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Analytical RF Pulse Heating Analysis for High Gradient Accelerating Structures

Daniel González Iglesias; Daniel Esperante; Benito Gimeno; Marçà Boronat; César Blanch; Nuria Fuster-Martínez; Pablo Martinez-Reviriego; Pablo Martín Luna; Juan Fuster

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<oai_dc:dc xmlns:dc="" xmlns:oai_dc="" xmlns:xsi="" xsi:schemaLocation="">
  <dc:creator>Daniel González Iglesias</dc:creator>
  <dc:creator>Daniel Esperante</dc:creator>
  <dc:creator>Benito Gimeno</dc:creator>
  <dc:creator>Marçà Boronat</dc:creator>
  <dc:creator>César Blanch</dc:creator>
  <dc:creator>Nuria Fuster-Martínez</dc:creator>
  <dc:creator>Pablo Martinez-Reviriego</dc:creator>
  <dc:creator>Pablo Martín Luna</dc:creator>
  <dc:creator>Juan Fuster</dc:creator>
  <dc:description>The main aim of this work is to present a simple
method, based on analytical expressions, for obtaining the temperature
increase due to the Joule effect inside the metallic walls
of an RF accelerating component. This technique relies on solving
the 1D heat transfer equation for a thick wall, considering that
the heat sources inside the wall are the ohmic losses produced
by the RF electromagnetic fields penetrating into the metal with
finite electrical conductivity. Furthermore, it is discussed how the
theoretical expressions of this method can be applied to obtain
an approximation to the temperature increase in realistic 3D
RF accelerating structures, taking as an example the cavity of
an RF electron photoinjector and a travelling wave linac cavity.
These theoretical results have been benchmarked with numerical
simulations carried out with a commercial Finite Element Method
(FEM) software, finding good agreement among them. Besides,
the advantage of the analytical method with respect to the
numerical simulations is evidenced. In particular, the model could
be very useful during the design and optimization phase of RF
accelerating structures, where many different combinations of
parameters must be analysed in order to obtain the proper
working point of the device, allowing to save time and speed
up the process. However, it must be mentioned that the method
described in this manuscript is intended to provide a quick
approximation to the temperature increase in the device, which of
course is not as accurate as the proper 3D numerical simulations
of the component.</dc:description>
  <dc:subject>RF pulse heating</dc:subject>
  <dc:subject>thermal analysis</dc:subject>
  <dc:subject>RF accelerating structures</dc:subject>
  <dc:title>Analytical RF Pulse Heating Analysis for High Gradient Accelerating Structures</dc:title>
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