Journal article Open Access

MEMS MANUFACTURING AND RELIABILITY

Băjenescu, Titu-Marius I.

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Publication date:
March 15, 2019
DOI:
10.5281/zenodo.2640042

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10.5281/zenodo.2640042

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Keyword(s):
Process errors MEMS optical MEMS failure analysis MEMS switches package cracking failure mechanisms reliability creep lifetime prediction
Published in:
Journal of Engineering Science: XXVI (1) pp. 65-82.
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License (for files):
Creative Commons Attribution 4.0 International

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