April 10, 2019 Presentation Open Access

Naumann, Falk; Buehler, Kjell; Mittag, Marcel; Lorenz, Georg; Krieger, Uwe; Wicht, Sebastian; Günther, Daniela; Altmann, Frank

DataCite XML Export

<?xml version='1.0' encoding='utf-8'?>
<resource xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns="http://datacite.org/schema/kernel-4" xsi:schemaLocation="http://datacite.org/schema/kernel-4 http://schema.datacite.org/meta/kernel-4.1/metadata.xsd">
  <identifier identifierType="DOI">10.5281/zenodo.2702429</identifier>
  <creators>
    <creator>
      <creatorName>Naumann, Falk</creatorName>
      <givenName>Falk</givenName>
      <familyName>Naumann</familyName>
    </creator>
    <creator>
      <creatorName>Buehler, Kjell</creatorName>
      <givenName>Kjell</givenName>
      <familyName>Buehler</familyName>
    </creator>
    <creator>
      <creatorName>Mittag, Marcel</creatorName>
      <givenName>Marcel</givenName>
      <familyName>Mittag</familyName>
    </creator>
    <creator>
      <creatorName>Lorenz, Georg</creatorName>
      <givenName>Georg</givenName>
      <familyName>Lorenz</familyName>
    </creator>
    <creator>
      <creatorName>Krieger, Uwe</creatorName>
      <givenName>Uwe</givenName>
      <familyName>Krieger</familyName>
    </creator>
    <creator>
      <creatorName>Wicht, Sebastian</creatorName>
      <givenName>Sebastian</givenName>
      <familyName>Wicht</familyName>
    </creator>
    <creator>
      <creatorName>Günther, Daniela</creatorName>
      <givenName>Daniela</givenName>
      <familyName>Günther</familyName>
    </creator>
    <creator>
      <creatorName>Altmann, Frank</creatorName>
      <givenName>Frank</givenName>
      <familyName>Altmann</familyName>
    </creator>
  </creators>
  <titles>
    <title>Micro-Transfer-Printing and its Process Characterization by FEA &amp; Micromechanical Testing</title>
  </titles>
  <publisher>Zenodo</publisher>
  <publicationYear>2019</publicationYear>
  <subjects>
    <subject>micro-transfer printing</subject>
  </subjects>
  <dates>
    <date dateType="Issued">2019-04-10</date>
  </dates>
  <resourceType resourceTypeGeneral="Text">Presentation</resourceType>
  <alternateIdentifiers>
    <alternateIdentifier alternateIdentifierType="url">https://zenodo.org/record/2702429</alternateIdentifier>
  </alternateIdentifiers>
  <relatedIdentifiers>
    <relatedIdentifier relatedIdentifierType="DOI" relationType="IsVersionOf">10.5281/zenodo.2702428</relatedIdentifier>
    <relatedIdentifier relatedIdentifierType="URL" relationType="IsPartOf">https://zenodo.org/communities/microprince</relatedIdentifier>
  </relatedIdentifiers>
  <rightsList>
    <rights rightsURI="https://creativecommons.org/licenses/by/4.0/legalcode">Creative Commons Attribution 4.0 International</rights>
    <rights rightsURI="info:eu-repo/semantics/openAccess">Open Access</rights>
  </rightsList>
  <descriptions>
    <description descriptionType="Abstract">&lt;p&gt;X-FAB and its partners develop a new micro-assembly technology &amp;ndash; micro-transfer-printing (&amp;mu;TP). It has been applied by X-Celeprint on applications ranging from OLED and micro-LEDs photonics already. The technological principle is based on parallel transfer of an array of devices from a source to a non-native target Substrate applying an elastomeric stamp. The knowledge of typical failure modes is a key element in ensuring stable production and develop strategies to prevent failures in the manufacturing process. X-FAB presents details of typical applications for heterogeneous integration by &amp;mu;TP and gives a brief outlook for failure modes and material characterization. In a second subsequent presentation FhG-IMWS presents related mechanical- and numerical approaches for the &amp;mu;TP process design.&lt;/p&gt;</description>
  </descriptions>
  <fundingReferences>
    <fundingReference>
      <funderName>European Commission</funderName>
      <funderIdentifier funderIdentifierType="Crossref Funder ID">10.13039/100010661</funderIdentifier>
      <awardNumber awardURI="info:eu-repo/grantAgreement/EC/H2020/737465/">737465</awardNumber>
      <awardTitle>Pilot line for micro-transfer-printing of functional components on wafer level</awardTitle>
    </fundingReference>
  </fundingReferences>
</resource>