Conference paper Open Access

Multi-Physical Simulations and Modelling of an Integrated GaN-on-Si Module Concept for Millimetre-Wave Communications

Rasilainen, Kimmo; Buisman, Koen; Andersson, Kristoffer; Fager, Christian


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{
  "publisher": "Zenodo", 
  "DOI": "10.5281/zenodo.3945938", 
  "author": [
    {
      "family": "Rasilainen, Kimmo"
    }, 
    {
      "family": "Buisman, Koen"
    }, 
    {
      "family": "Andersson, Kristoffer"
    }, 
    {
      "family": "Fager, Christian"
    }
  ], 
  "issued": {
    "date-parts": [
      [
        2020, 
        6, 
        30
      ]
    ]
  }, 
  "abstract": "<p>This paper presents a multi-physical system-level simulation workflow to characterise the performance of a heterogeneously<br>\nintegrated communications module for mm-wave applications. Basic principles behind modelling different parts<br>\nand properties of the module are explained. The workflow combines the electromagnetic properties of a patch antenna array<br>\noperating at 39GHz with polynomial-based power amplifier (PA) models and thermal simulations of the structural heating. Effects<br>\nof heating on the PA properties are also considered. The PA model is based on and compared with circuit simulations of a<br>\nmm-wave transceiver chip, and the results are in good agreement. The proposed workflow can be used to describe and predict the performance of the module in different spatio-temporal use cases,<br>\nand the approach also scales to larger arrays and more detailed simulation models.</p>", 
  "title": "Multi-Physical Simulations and Modelling of an Integrated GaN-on-Si Module Concept for Millimetre-Wave Communications", 
  "type": "paper-conference", 
  "id": "3945938"
}
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