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SUMCASTEC_180122_NA_2017EPTCPaper_Conference Paper_.pdf_Franfurt Oder_M. Inac_Partners and public_Last draft

Mesut Inaç


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{
  "description": "<p>Abstract for the 2017 19th IEEE Electronics Packaging Technology Conference (EPTC), 6-9 December 2017, Singapore.</p>", 
  "license": "http://creativecommons.org/licenses/by/4.0/legalcode", 
  "creator": [
    {
      "affiliation": "I", 
      "@type": "Person", 
      "name": "Mesut Ina\u00e7"
    }
  ], 
  "url": "https://zenodo.org/record/1157101", 
  "image": "https://zenodo.org/static/img/logos/zenodo-gradient-round.svg", 
  "datePublished": "2018-01-22", 
  "headline": "SUMCASTEC_180122_NA_2017EPTCPaper_Conference Paper_.pdf_Franfurt Oder_M. Inac_Partners and public_Last draft", 
  "version": "last author", 
  "@context": "https://schema.org/", 
  "identifier": "https://doi.org/10.5281/zenodo.1157101", 
  "@id": "https://doi.org/10.5281/zenodo.1157101", 
  "@type": "ScholarlyArticle", 
  "name": "SUMCASTEC_180122_NA_2017EPTCPaper_Conference Paper_.pdf_Franfurt Oder_M. Inac_Partners and public_Last draft"
}
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