Wetting Behavior of Reactive and Non–Reactive Wetting of Liquids on Metallic Substrates
Wetting characteristics of reactive (Sn–0.7Cu solder)
and non– reactive (castor oil) wetting of liquids on Cu and Ag plated
Al substrates have been investigated. Solder spreading exhibited
capillary, gravity and viscous regimes. Oils did not exhibit noticeable
spreading regimes. Solder alloy showed better wettability on Ag
coated Al substrate compared to Cu plating. In the case of castor oil,
Cu coated Al substrate exhibited good wettability as compared to Ag
coated Al substrates. The difference in wettability during reactive
wetting of solder and non–reactive wetting of oils is attributed to the
change in the surface energies of Al substrates brought about by the
formation of intermetallic compounds (IMCs).
D.Y. Kwok and A.W. Neumann, "Contact angle measurement and
contact", Adv. Colloid Interface Sci. 81 (1999), pp.167-249.
Girish Kumar and K. N. Prabhu, "Review of non-reactive and reactive
wetting of liquids on surfaces", Adv. Colloid Interface Sci. (2007), pp.
Girish Kumar and K. N. Prabhu, "Wetting Behavior of Solders", J.
ASTM Int. 7(5) (2010) Paper ID JAI103055.
M. S. Park and R. Arroyave, "Formation and Growth of Intermetallic
Compound Cu6Sn5 at Early Stages in Lead-Free Soldering", J. Electron.
Mater. (2010) DOI: 10.1007/s11664-010-1353-7
O. Dezellus and N. Eustathopoulos, "Fundamental issues of reactive
wetting by liquid metals", J Mater Sci. 45 (2010), pp.4256-4264.
R. N. Wenzel, "Resistance of solid surfaces to wetting by water", Ind.
Eng. Chem.: 28 (8) (1936), pp.988-994..
Satyanarayan and K. Narayan Prabhu, "Effect of temperature and
substrate surface texture on wettability and morphology of IMCs
between Sn-0.7Cu solder alloy and copper substrate", J Mater Sci:
Mater Electron. 23(2012),pp.1664-1672
T. Matsumoto and K. Nogi, "Wetting in Soldering and
Microelectronics", Annu. Rev. Mater. Res. 38 (2008), pp.251-273.