July 2, 2018 Project deliverable Open Access

Ndip, Ivan; Andersson, Kristoffer; Dielacher, Franz; Papananos, Yannis; Reyes, Jacob; Tschoban, Christian; Maaß, Uwe; Ostmann, Andreas; Kosmider, Stefan

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{
  "inLanguage": {
    "alternateName": "eng", 
    "@type": "Language", 
    "name": "English"
  }, 
  "description": "<p>5G mmWave packaging requirements are given, and the specifications of the packaging platform proposed in SERENA to meet these requirements are presented. The platform is specified to meet the performance, reliability, size and cost requirements.</p>", 
  "license": "https://creativecommons.org/licenses/by/4.0/legalcode", 
  "creator": [
    {
      "affiliation": "Fraunhofer", 
      "@type": "Person", 
      "name": "Ndip, Ivan"
    }, 
    {
      "affiliation": "Ericsson", 
      "@type": "Person", 
      "name": "Andersson, Kristoffer"
    }, 
    {
      "affiliation": "Infineon Austria", 
      "@type": "Person", 
      "name": "Dielacher, Franz"
    }, 
    {
      "affiliation": "Infineon Austria", 
      "@type": "Person", 
      "name": "Papananos, Yannis"
    }, 
    {
      "affiliation": "FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.", 
      "@type": "Person", 
      "name": "Reyes, Jacob"
    }, 
    {
      "affiliation": "FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.", 
      "@type": "Person", 
      "name": "Tschoban, Christian"
    }, 
    {
      "affiliation": "FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.", 
      "@type": "Person", 
      "name": "Maa\u00df, Uwe"
    }, 
    {
      "affiliation": "FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.", 
      "@type": "Person", 
      "name": "Ostmann, Andreas"
    }, 
    {
      "affiliation": "FRAUNHOFER GESELLSCHAFT ZUR FOERDERUNG DER ANGEWANDTEN FORSCHUNG E.V.", 
      "@type": "Person", 
      "name": "Kosmider, Stefan"
    }
  ], 
  "url": "https://zenodo.org/record/3240451", 
  "datePublished": "2018-07-02", 
  "keywords": [
    "PCB embedding packaging platform", 
    "5G mmWave", 
    "39 GHz band", 
    "antennas"
  ], 
  "@context": "https://schema.org/", 
  "identifier": "https://doi.org/10.5281/zenodo.3240451", 
  "@id": "https://doi.org/10.5281/zenodo.3240451", 
  "@type": "CreativeWork", 
  "name": "Integration specifications"
}