May 16, 2017 Conference paper Open Access

Dempwolf, Sophia; Hofmann, Lutz; Bowers, Christopher; Guenther, Daniela; Knechtel, Roy; Schulz, Stefan E.; Gerbach, Ronny

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  <dc:creator>Dempwolf, Sophia</dc:creator>
  <dc:creator>Hofmann, Lutz</dc:creator>
  <dc:creator>Bowers, Christopher</dc:creator>
  <dc:creator>Guenther, Daniela</dc:creator>
  <dc:creator>Knechtel, Roy</dc:creator>
  <dc:creator>Schulz, Stefan E.</dc:creator>
  <dc:creator>Gerbach, Ronny</dc:creator>
  <dc:date>2017-05-16</dc:date>
  <dc:description>This paper describes approaches for 3D integration of CMOS and MEMS sensors. It implies methods for wafer level packaging, Through-Silicon-Vias (TSV) and novel methods for heterogeneous system integration like micro-transfer printing. These technologies are described on sensor devices.</dc:description>
  <dc:identifier>https://zenodo.org/record/1043259</dc:identifier>
  <dc:identifier>10.5281/zenodo.1043259</dc:identifier>
  <dc:identifier>oai:zenodo.org:1043259</dc:identifier>
  <dc:relation>info:eu-repo/grantAgreement/EC/H2020/737465/</dc:relation>
  <dc:relation>doi:10.5281/zenodo.1043258</dc:relation>
  <dc:relation>url:https://zenodo.org/communities/microprince</dc:relation>
  <dc:rights>info:eu-repo/semantics/openAccess</dc:rights>
  <dc:rights>https://creativecommons.org/licenses/by-nc/4.0/legalcode</dc:rights>
  <dc:title>Approaches for wafer level packaging and heterogeneous system integration for CMOS and MEMS sensors</dc:title>
  <dc:type>info:eu-repo/semantics/conferencePaper</dc:type>
  <dc:type>publication-conferencepaper</dc:type>
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