Conference paper Open Access

F-band Low-loss Tapered Slot Transition for Millimeter-wave System Packaging

Hassona, Ahmed; Zhongxia, Simon He; Vassilev, Vessen; Zirath, Herbert


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  <identifier identifierType="URL">https://zenodo.org/record/3564613</identifier>
  <creators>
    <creator>
      <creatorName>Hassona, Ahmed</creatorName>
      <givenName>Ahmed</givenName>
      <familyName>Hassona</familyName>
      <affiliation>Chalmers University of Technology</affiliation>
    </creator>
    <creator>
      <creatorName>Zhongxia, Simon He</creatorName>
      <givenName>Simon He</givenName>
      <familyName>Zhongxia</familyName>
      <affiliation>Chalmers University of Technology</affiliation>
    </creator>
    <creator>
      <creatorName>Vassilev, Vessen</creatorName>
      <givenName>Vessen</givenName>
      <familyName>Vassilev</familyName>
      <affiliation>Chalmers University of Technology</affiliation>
    </creator>
    <creator>
      <creatorName>Zirath, Herbert</creatorName>
      <givenName>Herbert</givenName>
      <familyName>Zirath</familyName>
      <affiliation>Chalmers University of Technology</affiliation>
    </creator>
  </creators>
  <titles>
    <title>F-band Low-loss Tapered Slot Transition for Millimeter-wave System Packaging</title>
  </titles>
  <publisher>Zenodo</publisher>
  <publicationYear>2019</publicationYear>
  <subjects>
    <subject>waveguide transition</subject>
    <subject>tapered slot</subject>
    <subject>F-band</subject>
    <subject>millimeter-waves</subject>
    <subject>GaAs</subject>
  </subjects>
  <dates>
    <date dateType="Issued">2019-11-25</date>
  </dates>
  <language>en</language>
  <resourceType resourceTypeGeneral="Text">Conference paper</resourceType>
  <alternateIdentifiers>
    <alternateIdentifier alternateIdentifierType="url">https://ieeexplore.ieee.org/abstract/document/8910886</alternateIdentifier>
    <alternateIdentifier alternateIdentifierType="url">https://zenodo.org/record/3564613</alternateIdentifier>
  </alternateIdentifiers>
  <relatedIdentifiers>
    <relatedIdentifier relatedIdentifierType="DOI" relationType="IsIdenticalTo">10.23919/EuMC.2019.8910886</relatedIdentifier>
    <relatedIdentifier relatedIdentifierType="URL" relationType="IsPartOf">https://zenodo.org/communities/car2tera-h2020</relatedIdentifier>
  </relatedIdentifiers>
  <rightsList>
    <rights rightsURI="https://creativecommons.org/licenses/by/4.0/legalcode">Creative Commons Attribution 4.0 International</rights>
    <rights rightsURI="info:eu-repo/semantics/openAccess">Open Access</rights>
  </rightsList>
  <descriptions>
    <description descriptionType="Abstract">&lt;p&gt;This work presents a packaging solution at F-band (90 - 140 GHz) using on-chip waveguide transition. The transition is realized using a Linearly Tapered Slot (LTS) implemented in a commercial Gallium Arsenide (GaAs) Monolithic Microwave Integrated Circuit (MMIC) technology. The LTS is mounted in the E-plane of a split-block waveguide module and fed through a microstrip line. The transition is experimentally verified using a back-to-back test structure and it exhibits an average insertion loss of 1.7 dB over the frequency range extending from 100 to 135 GHz. This work presents an on-chip packaging technique to realize the interface between MMICs and standard waveguides at millimeter-wave (mmW) frequencies and hence addressing one of the main integration challenging facing systems operating at that range.&lt;/p&gt;</description>
  </descriptions>
  <fundingReferences>
    <fundingReference>
      <funderName>European Commission</funderName>
      <funderIdentifier funderIdentifierType="Crossref Funder ID">10.13039/501100000780</funderIdentifier>
      <awardNumber awardURI="info:eu-repo/grantAgreement/EC/H2020/824962/">824962</awardNumber>
      <awardTitle>Terahertz sensors and networks for next generation smart automotive electronic systems</awardTitle>
    </fundingReference>
  </fundingReferences>
</resource>
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