Conference paper Open Access
Totaro, Massimo;
Bernardeschi, Irene;
Wang, Hongbo;
Beccai, Lucia
<?xml version='1.0' encoding='utf-8'?> <resource xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns="http://datacite.org/schema/kernel-4" xsi:schemaLocation="http://datacite.org/schema/kernel-4 http://schema.datacite.org/meta/kernel-4.1/metadata.xsd"> <identifier identifierType="URL">https://zenodo.org/record/4252769</identifier> <creators> <creator> <creatorName>Totaro, Massimo</creatorName> <givenName>Massimo</givenName> <familyName>Totaro</familyName> <affiliation>Istituto Italiano di Tecnologia</affiliation> </creator> <creator> <creatorName>Bernardeschi, Irene</creatorName> <givenName>Irene</givenName> <familyName>Bernardeschi</familyName> <affiliation>Istituto Italiano di Tecnologia</affiliation> </creator> <creator> <creatorName>Wang, Hongbo</creatorName> <givenName>Hongbo</givenName> <familyName>Wang</familyName> <nameIdentifier nameIdentifierScheme="ORCID" schemeURI="http://orcid.org/">0000-0002-6546-1241</nameIdentifier> <affiliation>Istituto Italiano di Tecnologia</affiliation> </creator> <creator> <creatorName>Beccai, Lucia</creatorName> <givenName>Lucia</givenName> <familyName>Beccai</familyName> <affiliation>Istituto Italiano di Tecnologia</affiliation> </creator> </creators> <titles> <title>Analysis and optimization of fully foam-based capacitive sensors</title> </titles> <publisher>Zenodo</publisher> <publicationYear>2020</publicationYear> <subjects> <subject>Soft sensors</subject> <subject>conductive foam</subject> <subject>Capacitive sensors</subject> <subject>tactile sensing</subject> <subject>porous materials</subject> <subject>Porous materials modeling</subject> <subject>FEA</subject> </subjects> <dates> <date dateType="Issued">2020-06-15</date> </dates> <language>en</language> <resourceType resourceTypeGeneral="ConferencePaper"/> <alternateIdentifiers> <alternateIdentifier alternateIdentifierType="url">https://zenodo.org/record/4252769</alternateIdentifier> </alternateIdentifiers> <relatedIdentifiers> <relatedIdentifier relatedIdentifierType="DOI" relationType="IsIdenticalTo">10.1109/RoboSoft48309.2020.9116014</relatedIdentifier> <relatedIdentifier relatedIdentifierType="URL" relationType="IsPartOf">https://zenodo.org/communities/3d-sits</relatedIdentifier> </relatedIdentifiers> <version>V_final_submmision</version> <rightsList> <rights rightsURI="https://creativecommons.org/licenses/by/4.0/legalcode">Creative Commons Attribution 4.0 International</rights> <rights rightsURI="info:eu-repo/semantics/openAccess">Open Access</rights> </rightsList> <descriptions> <description descriptionType="Abstract"><p>This paper presents the electromechanical analysis of ultra-light and highly compressible capacitive pressure sensors based on open-cell foams, with top and bottom surface electrodes built by PEDOT:PSS coating. Multiple samples of porous capacitive sensors were characterized, and experimental results were compared by means of both FEM simulations and theoretical analysis. The agreement between experiments and theoretical/numerical prediction is good, suggesting that this methodology can be a useful tool for fine tuning of the sensor performance (i.e. sensitivity, range) for specific applications. Finally, the proposed foam sensor provides a low-cost, easy-to-implement, robust sensing solution for real-world applications in robotics and wearable systems.</p></description> <description descriptionType="Other">This is the final manuscript submitted for publication. For request of research data or any other detail, please contact Dr Massimo Totaro, massimo.totaro@iit.it</description> </descriptions> <fundingReferences> <fundingReference> <funderName>European Commission</funderName> <funderIdentifier funderIdentifierType="Crossref Funder ID">10.13039/100010661</funderIdentifier> <awardNumber awardURI="info:eu-repo/grantAgreement/EC/H2020/799773/">799773</awardNumber> <awardTitle>3D Stretchable Inductive Tactile Sensors for Soft Artificial Touch</awardTitle> </fundingReference> </fundingReferences> </resource>
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