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SUMCASTEC_180117_NA_ECTC17Paper_Conference paper_.pdf_Frankfurt Oder_M. Inac_Partners and public_Last draft

Mesut Inaç


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{
  "DOI": "10.1109/ECTC.2017.153", 
  "title": "SUMCASTEC_180117_NA_ECTC17Paper_Conference paper_.pdf_Frankfurt Oder_M. Inac_Partners and public_Last draft", 
  "issued": {
    "date-parts": [
      [
        2018, 
        1, 
        17
      ]
    ]
  }, 
  "abstract": "<p>2017 IEEE 67th Electronic Components and Technology Conference (ECTC) paper&nbsp;entitled &quot;BiCMOS Integrated Microfluidic Packaging by&nbsp;Wafer Bonding for Lab-on-Chip Applications &quot;.&nbsp;</p>", 
  "author": [
    {
      "family": "Mesut Ina\u00e7"
    }
  ], 
  "version": "last author's draft", 
  "type": "paper-conference", 
  "id": "1154183"
}
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