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SUMCASTEC_180117_NA_ECTC17Paper_Conference paper_.pdf_Frankfurt Oder_M. Inac_Partners and public_Last draft

Mesut Inaç


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{
  "description": "<p>2017 IEEE 67th Electronic Components and Technology Conference (ECTC) paper&nbsp;entitled &quot;BiCMOS Integrated Microfluidic Packaging by&nbsp;Wafer Bonding for Lab-on-Chip Applications &quot;.&nbsp;</p>", 
  "license": "http://creativecommons.org/licenses/by/4.0/legalcode", 
  "creator": [
    {
      "affiliation": "IHP Microelectronics", 
      "@type": "Person", 
      "name": "Mesut Ina\u00e7"
    }
  ], 
  "url": "https://zenodo.org/record/1154183", 
  "image": "https://zenodo.org/static/img/logos/zenodo-gradient-round.svg", 
  "datePublished": "2018-01-17", 
  "headline": "SUMCASTEC_180117_NA_ECTC17Paper_Conference paper_.pdf_Frankfurt Oder_M. Inac_Partners and public_Last draft", 
  "version": "last author's draft", 
  "@context": "https://schema.org/", 
  "identifier": "https://doi.org/10.1109/ECTC.2017.153", 
  "@id": "https://doi.org/10.1109/ECTC.2017.153", 
  "@type": "ScholarlyArticle", 
  "name": "SUMCASTEC_180117_NA_ECTC17Paper_Conference paper_.pdf_Frankfurt Oder_M. Inac_Partners and public_Last draft"
}
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