Conference paper Open Access
Hassona, Ahmed; Vassilev, Vessen; He, Zhongxia Simon; Mariotti, Chiara; Dielacher, Franz; Zirath, Herbert
This paper presents a novel interconnect for coupling Millimeter-wave (mmW) signals from integrated circuits to air-filled waveguides. The proposed solution is realized through a slot antenna implemetend in embedded Wafer Level Ball Grid Array (eWLB) process. The antenna radiates into a high-resistivity (HR) silicon taper perpendicular to its plane, which in turn radiates into an air-filled waveguide. The interconnect achieves a measured average insertion loss of 3.4 dB over the frequency range 166-151 GHz. The proposed interconnect is generic and does not require any galvanic contacts. The utilized eWLB packaging process is suitable for low-cost high-volume productionand allows heterogeneous integration with other technologies. This work proposes a straightforward cost-effective high-performance interconnect for mmW integration and thus addressing one of the main challenges facing systems operating beyond 100 GHz.