SERENA
Published August 5, 2020 | Version v1
Conference paper Open

A Novel Packaging and System-Integration Platform with Integrated Antennas for Scalable, Low-Cost and High-Performance 5G mmWave Systems

Creators

  • 1. Fraunhofer Institute for Reliability and Microintegration (IZM)
  • 2. Ericsson

Description

In this work, we present a novel packaging and system-integration platform with integrated antennas (antenna-in-package, AiP, platform) for 5G millimeter-wave (mmWave) systems. We illustrate the application of the platform for the development of miniaturized, scalable, low-cost and high-performance 5G mmWave systems for new radio (NR) base stations. RF characterization of the dielectric material of the platform and the integrated mmWave antennas as well as thermal investigations of the platform are presented. The process steps required for the fabrication of the platform are discussed, and an example of a mmWave chip embedded in the platform is shown.

Files

ECTC-Paper-639_A-novel-system-integration-platform.pdf

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Additional details

Related works

Is previous version of
10.1109/ECTC32862.2020.00029 (DOI)

Funding

SERENA – gan-on-Silicon Efficient mm-wave euRopean systEm iNtegration plAtform 779305
European Commission