April 10, 2019 Presentation Open Access

Naumann, Falk; Buehler, Kjell; Mittag, Marcel; Lorenz, Georg; Krieger, Uwe; Wicht, Sebastian; Günther, Daniela; Altmann, Frank

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{
  "publisher": "Zenodo", 
  "DOI": "10.5281/zenodo.2702429", 
  "title": "Micro-Transfer-Printing and its Process Characterization by FEA & Micromechanical Testing", 
  "issued": {
    "date-parts": [
      [
        2019, 
        4, 
        10
      ]
    ]
  }, 
  "abstract": "<p>X-FAB and its partners develop a new micro-assembly technology &ndash; micro-transfer-printing (&mu;TP). It has been applied by X-Celeprint on applications ranging from OLED and micro-LEDs photonics already. The technological principle is based on parallel transfer of an array of devices from a source to a non-native target Substrate applying an elastomeric stamp. The knowledge of typical failure modes is a key element in ensuring stable production and develop strategies to prevent failures in the manufacturing process. X-FAB presents details of typical applications for heterogeneous integration by &mu;TP and gives a brief outlook for failure modes and material characterization. In a second subsequent presentation FhG-IMWS presents related mechanical- and numerical approaches for the &mu;TP process design.</p>", 
  "author": [
    {
      "family": "Naumann, Falk"
    }, 
    {
      "family": "Buehler, Kjell"
    }, 
    {
      "family": "Mittag, Marcel"
    }, 
    {
      "family": "Lorenz, Georg"
    }, 
    {
      "family": "Krieger, Uwe"
    }, 
    {
      "family": "Wicht, Sebastian"
    }, 
    {
      "family": "G\u00fcnther, Daniela"
    }, 
    {
      "family": "Altmann, Frank"
    }
  ], 
  "id": "2702429", 
  "event-place": "Halle, Germany", 
  "type": "speech", 
  "event": "International Conference on Innovation in Failure Analysis and Material Diagnostics of Electronics Components (CAM 2019)"
}