Conference paper Open Access

F-band Low-loss Tapered Slot Transition for Millimeter-wave System Packaging

Hassona, Ahmed; Zhongxia, Simon He; Vassilev, Vessen; Zirath, Herbert


MARC21 XML Export

<?xml version='1.0' encoding='UTF-8'?>
<record xmlns="http://www.loc.gov/MARC21/slim">
  <leader>00000nam##2200000uu#4500</leader>
  <datafield tag="041" ind1=" " ind2=" ">
    <subfield code="a">eng</subfield>
  </datafield>
  <datafield tag="653" ind1=" " ind2=" ">
    <subfield code="a">waveguide transition</subfield>
  </datafield>
  <datafield tag="653" ind1=" " ind2=" ">
    <subfield code="a">tapered slot</subfield>
  </datafield>
  <datafield tag="653" ind1=" " ind2=" ">
    <subfield code="a">F-band</subfield>
  </datafield>
  <datafield tag="653" ind1=" " ind2=" ">
    <subfield code="a">millimeter-waves</subfield>
  </datafield>
  <datafield tag="653" ind1=" " ind2=" ">
    <subfield code="a">GaAs</subfield>
  </datafield>
  <controlfield tag="005">20200120171813.0</controlfield>
  <controlfield tag="001">3564613</controlfield>
  <datafield tag="711" ind1=" " ind2=" ">
    <subfield code="d">2019</subfield>
    <subfield code="g">EuMC</subfield>
    <subfield code="a">49th European Microwave Conference</subfield>
    <subfield code="c">Paris, France</subfield>
  </datafield>
  <datafield tag="700" ind1=" " ind2=" ">
    <subfield code="u">Chalmers University of Technology</subfield>
    <subfield code="a">Zhongxia, Simon He</subfield>
  </datafield>
  <datafield tag="700" ind1=" " ind2=" ">
    <subfield code="u">Chalmers University of Technology</subfield>
    <subfield code="a">Vassilev, Vessen</subfield>
  </datafield>
  <datafield tag="700" ind1=" " ind2=" ">
    <subfield code="u">Chalmers University of Technology</subfield>
    <subfield code="a">Zirath, Herbert</subfield>
  </datafield>
  <datafield tag="856" ind1="4" ind2=" ">
    <subfield code="s">1205255</subfield>
    <subfield code="z">md5:973ef1b5b87773b193b74b6950d6b934</subfield>
    <subfield code="u">https://zenodo.org/record/3564613/files/LTS_Fband_C2T.pdf</subfield>
  </datafield>
  <datafield tag="542" ind1=" " ind2=" ">
    <subfield code="l">open</subfield>
  </datafield>
  <datafield tag="260" ind1=" " ind2=" ">
    <subfield code="c">2019-11-25</subfield>
  </datafield>
  <datafield tag="909" ind1="C" ind2="O">
    <subfield code="p">openaire</subfield>
    <subfield code="p">user-car2tera-h2020</subfield>
    <subfield code="o">oai:zenodo.org:3564613</subfield>
  </datafield>
  <datafield tag="100" ind1=" " ind2=" ">
    <subfield code="u">Chalmers University of Technology</subfield>
    <subfield code="a">Hassona, Ahmed</subfield>
  </datafield>
  <datafield tag="245" ind1=" " ind2=" ">
    <subfield code="a">F-band Low-loss Tapered Slot Transition for Millimeter-wave System Packaging</subfield>
  </datafield>
  <datafield tag="980" ind1=" " ind2=" ">
    <subfield code="a">user-car2tera-h2020</subfield>
  </datafield>
  <datafield tag="536" ind1=" " ind2=" ">
    <subfield code="c">824962</subfield>
    <subfield code="a">Terahertz sensors and networks for next generation smart automotive electronic systems</subfield>
  </datafield>
  <datafield tag="540" ind1=" " ind2=" ">
    <subfield code="u">https://creativecommons.org/licenses/by/4.0/legalcode</subfield>
    <subfield code="a">Creative Commons Attribution 4.0 International</subfield>
  </datafield>
  <datafield tag="650" ind1="1" ind2="7">
    <subfield code="a">cc-by</subfield>
    <subfield code="2">opendefinition.org</subfield>
  </datafield>
  <datafield tag="520" ind1=" " ind2=" ">
    <subfield code="a">&lt;p&gt;This work presents a packaging solution at F-band (90 - 140 GHz) using on-chip waveguide transition. The transition is realized using a Linearly Tapered Slot (LTS) implemented in a commercial Gallium Arsenide (GaAs) Monolithic Microwave Integrated Circuit (MMIC) technology. The LTS is mounted in the E-plane of a split-block waveguide module and fed through a microstrip line. The transition is experimentally verified using a back-to-back test structure and it exhibits an average insertion loss of 1.7 dB over the frequency range extending from 100 to 135 GHz. This work presents an on-chip packaging technique to realize the interface between MMICs and standard waveguides at millimeter-wave (mmW) frequencies and hence addressing one of the main integration challenging facing systems operating at that range.&lt;/p&gt;</subfield>
  </datafield>
  <datafield tag="773" ind1=" " ind2=" ">
    <subfield code="b">IEEE</subfield>
    <subfield code="z">978-2-87487-055-2</subfield>
    <subfield code="t">Proceedings 2019 49th European Microwave Conference (EuMC)</subfield>
  </datafield>
  <datafield tag="024" ind1=" " ind2=" ">
    <subfield code="a">10.23919/EuMC.2019.8910886</subfield>
    <subfield code="2">doi</subfield>
  </datafield>
  <datafield tag="024" ind1=" " ind2=" ">
    <subfield code="q">alternateidentifier</subfield>
    <subfield code="a">https://ieeexplore.ieee.org/abstract/document/8910886</subfield>
    <subfield code="2">url</subfield>
  </datafield>
  <datafield tag="980" ind1=" " ind2=" ">
    <subfield code="a">publication</subfield>
    <subfield code="b">conferencepaper</subfield>
  </datafield>
</record>
150
84
views
downloads
Views 150
Downloads 84
Data volume 108.2 MB
Unique views 126
Unique downloads 75

Share

Cite as