February 11, 2020 Conference paper Open Access

Corbett, B.; Li, Z; Buehler, K.; Naumann, F.; Krieger, U.; Wicht, S.; Bower, C.A.

DataCite XML Export

<?xml version='1.0' encoding='utf-8'?>
<resource xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns="http://datacite.org/schema/kernel-4" xsi:schemaLocation="http://datacite.org/schema/kernel-4 http://schema.datacite.org/meta/kernel-4.1/metadata.xsd">
  <identifier identifierType="URL">https://zenodo.org/record/3662515</identifier>
  <creators>
    <creator>
      <creatorName>Corbett, B.</creatorName>
      <givenName>B.</givenName>
      <familyName>Corbett</familyName>
      <affiliation>Tyndall National Institute</affiliation>
    </creator>
    <creator>
      <creatorName>Li, Z</creatorName>
      <givenName>Z</givenName>
      <familyName>Li</familyName>
      <affiliation>Tyndall National Institute</affiliation>
    </creator>
    <creator>
      <creatorName>Buehler, K.</creatorName>
      <givenName>K.</givenName>
      <familyName>Buehler</familyName>
      <affiliation>Fraunhofer Institute for Microstructure of Materials and Systems</affiliation>
    </creator>
    <creator>
      <creatorName>Naumann, F.</creatorName>
      <givenName>F.</givenName>
      <familyName>Naumann</familyName>
      <affiliation>Fraunhofer Institute for Microstructure of Materials and Systems</affiliation>
    </creator>
    <creator>
      <creatorName>Krieger, U.</creatorName>
      <givenName>U.</givenName>
      <familyName>Krieger</familyName>
      <affiliation>X-FAB MEMS Foundry GmbH</affiliation>
    </creator>
    <creator>
      <creatorName>Wicht, S.</creatorName>
      <givenName>S.</givenName>
      <familyName>Wicht</familyName>
      <affiliation>X-FAB MEMS Foundry GmbH</affiliation>
    </creator>
    <creator>
      <creatorName>Bower, C.A.</creatorName>
      <givenName>C.A.</givenName>
      <familyName>Bower</familyName>
      <affiliation>X-Celeprint Inc</affiliation>
    </creator>
  </creators>
  <titles>
    <title>Micro-transfer-printing for heterogeneous integration</title>
  </titles>
  <publisher>Zenodo</publisher>
  <publicationYear>2020</publicationYear>
  <dates>
    <date dateType="Issued">2020-02-11</date>
  </dates>
  <language>en</language>
  <resourceType resourceTypeGeneral="Text">Conference paper</resourceType>
  <alternateIdentifiers>
    <alternateIdentifier alternateIdentifierType="url">https://zenodo.org/record/3662515</alternateIdentifier>
  </alternateIdentifiers>
  <relatedIdentifiers>
    <relatedIdentifier relatedIdentifierType="DOI" relationType="IsIdenticalTo">10.23919/LTB-3D.2019.8735381</relatedIdentifier>
    <relatedIdentifier relatedIdentifierType="URL" relationType="IsPartOf">https://zenodo.org/communities/microprince</relatedIdentifier>
  </relatedIdentifiers>
  <rightsList>
    <rights rightsURI="https://creativecommons.org/licenses/by/4.0/legalcode">Creative Commons Attribution 4.0 International</rights>
    <rights rightsURI="info:eu-repo/semantics/openAccess">Open Access</rights>
  </rightsList>
  <descriptions>
    <description descriptionType="Abstract">&lt;p&gt;Micro-transfer-printing is a key enabling technology for the heterogeneous integration of different materials and devices. The technique is particularly applicable to photonics where a typical system requires diverse arrays of components.&lt;/p&gt;</description>
  </descriptions>
  <fundingReferences>
    <fundingReference>
      <funderName>European Commission</funderName>
      <funderIdentifier funderIdentifierType="Crossref Funder ID">10.13039/501100000780</funderIdentifier>
      <awardNumber awardURI="info:eu-repo/grantAgreement/EC/H2020/737465/">737465</awardNumber>
      <awardTitle>Pilot line for micro-transfer-printing of functional components on wafer level</awardTitle>
    </fundingReference>
  </fundingReferences>
</resource>