Presentation Open Access

Micro-Transfer-Printing and its Process Characterization by FEA & Micromechanical Testing

Naumann, Falk; Buehler, Kjell; Mittag, Marcel; Lorenz, Georg; Krieger, Uwe; Wicht, Sebastian; Günther, Daniela; Altmann, Frank


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    <subfield code="a">&lt;p&gt;X-FAB and its partners develop a new micro-assembly technology &amp;ndash; micro-transfer-printing (&amp;mu;TP). It has been applied by X-Celeprint on applications ranging from OLED and micro-LEDs photonics already. The technological principle is based on parallel transfer of an array of devices from a source to a non-native target Substrate applying an elastomeric stamp. The knowledge of typical failure modes is a key element in ensuring stable production and develop strategies to prevent failures in the manufacturing process. X-FAB presents details of typical applications for heterogeneous integration by &amp;mu;TP and gives a brief outlook for failure modes and material characterization. In a second subsequent presentation FhG-IMWS presents related mechanical- and numerical approaches for the &amp;mu;TP process design.&lt;/p&gt;</subfield>
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