2702429
doi
10.5281/zenodo.2702429
oai:zenodo.org:2702429
user-microprince
user-eu
Buehler, Kjell
Mittag, Marcel
Lorenz, Georg
Krieger, Uwe
Wicht, Sebastian
Günther, Daniela
Altmann, Frank
Micro-Transfer-Printing and its Process Characterization by FEA & Micromechanical Testing
Naumann, Falk
info:eu-repo/semantics/openAccess
Creative Commons Attribution 4.0 International
https://creativecommons.org/licenses/by/4.0/legalcode
micro-transfer printing
<p>X-FAB and its partners develop a new micro-assembly technology – micro-transfer-printing (μTP). It has been applied by X-Celeprint on applications ranging from OLED and micro-LEDs photonics already. The technological principle is based on parallel transfer of an array of devices from a source to a non-native target Substrate applying an elastomeric stamp. The knowledge of typical failure modes is a key element in ensuring stable production and develop strategies to prevent failures in the manufacturing process. X-FAB presents details of typical applications for heterogeneous integration by μTP and gives a brief outlook for failure modes and material characterization. In a second subsequent presentation FhG-IMWS presents related mechanical- and numerical approaches for the μTP process design.</p>
Zenodo
2019-04-10
info:eu-repo/semantics/lecture
2702428
user-microprince
user-eu
award_title=Pilot line for micro-transfer-printing of functional components on wafer level; award_number=737465; award_identifiers_scheme=url; award_identifiers_identifier=https://cordis.europa.eu/projects/737465; funder_id=00k4n6c32; funder_name=European Commission;
1579541500.337778
2057323
md5:4ea2e58fc9f16588bda8e8b4416fb664
https://zenodo.org/records/2702429/files/Naumann_CAM_WS-µTP-IWMS.pdf
public
10.5281/zenodo.2702428
isVersionOf
doi