Journal article Open Access

Wetting Behavior of Reactive and Non–Reactive Wetting of Liquids on Metallic Substrates

Pradeep Bhagawath; K.N. Prabhu; Satyanarayan

Wetting characteristics of reactive (Sn–0.7Cu solder) and non– reactive (castor oil) wetting of liquids on Cu and Ag plated Al substrates have been investigated. Solder spreading exhibited capillary, gravity and viscous regimes. Oils did not exhibit noticeable spreading regimes. Solder alloy showed better wettability on Ag coated Al substrate compared to Cu plating. In the case of castor oil, Cu coated Al substrate exhibited good wettability as compared to Ag coated Al substrates. The difference in wettability during reactive wetting of solder and non–reactive wetting of oils is attributed to the change in the surface energies of Al substrates brought about by the formation of intermetallic compounds (IMCs).

Files (474.3 kB)
Name Size
474.3 kB Download
  • D.Y. Kwok and A.W. Neumann, "Contact angle measurement and contact", Adv. Colloid Interface Sci. 81 (1999), pp.167-249.
  • Girish Kumar and K. N. Prabhu, "Review of non-reactive and reactive wetting of liquids on surfaces", Adv. Colloid Interface Sci. (2007), pp. 61-89
  • Girish Kumar and K. N. Prabhu, "Wetting Behavior of Solders", J. ASTM Int. 7(5) (2010) Paper ID JAI103055.
  • M. S. Park and R. Arroyave, "Formation and Growth of Intermetallic Compound Cu6Sn5 at Early Stages in Lead-Free Soldering", J. Electron. Mater. (2010) DOI: 10.1007/s11664-010-1353-7
  • O. Dezellus and N. Eustathopoulos, "Fundamental issues of reactive wetting by liquid metals", J Mater Sci. 45 (2010), pp.4256-4264.
  • R. N. Wenzel, "Resistance of solid surfaces to wetting by water", Ind. Eng. Chem.: 28 (8) (1936), pp.988-994..
  • Satyanarayan and K. Narayan Prabhu, "Effect of temperature and substrate surface texture on wettability and morphology of IMCs between Sn-0.7Cu solder alloy and copper substrate", J Mater Sci: Mater Electron. 23(2012),pp.1664-1672
  • T. Matsumoto and K. Nogi, "Wetting in Soldering and Microelectronics", Annu. Rev. Mater. Res. 38 (2008), pp.251-273.
All versions This version
Views 22
Downloads 11
Data volume 474.3 kB474.3 kB
Unique views 22
Unique downloads 11


Cite as