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Integration specifications

Ndip, Ivan; Andersson, Kristoffer; Dielacher, Franz; Papananos, Yannis; Reyes, Jacob; Tschoban, Christian; Maaß, Uwe; Ostmann, Andreas; Kosmider, Stefan

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{
  "publisher": "Zenodo", 
  "DOI": "10.5281/zenodo.3240451", 
  "language": "eng", 
  "title": "Integration specifications", 
  "issued": {
    "date-parts": [
      [
        2018, 
        7, 
        2
      ]
    ]
  }, 
  "abstract": "<p>5G mmWave packaging requirements are given, and the specifications of the packaging platform proposed in SERENA to meet these requirements are presented. The platform is specified to meet the performance, reliability, size and cost requirements.</p>", 
  "author": [
    {
      "family": "Ndip, Ivan"
    }, 
    {
      "family": "Andersson, Kristoffer"
    }, 
    {
      "family": "Dielacher, Franz"
    }, 
    {
      "family": "Papananos, Yannis"
    }, 
    {
      "family": "Reyes, Jacob"
    }, 
    {
      "family": "Tschoban, Christian"
    }, 
    {
      "family": "Maa\u00df, Uwe"
    }, 
    {
      "family": "Ostmann, Andreas"
    }, 
    {
      "family": "Kosmider, Stefan"
    }
  ], 
  "type": "report", 
  "id": "3240451"
}
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Publication date:
July 2, 2018
DOI:
10.5281/zenodo.3240451

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Keyword(s):
PCB embedding packaging platform 5G mmWave 39 GHz band antennas
Grants:
European Commission:
  • SERENA - gan-on-Silicon Efficient mm-wave euRopean systEm iNtegration plAtform (779305)
Communities:
License (for files):
Creative Commons Attribution 4.0 International

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