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Micro-Transfer-Printing and its Process Characterization by FEA & Micromechanical Testing

Naumann, Falk; Buehler, Kjell; Mittag, Marcel; Lorenz, Georg; Krieger, Uwe; Wicht, Sebastian; Günther, Daniela; Altmann, Frank

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<oai_dc:dc xmlns:dc="" xmlns:oai_dc="" xmlns:xsi="" xsi:schemaLocation="">
  <dc:creator>Naumann, Falk</dc:creator>
  <dc:creator>Buehler, Kjell</dc:creator>
  <dc:creator>Mittag, Marcel</dc:creator>
  <dc:creator>Lorenz, Georg</dc:creator>
  <dc:creator>Krieger, Uwe</dc:creator>
  <dc:creator>Wicht, Sebastian</dc:creator>
  <dc:creator>Günther, Daniela</dc:creator>
  <dc:creator>Altmann, Frank</dc:creator>
  <dc:description>X-FAB and its partners develop a new micro-assembly technology – micro-transfer-printing (μTP). It has been applied by X-Celeprint on applications ranging from OLED and micro-LEDs photonics already. The technological principle is based on parallel transfer of an array of devices from a source to a non-native target Substrate applying an elastomeric stamp. The knowledge of typical failure modes is a key element in ensuring stable production and develop strategies to prevent failures in the manufacturing process. X-FAB presents details of typical applications for heterogeneous integration by μTP and gives a brief outlook for failure modes and material characterization. In a second subsequent presentation FhG-IMWS presents related mechanical- and numerical approaches for the μTP process design.</dc:description>
  <dc:subject>micro-transfer printing</dc:subject>
  <dc:title>Micro-Transfer-Printing and its Process Characterization by FEA &amp; Micromechanical Testing</dc:title>
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