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Multi-Physical Simulations and Modelling of an Integrated GaN-on-Si Module Concept for Millimetre-Wave Communications

Rasilainen, Kimmo; Buisman, Koen; Andersson, Kristoffer; Fager, Christian


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  <identifier identifierType="DOI">10.5281/zenodo.3945938</identifier>
  <creators>
    <creator>
      <creatorName>Rasilainen, Kimmo</creatorName>
      <givenName>Kimmo</givenName>
      <familyName>Rasilainen</familyName>
      <affiliation>Chalmers University of Technology</affiliation>
    </creator>
    <creator>
      <creatorName>Buisman, Koen</creatorName>
      <givenName>Koen</givenName>
      <familyName>Buisman</familyName>
      <affiliation>Chalmers University of Technology</affiliation>
    </creator>
    <creator>
      <creatorName>Andersson, Kristoffer</creatorName>
      <givenName>Kristoffer</givenName>
      <familyName>Andersson</familyName>
      <affiliation>Ericsson AB</affiliation>
    </creator>
    <creator>
      <creatorName>Fager, Christian</creatorName>
      <givenName>Christian</givenName>
      <familyName>Fager</familyName>
      <affiliation>Chalmers University of Technology</affiliation>
    </creator>
  </creators>
  <titles>
    <title>Multi-Physical Simulations and Modelling of an Integrated GaN-on-Si Module Concept for Millimetre-Wave Communications</title>
  </titles>
  <publisher>Zenodo</publisher>
  <publicationYear>2020</publicationYear>
  <dates>
    <date dateType="Issued">2020-06-30</date>
  </dates>
  <resourceType resourceTypeGeneral="ConferencePaper"/>
  <alternateIdentifiers>
    <alternateIdentifier alternateIdentifierType="url">https://zenodo.org/record/3945938</alternateIdentifier>
  </alternateIdentifiers>
  <relatedIdentifiers>
    <relatedIdentifier relatedIdentifierType="DOI" relationType="IsVersionOf">10.5281/zenodo.3945937</relatedIdentifier>
  </relatedIdentifiers>
  <rightsList>
    <rights rightsURI="https://creativecommons.org/licenses/by/4.0/legalcode">Creative Commons Attribution 4.0 International</rights>
    <rights rightsURI="info:eu-repo/semantics/openAccess">Open Access</rights>
  </rightsList>
  <descriptions>
    <description descriptionType="Abstract">&lt;p&gt;This paper presents a multi-physical system-level simulation workflow to characterise the performance of a heterogeneously&lt;br&gt;
integrated communications module for mm-wave applications. Basic principles behind modelling different parts&lt;br&gt;
and properties of the module are explained. The workflow combines the electromagnetic properties of a patch antenna array&lt;br&gt;
operating at 39GHz with polynomial-based power amplifier (PA) models and thermal simulations of the structural heating. Effects&lt;br&gt;
of heating on the PA properties are also considered. The PA model is based on and compared with circuit simulations of a&lt;br&gt;
mm-wave transceiver chip, and the results are in good agreement. The proposed workflow can be used to describe and predict the performance of the module in different spatio-temporal use cases,&lt;br&gt;
and the approach also scales to larger arrays and more detailed simulation models.&lt;/p&gt;</description>
  </descriptions>
  <fundingReferences>
    <fundingReference>
      <funderName>European Commission</funderName>
      <funderIdentifier funderIdentifierType="Crossref Funder ID">10.13039/100010661</funderIdentifier>
      <awardNumber awardURI="info:eu-repo/grantAgreement/EC/H2020/779305/">779305</awardNumber>
      <awardTitle>gan-on-Silicon Efficient mm-wave euRopean systEm iNtegration plAtform</awardTitle>
    </fundingReference>
  </fundingReferences>
</resource>
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