Presentation Open Access

MICROPRINCE—Open Access Foundry Pilot Line for Elastomer Assisted Micro-Assembly

Gerbach, Ronny; Ghosal, Kanchan; Krieger, Uwe; Kittler, Gabriel; Bower, Christopher; Knechtel, Roy


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<?xml version='1.0' encoding='utf-8'?>
<resource xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns="http://datacite.org/schema/kernel-4" xsi:schemaLocation="http://datacite.org/schema/kernel-4 http://schema.datacite.org/meta/kernel-4.1/metadata.xsd">
  <identifier identifierType="DOI">10.5281/zenodo.2651911</identifier>
  <creators>
    <creator>
      <creatorName>Gerbach, Ronny</creatorName>
      <givenName>Ronny</givenName>
      <familyName>Gerbach</familyName>
      <affiliation>X-FAB MEMS Foundry GmbH, Erfurt Germany</affiliation>
    </creator>
    <creator>
      <creatorName>Ghosal, Kanchan</creatorName>
      <givenName>Kanchan</givenName>
      <familyName>Ghosal</familyName>
      <affiliation>X-Celeprint Inc., Durham, North Carolina, United States</affiliation>
    </creator>
    <creator>
      <creatorName>Krieger, Uwe</creatorName>
      <givenName>Uwe</givenName>
      <familyName>Krieger</familyName>
      <affiliation>X-FAB Semiconductor Foundries AG, Erfurt Germany</affiliation>
    </creator>
    <creator>
      <creatorName>Kittler, Gabriel</creatorName>
      <givenName>Gabriel</givenName>
      <familyName>Kittler</familyName>
      <affiliation>X-FAB Semiconductor Foundries AG, Erfurt Germany</affiliation>
    </creator>
    <creator>
      <creatorName>Bower, Christopher</creatorName>
      <givenName>Christopher</givenName>
      <familyName>Bower</familyName>
      <affiliation>X-Celeprint Inc., Durham, North Carolina, United States</affiliation>
    </creator>
    <creator>
      <creatorName>Knechtel, Roy</creatorName>
      <givenName>Roy</givenName>
      <familyName>Knechtel</familyName>
      <affiliation>X-FAB MEMS Foundry GmbH, Erfurt Germany</affiliation>
    </creator>
  </creators>
  <titles>
    <title>MICROPRINCE—Open Access Foundry Pilot Line for Elastomer Assisted Micro-Assembly</title>
  </titles>
  <publisher>Zenodo</publisher>
  <publicationYear>2017</publicationYear>
  <subjects>
    <subject>micro-Transfer-Printing</subject>
  </subjects>
  <dates>
    <date dateType="Issued">2017-11-29</date>
  </dates>
  <resourceType resourceTypeGeneral="Text">Presentation</resourceType>
  <alternateIdentifiers>
    <alternateIdentifier alternateIdentifierType="url">https://zenodo.org/record/2651911</alternateIdentifier>
  </alternateIdentifiers>
  <relatedIdentifiers>
    <relatedIdentifier relatedIdentifierType="DOI" relationType="IsVersionOf">10.5281/zenodo.2651910</relatedIdentifier>
    <relatedIdentifier relatedIdentifierType="URL" relationType="IsPartOf">https://zenodo.org/communities/microprince</relatedIdentifier>
  </relatedIdentifiers>
  <rightsList>
    <rights rightsURI="https://creativecommons.org/licenses/by/4.0/legalcode">Creative Commons Attribution 4.0 International</rights>
    <rights rightsURI="info:eu-repo/semantics/openAccess">Open Access</rights>
  </rightsList>
  <descriptions>
    <description descriptionType="Abstract">&lt;p&gt;Elastomer assisted Micro-Transfer-Printing (&amp;mu;TP) is a demonstrated and versatile micro-assembly technology that has been developed in a laboratory and an industrial environment for over ten years. &amp;mu;TP involves the release, transfer and printing of an array of devices from their growth substrate to a different non-native substrate in a massively parallel manner (i.e. thousands of devices per transfer) with a positioning tolerance less than 1.5 &amp;micro;m, using an elastomeric stamp as the transfer element. X-Celeprint has demonstrated this technology in a wide range of diverse applications spanning from OLED and micro-LED displays to concentrated photovoltaics, sensors, storage and photonics [1, 2]. This technology provides an excellent solution to challenges involving the heterogeneous integration of III-V devices with silicon and other application specific substrates such as engineered substrates, flexible substrates, CMOS wafers and glass substrates. Despite the transformational potential of &amp;mu;TP, no commercial facility is available to scale up the technology to an industrial production level in a microelectronics foundry environment.&lt;br&gt;
This paper will describe a European project, MICROPRINCE, that has the goal of setting up the worldwide first open access foundry pilot line for heterogeneous integration by &amp;mu;TP and demonstrate its capability on five defined target applications. The project includes 13 European partners and will be led by X-FAB MEMS Foundry GmbH, who will set up the pilot line in its cleanroom facilities. The installed pilot and the developed processes will lead to the unique opportunity to transfer R&amp;amp;D results to commercial exploitation. Companies planning to use the technology will now be able to use a foundry to have their products fabricated. This key element is expected to spur rapid adaption of the technology. The successful implementation is expected to lead to a substantial and sustainable growth of micro-assembly related businesses&lt;/p&gt;</description>
  </descriptions>
  <fundingReferences>
    <fundingReference>
      <funderName>European Commission</funderName>
      <funderIdentifier funderIdentifierType="Crossref Funder ID">10.13039/501100000780</funderIdentifier>
      <awardNumber awardURI="info:eu-repo/grantAgreement/EC/H2020/737465/">737465</awardNumber>
      <awardTitle>Pilot line for micro-transfer-printing of functional components on wafer level</awardTitle>
    </fundingReference>
  </fundingReferences>
</resource>
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