schema/kernel-4" xsi:schemaLocation="http://datacite.org/schema/kernel-4 http://schema.datacite.org/meta/kernel-4.1/metadata.xsd">
  <identifier identifierType="DOI">10.5281/zenodo.5801076</identifier>
  <creators>
    <creator>
      <creatorName>Taghikhani, Parastoo</creatorName>
      <givenName>Parastoo</givenName>
      <familyName>Taghikhani</familyName>
      <affiliation>Chalmers University</affiliation>
    </creator>
    <creator>
      <creatorName>Buisman, Koen</creatorName>
      <givenName>Koen</givenName>
      <familyName>Buisman</familyName>
      <affiliation>Chalmers University</affiliation>
    </creator>
    <creator>
      <creatorName>Versleijen, Martin</creatorName>
      <givenName>Martin</givenName>
      <familyName>Versleijen</familyName>
      <affiliation>Chalmers University</affiliation>
    </creator>
    <creator>
      <creatorName>Perez-Cisneros, Jose-Ramon</creatorName>
      <givenName>Jose-Ramon</givenName>
      <familyName>Perez-Cisneros</familyName>
      <affiliation>Chalmers University</affiliation>
    </creator>
    <creator>
      <creatorName>Fager, Christian</creatorName>
      <givenName>Christian</givenName>
      <familyName>Fager</familyName>
      <affiliation>Chalmers University</affiliation>
    </creator>
  </creators>
  <titles>
    <title>Temperature-dependent Characterization of Power Amplifiers Using an Efficient Electrothermal Analysis Technique</title>
  </titles>
  <publisher>Zenodo</publisher>
  <publicationYear>2021</publicationYear>
  <subjects>
    <subject>Electrothermal characterization</subject>
    <subject>thermal modeling</subject>
    <subject>thermal network extraction</subject>
    <subject>heat dissipation</subject>
    <subject>thermal impedance identification</subject>
    <subject>power amplifier linearity</subject>
    <subject>EVM</subject>
  </subjects>
  <dates>
    <date dateType="Issued">2021-12-23</date>
  </dates>
  <language>en</language>
  <resourceType resourceTypeGeneral="JournalArticle"/>
  <alternateIdentifiers>
    <alternateIdentifier alternateIdentifierType="url">https://zenodo.org/record/5801076</alternateIdentifier>
  </alternateIdentifiers>
  <relatedIdentifiers>
    <relatedIdentifier relatedIdentifierType="DOI" relationType="IsVersionOf">10.5281/zenodo.5801075</relatedIdentifier>
    <relatedIdentifier relatedIdentifierType="URL" relationType="IsPartOf">https://zenodo.org/communities/serena-h2020</relatedIdentifier>
  </relatedIdentifiers>
  <rightsList>
    <rights rightsURI="https://creativecommons.org/licenses/by/4.0/legalcode">Creative Commons Attribution 4.0 International</rights>
    <rights rightsURI="info:eu-repo/semantics/openAccess">Open Access</rights>
  </rightsList>
  <descriptions>
    <description descriptionType="Abstract">&lt;p&gt;In this paper, we propose an efficient methodology for the electrothermal characterization of power amplifier (PA) integrated circuits. The proposed electrothermal analysis method predicts the effect of temperature variations on the key performances of PAs, such as gain and linearity, under realistic dynamic operating conditions. A comprehensive technique for identifying an equivalent compact thermal model, using data from 3-D finite element method thermal simulation and nonlinear curve fitting algorithms, is described. Two efficient methods for electrothermal analysis applying the developed compact thermal model are reported. The validity of the methods is evaluated using commercially available electrothermal computer-aided design (CAD) tools and through extensive pulsed RF signal measurements of a PA device under test. The measurement results confirm the validity of the proposed electrothermal analysis methods. The proposed methods show significantly faster simulation speed comparing to available CAD tools for electrothermal analysis. Moreover, the results reveal the importance of electrothermal characterization in the&lt;/p&gt;</description>
  </descriptions>
  <fundingReferences>
    <fundingReference>
      <funderName>European Commission</funderName>
      <funderIdentifier funderIdentifierType="Crossref Funder ID">10.13039/100010661</funderIdentifier>
      <awardNumber awardURI="info:eu-repo/grantAgreement/EC/H2020/779305/">779305</awardNumber>
      <awardTitle>gan-on-Silicon Efficient mm-wave euRopean systEm iNtegration plAtform</awardTitle>
    </fundingReference>
  </fundingReferences>
</resource>