Presentation Open Access

MICRO-TRANSFER-PRINTING AND POTENTIAL PROCESS OPTIMIZATIONS BY FEA

Buehler, Kjell; Lorenz, Georg; Mittag, Marcel; Krieger, Uwe; Heise, Niclas; Wicht, Sebastian; Gerbach, Ronny; Naumann, Falk

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    <dct:title>MICRO-TRANSFER-PRINTING AND POTENTIAL PROCESS OPTIMIZATIONS BY FEA</dct:title>
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    <dct:description>&lt;p&gt;Micro-Transfer-Printing (&amp;mu;TP) as an alternative micro-assembly technology opens up new possibilities in the integration and packaging of smart devices like processed III/V devices, optical filters and special sensors on CMOS and MEMS on wafer-level. The technology uses an elastomer stamp to manipulate multiple printable components at the same time that are difficult to handle because of their size or fragility. Nevertheless, the industrial application of this technology as well as the transfer and upscaling from laboratory scale is still challenging. In order to realize a reliable printing process with sufficient yield, the interaction of the components to be printed, their fixation by tether structures to the source wafer and the adhesion of the transfer stamp must be well adapted. Therefore, the presented work will deal with results of mechanical experiments and FEA-modelling in order to get a deeper understanding of the &amp;mu;TP-process and will allow a defined tether layout and optimization of the processed source wafers.&lt;/p&gt;</dct:description>
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Publication date:
March 24, 2019
DOI:
10.5281/zenodo.2677551

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Keyword(s):
Micro-Transfer-Printing micro-assembly technology
Grants:
European Commission:
  • MICROPRINCE - Pilot line for micro-transfer-printing of functional components on wafer level (737465)
Meeting:
International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2019), Hannover, Germany, 24-27 March 2019
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License (for files):
Creative Commons Attribution 4.0 International

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