April 10, 2019 Presentation Open Access

Naumann, Falk; Buehler, Kjell; Mittag, Marcel; Lorenz, Georg; Krieger, Uwe; Wicht, Sebastian; Günther, Daniela; Altmann, Frank

JSON-LD (schema.org) Export

{
  "description": "<p>X-FAB and its partners develop a new micro-assembly technology &ndash; micro-transfer-printing (&mu;TP). It has been applied by X-Celeprint on applications ranging from OLED and micro-LEDs photonics already. The technological principle is based on parallel transfer of an array of devices from a source to a non-native target Substrate applying an elastomeric stamp. The knowledge of typical failure modes is a key element in ensuring stable production and develop strategies to prevent failures in the manufacturing process. X-FAB presents details of typical applications for heterogeneous integration by &mu;TP and gives a brief outlook for failure modes and material characterization. In a second subsequent presentation FhG-IMWS presents related mechanical- and numerical approaches for the &mu;TP process design.</p>", 
  "license": "https://creativecommons.org/licenses/by/4.0/legalcode", 
  "creator": [
    {
      "@type": "Person", 
      "name": "Naumann, Falk"
    }, 
    {
      "@type": "Person", 
      "name": "Buehler, Kjell"
    }, 
    {
      "@type": "Person", 
      "name": "Mittag, Marcel"
    }, 
    {
      "@type": "Person", 
      "name": "Lorenz, Georg"
    }, 
    {
      "@type": "Person", 
      "name": "Krieger, Uwe"
    }, 
    {
      "@type": "Person", 
      "name": "Wicht, Sebastian"
    }, 
    {
      "@type": "Person", 
      "name": "G\u00fcnther, Daniela"
    }, 
    {
      "@type": "Person", 
      "name": "Altmann, Frank"
    }
  ], 
  "url": "https://zenodo.org/record/2702429", 
  "datePublished": "2019-04-10", 
  "@type": "PresentationDigitalDocument", 
  "keywords": [
    "micro-transfer printing"
  ], 
  "@context": "https://schema.org/", 
  "identifier": "https://doi.org/10.5281/zenodo.2702429", 
  "@id": "https://doi.org/10.5281/zenodo.2702429", 
  "workFeatured": {
    "url": "http://www.cam-workshop.de/", 
    "alternateName": "CAM 2019", 
    "location": "Halle, Germany", 
    "@type": "Event", 
    "name": "International Conference on Innovation in Failure Analysis and Material Diagnostics of Electronics Components"
  }, 
  "name": "Micro-Transfer-Printing and its Process Characterization by FEA & Micromechanical Testing"
}