Conference paper Open Access

Micro-transfer-printing for heterogeneous integration

Corbett, B.; Li, Z; Buehler, K.; Naumann, F.; Krieger, U.; Wicht, S.; Bower, C.A.


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{
  "inLanguage": {
    "alternateName": "eng", 
    "@type": "Language", 
    "name": "English"
  }, 
  "description": "<p>Micro-transfer-printing is a key enabling technology for the heterogeneous integration of different materials and devices. The technique is particularly applicable to photonics where a typical system requires diverse arrays of components.</p>", 
  "license": "https://creativecommons.org/licenses/by/4.0/legalcode", 
  "creator": [
    {
      "affiliation": "Tyndall National Institute", 
      "@type": "Person", 
      "name": "Corbett, B."
    }, 
    {
      "affiliation": "Tyndall National Institute", 
      "@type": "Person", 
      "name": "Li, Z"
    }, 
    {
      "affiliation": "Fraunhofer Institute for Microstructure of Materials and Systems", 
      "@type": "Person", 
      "name": "Buehler, K."
    }, 
    {
      "affiliation": "Fraunhofer Institute for Microstructure of Materials and Systems", 
      "@type": "Person", 
      "name": "Naumann, F."
    }, 
    {
      "affiliation": "X-FAB MEMS Foundry GmbH", 
      "@type": "Person", 
      "name": "Krieger, U."
    }, 
    {
      "affiliation": "X-FAB MEMS Foundry GmbH", 
      "@type": "Person", 
      "name": "Wicht, S."
    }, 
    {
      "affiliation": "X-Celeprint Inc", 
      "@type": "Person", 
      "name": "Bower, C.A."
    }
  ], 
  "headline": "Micro-transfer-printing for heterogeneous integration", 
  "image": "https://zenodo.org/static/img/logos/zenodo-gradient-round.svg", 
  "datePublished": "2020-02-11", 
  "url": "https://zenodo.org/record/3662515", 
  "@type": "ScholarlyArticle", 
  "@context": "https://schema.org/", 
  "identifier": "https://doi.org/10.23919/LTB-3D.2019.8735381", 
  "@id": "https://doi.org/10.23919/LTB-3D.2019.8735381", 
  "workFeatured": {
    "alternateName": "LTB-3D", 
    "@type": "Event", 
    "name": "2019 6th International Workshop on Low Temperature Bonding for 3D Integration"
  }, 
  "name": "Micro-transfer-printing for heterogeneous integration"
}
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