March 24, 2019 Presentation Open Access

Buehler, Kjell; Lorenz, Georg; Mittag, Marcel; Krieger, Uwe; Heise, Niclas; Wicht, Sebastian; Gerbach, Ronny; Naumann, Falk

DataCite XML Export

<?xml version='1.0' encoding='utf-8'?>
<resource xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns="http://datacite.org/schema/kernel-4" xsi:schemaLocation="http://datacite.org/schema/kernel-4 http://schema.datacite.org/meta/kernel-4.1/metadata.xsd">
  <identifier identifierType="DOI">10.5281/zenodo.2677551</identifier>
  <creators>
    <creator>
      <creatorName>Buehler, Kjell</creatorName>
      <givenName>Kjell</givenName>
      <familyName>Buehler</familyName>
      <affiliation>Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle (Saale)</affiliation>
    </creator>
    <creator>
      <creatorName>Lorenz, Georg</creatorName>
      <givenName>Georg</givenName>
      <familyName>Lorenz</familyName>
      <affiliation>Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle (Saale)</affiliation>
    </creator>
    <creator>
      <creatorName>Mittag, Marcel</creatorName>
      <givenName>Marcel</givenName>
      <familyName>Mittag</familyName>
      <affiliation>X-FAB MEMS Foundry GmbH, Erfurt</affiliation>
    </creator>
    <creator>
      <creatorName>Krieger, Uwe</creatorName>
      <givenName>Uwe</givenName>
      <familyName>Krieger</familyName>
      <affiliation>X-FAB MEMS Foundry GmbH, Erfurt</affiliation>
    </creator>
    <creator>
      <creatorName>Heise, Niclas</creatorName>
      <givenName>Niclas</givenName>
      <familyName>Heise</familyName>
      <affiliation>X-FAB MEMS Foundry GmbH, Erfurt</affiliation>
    </creator>
    <creator>
      <creatorName>Wicht, Sebastian</creatorName>
      <givenName>Sebastian</givenName>
      <familyName>Wicht</familyName>
      <affiliation>X-FAB MEMS Foundry GmbH, Erfurt</affiliation>
    </creator>
    <creator>
      <creatorName>Gerbach, Ronny</creatorName>
      <givenName>Ronny</givenName>
      <familyName>Gerbach</familyName>
      <affiliation>Ronny Gerbach</affiliation>
    </creator>
    <creator>
      <creatorName>Naumann, Falk</creatorName>
      <givenName>Falk</givenName>
      <familyName>Naumann</familyName>
      <affiliation>Fraunhofer Institute for Microstructure of Materials and Systems IMWS, Halle (Saale)</affiliation>
    </creator>
  </creators>
  <titles>
    <title>MICRO-TRANSFER-PRINTING AND POTENTIAL PROCESS OPTIMIZATIONS BY FEA</title>
  </titles>
  <publisher>Zenodo</publisher>
  <publicationYear>2019</publicationYear>
  <subjects>
    <subject>Micro-Transfer-Printing</subject>
    <subject>micro-assembly technology</subject>
  </subjects>
  <dates>
    <date dateType="Issued">2019-03-24</date>
  </dates>
  <resourceType resourceTypeGeneral="Text">Presentation</resourceType>
  <alternateIdentifiers>
    <alternateIdentifier alternateIdentifierType="url">https://zenodo.org/record/2677551</alternateIdentifier>
  </alternateIdentifiers>
  <relatedIdentifiers>
    <relatedIdentifier relatedIdentifierType="DOI" relationType="IsCompiledBy">10.5281/zenodo.2677535</relatedIdentifier>
    <relatedIdentifier relatedIdentifierType="DOI" relationType="IsVersionOf">10.5281/zenodo.2677550</relatedIdentifier>
  </relatedIdentifiers>
  <rightsList>
    <rights rightsURI="https://creativecommons.org/licenses/by/4.0/legalcode">Creative Commons Attribution 4.0 International</rights>
    <rights rightsURI="info:eu-repo/semantics/openAccess">Open Access</rights>
  </rightsList>
  <descriptions>
    <description descriptionType="Abstract">&lt;p&gt;Micro-Transfer-Printing (&amp;mu;TP) as an alternative micro-assembly technology opens up new possibilities in the integration and packaging of smart devices like processed III/V devices, optical filters and special sensors on CMOS and MEMS on wafer-level. The technology uses an elastomer stamp to manipulate multiple printable components at the same time that are difficult to handle because of their size or fragility. Nevertheless, the industrial application of this technology as well as the transfer and upscaling from laboratory scale is still challenging. In order to realize a reliable printing process with sufficient yield, the interaction of the components to be printed, their fixation by tether structures to the source wafer and the adhesion of the transfer stamp must be well adapted. Therefore, the presented work will deal with results of mechanical experiments and FEA-modelling in order to get a deeper understanding of the &amp;mu;TP-process and will allow a defined tether layout and optimization of the processed source wafers.&lt;/p&gt;</description>
  </descriptions>
  <fundingReferences>
    <fundingReference>
      <funderName>European Commission</funderName>
      <funderIdentifier funderIdentifierType="Crossref Funder ID">10.13039/100010661</funderIdentifier>
      <awardNumber awardURI="info:eu-repo/grantAgreement/EC/H2020/737465/">737465</awardNumber>
      <awardTitle>Pilot line for micro-transfer-printing of functional components on wafer level</awardTitle>
    </fundingReference>
  </fundingReferences>
</resource>